IMRA Agrees with DISCO to Jointly Develop Laser Dicing
KARIYA, Japan, March 21, 2012 /PRNewswire/ -- IMRA America, Inc., a subsidiary of Aisin Seiki Co., Ltd., and DISCO Corporation have agreed to collaborate in the development of new lasers and processing systems for laser dicing of semiconductor materials.
IMRA America has supplied several hundred femtosecond fiber lasers* that are now being used in semiconductor manufacturing facilities, delivering the high reliability and stability required for 24/7 operation. Also, IMRA America is the exclusive licensee of US Patent 5,656,186 by the University of Michigan, essential for femtosecond and picosecond laser materials processing, which they license to their customers.
In the future, both companies will together provide new solutions utilizing the unique capabilities of femtosecond lasers, which minimize thermal effects in materials processing.
* Femtosecond Fiber Lasers
These lasers emit pulses of light with a temporal duration on the order of femtoseconds (1 femtosecond is 1 quadrillionth of a second) at a high repetition frequency. A major advantage of femtosecond pulses is that the pulse duration is so short it is possible to minimize thermal damage. Femtosecond laser pulses can also create modifications within transparent materials without damaging the surface.
About IMRA America, Inc.
| Office: |
1044 Woodridge Avenue, Ann Arbor, MI 48105-9774 USA |
| President: |
Takashi Omitsu |
| Capital: |
US$18,750,000 |
| Founded: |
May 15, 1990 |
| Major Corporations: |
Aisin Seiki Co., Ltd. |
| Business outline: |
Development, manufacturing, marketing, sales, after-sales service of femtosecond fiber lasers |
URL: http://www.imra.com
About DISCO Corporation
Listed on First Section of Tokyo Stock Exchange
| Office: |
13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 Japan |
| President: |
Kazuma Sekiya |
| Capital: |
14,517,469,520 yen |
| Founded: |
March 2, 1940 |
Business outline:
- Manufacture and sale of precision cutting, grinding and polishing machines
- Maintenance of precision cutting, grinding and polishing machines
- Training in the operation and maintenance of precision cutting, grinding and polishing machines
- Disassembly and recycling of precision cutting, grinding and polishing machines
- Lease of precision machines; sale and purchase of used machines
- Manufacture and sale of precision diamond abrasive tools
- For-fee processing
URL: http://www.disco.co.jp/eg/index.html
Contact:
Ryuichiro Sasaki
Japan Branch Office
IMRA America, Inc.
Tel: +81-566-24-9024
Fax: +81-566-62-1607
E-mail: [email protected]
SOURCE IMRA America, Inc.
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