Innovations in Encapsulation Technologies for Printed Electronics (Technical Insights)

NEW YORK, Dec. 11, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Innovations in Encapsulation Technologies for Printed Electronics (Technical Insights)
http://www.reportlinker.com/p01923004/Innovations-in-Encapsulation-Technologies-for-Printed-Electronics-Technical-Insights.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electrical_Equipment

9 Dimensional Analysis--Preventing Degradation of Organic Electronics with Reliable Encapsulation

Printed electronics has resulted in cheaper manufacturing of electronic devices. Moreover by using plastic substrates, flexible electronics can also be printed. With printed electronics, devices such as Organic Light Emitting Diodes(OLEDs) and Organic Photo Voltaic(OPV) has potential to change display, lighting and energy harvesting applications landscape. But the active components in these devices react with moisture and oxygen, resulting in degradation of quality. To enable long lifetime of such printed electronics devices proper encapsulation is required. This research service analyses technology trends and market opportunities of different encapsulation technologies for printed electronic devices from nine dimensions governing adoption.

Nine Dimensional Analysis of Technology Assessment

• Year of impact
• Market Potential
• Global Footprint
• IP Activity
• Funding
• Breadth of Industries
• Impact on Megatrend
• Potential Points of Convergence
• Size of Innovation Ecosystem

Research Scope

Printed electronics has resulted in cheaper manufacturing of electronic devices. Moreover by using plastic substrates, flexible electronics can also be printed. With printed electronics, devices such as organic light emitting diodes (OLEDs) and organic photo voltaic (OPV) have the potential to change the display, lighting, and energy harvesting applications landscape. But the active components in these devices react with moisture and oxygen, resulting in degradation of quality. To enable long lifetime of such printed electronics devices proper encapsulation is required.

This research service covers technology trends in encapsulation technologies for printed electronics devices. The research service offers insights primarily on the nine dimensions listed below.
• Year of impact
• Market Potential
• Global Footprint
• IP Activity
• Funding
• Breadth of Industries
• Impact on Megatrend
• Potential Points of Convergence
• Size of Innovation Ecosystem

Key Findings

• Year of impact
Large Scale Uptake from 2015 Onwards: Flexible OLEDs and OPVs would impact various markets from 2015 onwards. Apart from polymer encapsulation, flexible glass is a viable alternative, which is expected to provide better results.

• Market Potential
High Potential: The need for encapsulation for enabling flexible printed electronics will be the key driving factor for increasing the market potential of reliable encapsulation technologies.

• Global Footprint
Technology Development High in APAC: Major technological development is observed in the APAC region, which caters to global market. Key device manufacturers are located in APAC, where flexible OLED displays are already set to be introduced in the market.

• IP Activity
Major Assignees Located in APAC Region: The majority of the top assignees are located in the APAC region. This compliments the trend of major developers situated in this region.

• Funding
Not Attractive for Encapsulation: There is limited funding directed toward novel encapsulation technologies. Increase in funding can lead to faster development of technology.

• Breadth of Industries
Multiple Industries Benefitted: Encapsulation technologies for printed electronics are going to be beneficial for multiple industries within the value chain as well as end-user applications. It is a key technology, which greatly enables successful commercialization of diverse flexible organic devices.

• Impact on Megatrend
Positive Impact for Future Infrastructure Development: Encapsulation will enable products that have high impact on megatrends such as 'Future Infrastructure Development' and 'Health, wellness, and Wellbeing.'

• Potential Points of Convergence
Opportunities in Advanced manufacturing: Encapsulation technologies has the potential to converge with manufacturing processes as well as innovative material technology to provide reliable barrier films. Printed Electronics holds high potential to converge with various technologies in sensors and microelectronics resulting in newer products.

• • Size of Innovation Ecosystem
Companies Driving Innovation: Major developments are occurring in-house, but there are certain research institutes focusing on high WVTR (water vapor transmission rate) barrier films. Companies have the major influence in R&D, and commercialization of reliable encapsulation technologies.

Technology Snapshot

Encapsulation For Printed Electronics:
• Potential for Printed Electronics: Printed electronics enable low cost large area manufacturing of electronics on a variety of substrates. With market revenues of about $Xbillion in 2011 and an estimated CAGR (compounded annual growth rate) of X% (2011-2016) (according to Frost & Sullivan Analysis), it is a rapidly growing market.
• Key Applications: Printed electronics has the potential to influence almost all applications in the electronics sector. But major application areas currently include display and lighting, energy, memory, sensor, and radio frequency identification.
• Role of Encapsulation: Encapsulation is required for protecting the active elements on the electronic device from degradation on exposure to moisture and oxygen. The degree of reaction with these agents vary from product to product and in some cases (for example, OLED displays) it has high negative impact on the performance.

Table of Contents

Executive Summary 3
Technology Overview 9
Year of Impact 19
Market Potential 22
Global Footprint 25
IP Activity—Patent Landscape 28
Funding 31
Breadth of Industries 34
Impact on Megatrend 37
Potential points of Convergence 39
Size of the Innovation Ecosystem 42
Key Patents and Contacts 53
The Frost & Sullivan Story 60

To order this report: Innovations in Encapsulation Technologies for Printed Electronics (Technical Insights)
http://www.reportlinker.com/p01923004/Innovations-in-Encapsulation-Technologies-for-Printed-Electronics-Technical-Insights.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electrical_Equipment



__________________________
Contact Clare: [email protected]
US: (339)-368-6001
Intl: +1 339-368-6001

SOURCE Reportlinker