SAN JOSE, Calif., July 25, 2016 /PRNewswire/ -- Intermolecular, Inc. (NASDAQ: IMI), the trusted partner in materials innovation, today announced it will present at ALD 2016 on Wednesday, July 27, 2016, in Dublin, Ireland. Nobi Fuchigami, Member of Technical Staff at Intermolecular, will review atomic layer deposition (ALD) processes for thin (<5nm) nickel and nickel nitride films using amidinate precursors for high work function electrode layers. The experiments were performed using Intermolecular's high-throughput experimentation platform and state-of-the art ALD site-isolated and quad combi ALD reactor technology.
In addition, Karl Littau, Ph.D, Senior Principal Scientist at Intermolecular, will present two posters showcasing the following:
Intermolecular's ALD technology demonstrating non-contact, site addressable ALD reactions across a 300mm wafer in an ALD chamber integrated on a cluster tool.
The comparison between RASIRC BRUTE™ hydrogen peroxide (H2O2) and ozone (O3) as the oxidant for zirconium oxide (ZrOx) utilizing Intermolecular Combinatorial ALD hardware.
About Intermolecular, Inc.
Intermolecular® is the trusted partner for advanced materials innovation. Advanced materials are at the core of innovation in the 21st century for a wide range of industries including semiconductors, consumer electronics, automotive and aerospace. With its substantial materials expertise; accelerated learning and experimentation platform; and information and analytics infrastructure, Intermolecular has a ten-year track record helping leading companies accelerate and de-risk materials innovation.
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