CAMARILLO, Calif., April 23, 2014 /PRNewswire/ -- Interlink Electronics, Inc. (OTC: LINK), a sensor technology company, today announced that its Board of Directors has approved a four (4) share for one (1) share forward stock split (the "Forward Stock Split") of Interlink Electronics' common stock, par value $.001 per share (the "Common Stock"). The record date for the Forward Stock Split is May 15, 2014. Steven N. Bronson, the Chairman and Chief Executive Officer of Interlink Electronics, is the owner of 426,382 shares of Common Stock, which represents a majority of the 731,142 shares of the issued and outstanding shares of Common Stock, has indicated that he will approve the Forward Stock Split. Accordingly, Interlink Electronics will not hold a meeting of its stockholders to consider or to vote upon the Forward Stock Split. It is expected that the Forward Stock Split will be implemented on May 19, 2014. The purpose of the Forward Stock Split is to increase the liquidity of the Common Stock and to enhance Interlink Electronics' ability to list its shares of Common Stock on a national exchange.
About Interlink Electronics, Inc.
Interlink Electronics is a world-leading trusted advisor and technology partner in the advancing world of human-machine interface and sensor technologies. Interlink Electronics has led the printed electronics industry in its commercialization of its patented Force-Sensing Resistor (FSR®) technology, which has enabled rugged and reliable human-machine interface ("HMI") solutions. For over 29 years, Interlink Electronics' solutions have focused on handheld user input, menu navigation, cursor control, and other intuitive interface technologies for the world's top electronics manufacturers. Interlink Electronics has a proven track record of supplying human-machine interface solutions for mission-critical applications in a wide range of markets, including, but not limited to, consumer electronics, automotive, industrial, and medical devices. Interlink Electronics serves a world-class customer-base from its corporate headquarters in Camarillo, California (greater Los Angeles area), printed-electronics factory in China, global distribution and warehouse facility in Hong Kong, and offices in Singapore, the United Kingdom, and Japan. For more information, please see http://www.interlinkelectronics.com.
FORWARD LOOKING STATEMENTS: This release contains "forward-looking statements" involving a number of risks and uncertainties as defined in the Private Securities Litigation Reform Act of 1995. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink Electronics, historical weaknesses in internal controls over financial reporting, continued availability of raw materials for our products at competitive prices, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.
SOURCE Interlink Electronics, Inc.