GREENVILLE, S.C., Sept. 29, 2011 /PRNewswire/ -- KEMET Corporation (NYSE: KEM), a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, today introduced its new Tantalum Stack Polymer (TSP) Series capacitors. The TSP Series is the first stack solution in the market that utilizes organic conductive polymer as the cathode plate of the capacitor. TSP Series is targeted for applications requiring high capacitance and very low ESR but with limited board space in the consumer/gaming, computer, medical, military/aerospace, telecommunications, and transportation markets.
"Our new TSP Series surface mountable devices can be specified with a variety of capacitance and performance characteristics by stacking two, three, four, or six standard EIA case size discrete components into just one device," said Stanley Garrett, KEMET Technical Product Manager. "These custom combinations result in high capacitance, very low ESR and high ripple current capability in a single footprint, which makes them an ideal solution for applications such as power supplies for a wide range of products."
KEMET offers this solution with its T540 Commercial Off-The-Shelf (COTS) Series capacitors. However, custom stacks are also available with other KEMET Tantalum Surface Mount Polymer Series products.
TSP Series Technical Information
- Capacitance values of 66 micro F to 4080 micro F
- Voltage rating of 3VDC-35VDC
- Surge options available
- Operating temperature range of -55 degrees C to +125 degrees C
EIA Electronic Industries Alliance
ESR Equivalent Series Resistance
KEMET's common stock is listed on the NYSE under the symbol "KEM." At the Investor Relations section of our web site at http://www.KEMET.com/IR, users may subscribe to KEMET news releases and find additional information about our Company. KEMET applies world class service and quality to deliver industry leading, high performance capacitance solutions to its customers around the world and offers the world's most complete line of surface mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics. Additional information about KEMET can be found at http://www.kemet.com.
Cautionary Statement on Forward-Looking Statements
Certain statements included herein contain forward-looking statements within the meaning of federal securities laws about KEMET Corporation's (the "Company") financial condition and results of operations that are based on management's current expectations, estimates and projections about the markets in which the Company operates, as well as management's beliefs and assumptions. Words such as "expects," "anticipates," "believes," "estimates," variations of such words and other similar expressions are intended to identify such forward-looking statements. These statements are not guarantees of future performance and involve certain risks, uncertainties and assumptions, which are difficult to predict. Therefore, actual outcomes and results may differ materially from what is expressed or forecasted in, or implied by, such forward-looking statements. Readers are cautioned not to place undue reliance on these forward-looking statements, which reflect management's judgment only as of the date hereof. The Company undertakes no obligation to update publicly any of these forward-looking statements to reflect new information, future events or otherwise.
Factors that may cause actual outcome and results to differ materially from those expressed in, or implied by, these forward-looking statements include, but are not necessarily limited to, generally adverse economic and industry conditions, including a decline in demand for the Company's products. Other risks and uncertainties may be described from time to time in the Company's reports and filings with the Securities and Exchange Commission.
Contact: Dean W. Dimke
Director of Corporate and Investor Communications
SOURCE KEMET Corporation