High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends

DUBLIN, April 11, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/f4vpw3/highdensity) has announced the addition of the "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" report to their offering.
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High-density packaging offer a host of benefits including performance improvements such as shorter interconnect lengths between die, resulting in reduced time of flight, lower power supply inductance, lower capacitance loading, less cross talk and lower off-chip driver power.

This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are.

The worldwide markets are analyzed and projected

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary
2.1 Summary of Technology Issues
2.2 Summary of Market Forecasts

Chapter 3 Technology Issues and Trends
3.1 Overview of HDP Technology
3.1.1 Need for Multiple IC Integration
3.1.2 Challenges of Multiple IC Integration
3.2 Technical Constraints of Integration
3.3 Economic Benefits of HDP
3.4 Technology Issues
3.4.1 Substrates
3.4.2 Conductors
3.4.3 Dielectrics
3.4.4 Vias
3.4.5 Die Attachment
3.4.6 Next Level Interconnection
3.4.7 Thermal Management
3.4.8 Test and Inspection
3.4.9 Design
3.5 3-D Modules
3.6 Superconducting Interconnects
3.7 Known Good Die
3.8 System In Package (SIP)
3.9 Multichip Package
3.10 Package-On-Package (PoP)

Chapter 4 Applications
4.1 Overview of HDP Applications
4.2 Military and Aerospace
4.3 Computer and Peripheral Equipment
4.4 Communications
4.5 Consumer
4.6 Industrial

Chapter 5 Competitive Environment
5.1 Overview of the HDP Competitive Environment
5.2 Joint Ventures and Cooperative Agreements
5.3 HDP Manufacturers

Chapter 6 3-D-TSV Technology
6.1 Driving Forces In 3D-TSV
6.2 3-D Package Varieties
6.3 TSV Processes
6.4 Critical Processing Technologies
6.4.1 Plasma Etch Technology
6.4.2 Cu Plating
6.4.3 Thin Wafer Bondling
6.4.4 Wafer Thinning/CMP
6.4.5 Lithography
6.5 Applications
6.6 Limitations Of 3-DPackaging Technology
6.6.1 Thermal Management
6.6.2 Cost
6.6.3 Design Complexity
6.6.4 Time To Delivery
6.7 Company Profiles

Chapter 7 Market Forecast
7.1 Overview of Multichip Modules
7.2 Driving Forces
7.3 Alternative Packaging Technologies
7.4 Worldwide IC Market Forecast
7.5 Worldwide Packaging Market Forecast
7.6 Worldwide MCM Market Forecast
7.6.1 Worldwide Forecast By Substrate Type
7.6.2 Worldwide 3-D Through Silicon Via (TSV) Market
7.6.2 Market Forecast By Application
7.6.3 Market Forecast By End Use
7.7 Wafer Level Packaging


Companies Mentioned:

• ALLVIA
• AMD
• AMITEC
• AT&T
• Advanced Packaging Systems
• Aeroflex Laboratories
• Amkor
• Amkor Electronics
• Analog Devices
• Appian Technology
• BeSang
• C-MAC MicroTechnology
• CNM-IMB
• CTM Electronics
• CTS
• Ceramic Packaging
• Chartered Semiconductor
• ChipSiP
• Conexant
• Control Data
• Cubic Wafer
• David Sarnoff Research Center
• Delco Electronics
• Digital Equipment
• ERIM
• Elpaq
• Elpida
• Elpida Memory
• Eureka
• Freescale
• Fujikura
• Fujitsu
• GEC Plessey
• General Electric
• Hadco
• Honeywell
• Hughes
• Hynx
• IBM
• ILC Data Device Corp.
• IMEC
• Ibiden
• Infineon
• Integrated System Assemblies
• Intel
• Interconnect Systems
• Interconnex
• International Micro Industries
• Intersil
• Jazz Semiconductor
• Kodak
• Kyocera
• Lexmark International
• Lucent Technologies
• MicroModule Systems
• Micron
• Micron Technology
• Mitsubishi
• Motorola
• NEC
• NXP
• NXP Semiconductors
• Oki Electric
• PMC-Sierra
• Pacific Microelectronics
• Packard-Hughes Interconnect
• Panda Project
• Phillips Laboratory
• Pico Systems
• Quadrant Technology
• RISH ASE
• Renasas
• Rockwell Avionics
• Rogers
• S-MOS Systems
• S3
• STATS ChipPAC
• STMicroelectronics
• Samsung
• Samsung Electronics
• Sensonix
• Sharp
• Sharp
• Sheldahl
• Shinko
• Silex Microsystems
• Skyworks Solutions
• Spansion
• Spectra
• TRW
• TSMC
• Tektronix
• Teledyne Electronic Technologies
• Tessera
• Texas Instruments
• Tezzaron
• Thomson Consumer Electronics
• Toshiba
• UTAC
• United Technologies
• W.L. Gore & Associates
• White Electronic Designs
• Z Systems
• Ziptronix
• ZyCube
• nCHIP

For more information visit http://www.researchandmarkets.com/research/f4vpw3/highdensity

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

SOURCE Research and Markets