NEW YORK, Oct. 6, 2011 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
MEMS : MEMS & Sensors for Smartphones
MARKET TRENDS
Integration of MEMS components and sensors is not new to the mobile phone industry. For example, FBAR RF filters and silicon microphones have been integrated on our mobile phones since 2002. More recently, MEMS accelerometers have been established as a "must-have" feature for many smartphones and feature-phones. And other types of sensors, like CMOS image sensors, have experienced a large success in the recent years.
But the mobile phone market is changing extremely quickly. It appears that in 2010 we are at a turning point in the history of MEMS & sensors for handsets: the market for MEMS & sensors will experience double digit growth, from $3.55B in 2009 to $7.91B in 2015.
We have identified several factors explaining why MEMS & sensors will experience this tremendous growth over the next few years:
Share of smartphones is rising faster than ever: 44% of the mobile phones will be smartphones in 2015. Success of smartphones is leading to an increasing amount of MEMS & sensors in mobile phones to provide new features/ services to end-users, to reduce cost through more integration or to improve hardware performance
GPS integration is not limited to high-end phones anymore. Nearly one phone in three will incorporate GPS in 2010. This is an additional driver to integrate motion sensors: when combined with compass, accelerometers or gyroscopes, this enables new services to be deployed
The RF part of cell phones is currently changing very quickly, with more and more multi-band multi-mode mobile phones. The incoming deployment of new standards (LTE network in particular) has a direct impact on RF components and will open new doors for online services using an increasing amount of sensors
One striking illustration on how quickly things can happen in the mobile phone industry is the recent release of iPhone 4, the first mobile phone to integrate a MEMS gyroscope, followed a few days later by the announcement of InvenSense IPO. The gyroscope business is now expected to boom very quickly: we believe that the gyroscope market for mobile phones will be more than $80M in 2010 already. We believe strongly that the impact of gyroscopes on the user experience will be as high as the accelerometer case. Only 3 years ago the first accelerometers were integrated on mobile phones, at a price level similar to gyroscopes today. Now accelerometers are viewed as commodity products in some platforms and their penetration should be above one third of cell phones in 2010. Total motion sensor market for mobile phone will reach $1.19Bin 2015, with a 25.3% CAGR.
Gyroscopes are not predicted to be the only "killer app" in handsets for the years to come. Many other signifcant changes are also expected:
While the accelerometer and compass try to offer differentiating features, gyroscopes are now entering the mobile phone business, and efforts are also put on pressure sensors. Combo of motion sensors with an increasing processing part are now in development
RF filters, variable capacitors and silicon MEMS oscillators should benefit from the changes occurring at the radiofront end level, from the increasing market for duplexers to the LTE impact on multi-mode phones.
Silicon microphones are being accepted by the handset market. The cost benefit of ECM tends to decrease, and silicon microphones offer many other advantages. The emergence of dual-microphone solutions for ambient noise cancellation is going to push this business.
Numerous innovative developments in the optical MEMS area are observed. Integrated picoprojectors could make the micromirror market take off, while new microdisplay concepts expect to widely decrease power consumption.
CMOS image sensors are already a very big business. The battle is intense between the competitors to develop the next key features such as BSI, WLO, autofocus solutions or stabilization.
Several other emerging sensors have been identified, with the potential to become new killer applications in 5 to 10 years: microspeakers, environmental sensors…
Such an attractive market brings with it intense competition between players. We can observe very quick changes in the supply chain since 2 years with the emergence of new players, the alliances between companies and regular fundraising / acquisitions, in particular when it comes to startups. IDMs such as ST Microelectronics have been established as business leaders, by offering reliable components, high level of customer support, an extensive product portfolio and huge price reduction. However few fabless companies have been successful and several innovative fabless start-ups are expected to impact the market within a few years.
COMPANY INDEX
3M, AgileRF, Aichi Steel, AKM, Akustica, Alces Technology, Alps Electric, Analog Devices, Apple, Aptina Imaging, Artificial Muscle, Asahi, Atmel, Audiopixels, Authentec, Auxitrol, Avago, Baolab, BEI Kimco Magnetics, Best Sound Electronics, Bluechiip, Bosch Sensortec, Btendo, Cambridge Mechatronics, Carnegie Mellon University, Cavendish Kinetics, CEA Leti, Ceradyne, ChipSensors, CSEM, Cypress, Dai Nippon Printing, Deep Di Semiconductor, DelfMEMS, Discera, Domintech, DXO, Epcos, Epson, Epson Toyocom, Fox Electronics, Fraunhofer IZM, Freescale, Fujitsu, G-TEK Scientific, Hamamatsu, HDK hokuriku, Hillcrest Lab, Hiperscan, Honda/Stanford University, Honeywell, Hosiden, HT Micro, IBM, iC Haus, ICT, IDT, IMEC, Infineon, Intersil, Invensense, Jyve, KDS, Kionix, Knowles Acoustics, Kyocera, Lawrence Livermore National Laboratory, Lemoptix, Lensvector, LG, Light Blue Optics, LighTuning / Egis Technology, Linear Technology, M2E power, Maradin Technologies, Maxim, Mcube, MEMSIC, Memsmart, Memsmeriz, Memstech, Micro infinity, Microflown Technologies, Microsemi, Microvision, Miradia, MIT, Mitsubishi, Mitsumi Electric, Mobius microsystem, Motorola, Movea, MTI Fuel Cell, Murata, MyFC, NDK, New Scale Technologies, Nippon Signal, Nokia, NPC, NTT Docomo, Nuvoton Technology, NXP, Olympus, Omnivision, Omron, Optotune, Opus Microsystems, Osram, Panasonic, Paratek, Pegrine SC, Pixart, Pixtronix, Polight, Powermat, Qualcomm, Qualtre, Rakon, RFMD, RIM, Rohm, Samsung, Sand9, Seiko Instruments, Senda Micro Technologies, Senodia, SenseAir, Sensirion, Sensor Platforms, SETi, Sharp, Siimpel, Silicon Clocks, Silicon Labs, SiTime, Siward, Skyworks, Sony, SonyEricsson, ST Microelectronics, Taiyo Yuden, Tessera, Texas Advanced Optoelectronic Solutions, Texas Instruments, Tohoku University, Toshiba, Triquint, TXC, Unipixel, Upek, Varioptic, Vasstek, Veratag, Virtus Advanced Sensors, Vishay, VTI, VTT, Wacoh, Wispry, Xiamen Hualian Electronics Company, Yamaha, Yishay Sensor, ZTE.
Introduction, Definitions & Methodology
Executive Summary
1. Mobile Phone Market Overview
2. MEMS & Sensors for Mobile Phones: 2009-2015 Market Overview
3. Supply Chain Analysis
Business Models of Device Suppliers
Strategy of the key MEMS players
4. Motivation to Integrate MEMS Devices and Market Dynamics
5. Motion Sensors and Pressure Sensors
Overview
MEMS Accelerometers
MEMS Gyroscopes
Electronic Compass
Inertial Measurement Units & Other Motion SensorClusters
Pressure Sensors
6. RF Devices
Analysis: Evolution of the Radio Front-End Module
BAW Filters and Duplexers
MEMS Switches and Variable Capacitors
Silicon MEMS Oscillators
7. Silicon Microphones
8. Optical MEMS for Display and Projection
Micromirrors for Picoprojectors
Microdisplays
9. CMOS Image sensors and MEMS Auto Focus
CMOS Image Sensors
MEMS AF & Microzoom
10. Emerging sensors for Mobile Phones
Ambient Light Sensors & Proximity Sensors
Energy harvesting
Micro fuel cells
Microspeakers
Fingerprint sensors
RFID
Environmental and biologic sensors: temperature, humidity, gas…
Conclusion
More Details
COMPANY INDEX
3M, AgileRF, Aichi Steel, AKM, Akustica, Alces Technology, Alps Electric, Analog Devices, Apple, Aptina Imaging, Artificial Muscle, Asahi, Atmel, Audiopixels, Authentec, Auxitrol, Avago, Baolab, BEI Kimco Magnetics, Best Sound Electronics, Bluechiip, Bosch Sensortec, Btendo, Cambridge Mechatronics, Carnegie Mellon University, Cavendish Kinetics, CEA Leti, Ceradyne, ChipSensors, CSEM, Cypress, Dai Nippon Printing, Deep Di Semiconductor, DelfMEMS, Discera, Domintech, DXO, Epcos, Epson, Epson Toyocom, Fox Electronics, Fraunhofer IZM, Freescale, Fujitsu, G-TEK Scientific, Hamamatsu, HDK hokuriku, Hillcrest Lab, Hiperscan, Honda/Stanford University, Honeywell, Hosiden, HT Micro, IBM, iC Haus, ICT, IDT, IMEC, Infineon, Intersil, Invensense, Jyve, KDS, Kionix, Knowles Acoustics, Kyocera, Lawrence Livermore National Laboratory, Lemoptix, Lensvector, LG, Light Blue Optics, LighTuning / Egis Technology, Linear Technology, M2E power, Maradin Technologies, Maxim, Mcube, MEMSIC, Memsmart, Memsmeriz, Memstech, Micro infinity, Microflown Technologies, Microsemi, Microvision, Miradia, MIT, Mitsubishi, Mitsumi Electric, Mobius microsystem, Motorola, Movea, MTI Fuel Cell, Murata, MyFC, NDK, New Scale Technologies, Nippon Signal, Nokia, NPC, NTT Docomo, Nuvoton Technology, NXP, Olympus, Omnivision, Omron, Optotune, Opus Microsystems, Osram, Panasonic, Paratek, Pegrine SC, Pixart, Pixtronix, Polight, Powermat, Qualcomm, Qualtre, Rakon, RFMD, RIM, Rohm, Samsung, Sand9, Seiko Instruments, Senda Micro Technologies, Senodia, SenseAir, Sensirion, Sensor Platforms, SETi, Sharp, Siimpel, Silicon Clocks, Silicon Labs, SiTime, Siward, Skyworks, Sony, SonyEricsson, ST Microelectronics, Taiyo Yuden, Tessera, Texas Advanced Optoelectronic Solutions, Texas Instruments, Tohoku University, Toshiba, Triquint, TXC, Unipixel, Upek, Varioptic, Vasstek, Veratag, Virtus Advanced Sensors, Vishay, VTI, VTT, Wacoh, Wispry, Xiamen Hualian Electronics Company, Yamaha, Yishay Sensor, ZTE.
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Electronic Component and Semiconductor Industry: MEMS : MEMS & Sensors for Smartphones
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Nicolas Bombourg
Reportlinker
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