DUBLIN, Dec. 31, 2015 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/qvj335/iphone_6s_plus) has announced the addition of the "iPhone 6s Plus Fingerprint Sensor - Reverse Costing Analysis" report to their offering.
This report provides an in-depth analysis of the new iPhone 6s Plus fingerprint sensor. The device features the same structure and capacitive technology of the previous model, but with new innovations in term of sensor design, die process and packaging.
Integrated in the home button, the 12.5×10.9 mm sensor is incorporated within a rectangular shaped housing composed of a stainless steel ring and an aluminum base. The sensor is protected by a sapphire window coated with two different materials and supported by innovative assembly of dies and flex PCB.
The fingerprint sensor allows it to scan the fingerprint just by pushing the button. The sensor has a resolution of 10,752 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin.
Respect to the old fingerprint sensor, the new sensor is composed of two dies, one dedicated to the sensing and one containing the logic. The ASIC die has a 0.18µm manufacturing process and the sensor die is manufactured with a more recent CMOS 65nm technology. While in the previous sensor had edge cavities for the wire bonding; the new sensor is implemented with TSV which allow a better packaging and wire bonding to the flex PCB.
2. Company Profile & Supply Chain
3. Physical Analysis
4. Technology and Cost comparison with iPhone 5s fingerprint sensor
5. Manufacturing Process Flow
6. Cost Analysis
For more information visit http://www.researchandmarkets.com/research/qvj335/iphone_6s_plus
Laura Wood, +353-1-481-1716, email@example.com
SOURCE Research and Markets