ALISO VIEJO, Calif., April 11, 2012 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its SmartFusion® customizable system-on-chip (cSoC) devices are now fully screened to meet stringent military operating temperatures ranging from -55 degrees C to 125 degrees C. The devices feature an integrated ARM® Cortex™-M3-based processor and are fully tested for operation at military temperature ranges, targeting applications where ensuring high-reliability performance is critical. These include avionics systems and missiles, as well as unmanned and weaponry systems which must continuously and reliably operate in harsh ground and atmospheric environments.
"Our mil-temp qualified cSoCs build on our more than 50-year heritage of delivering highly reliable, fully tested solutions for demanding military and avionics applications," said Esam Elashmawi, vice president and general manager at Microsemi. "In addition, our SmartFusion cSoCs combine analog and digital functionality on the same die, which allows designers to address SWaP (Size, Weight and Power) and cost concerns."
SmartFusion cSoCs provide military and avionics systems designers with a reprogrammable, non-volatile logic integration solution. The award-winning devices are based on secure flash technology that provides immunity against damaging radiation-induced configuration upsets, while eliminating the need for additional code storage. The easily reprogrammable cSoCs also enable quick prototyping and design validation capabilities, which streamline product development efforts. Additional benefits include:
- Fully tested ARM Cortex-M3 solution across the complete military temperature range;
- One hundred percent tested across the entire -55 to 125 degrees C temperature range, ensuring performance specifications are met and eliminating the need to up-screen commercial-of-the-shelf (COTS) devices;
- Live at power up (LAPU), delivering immediate processing to support short initiation systems without the need for additional power circuitry;
- Offered in 500K and 60K equivalent gates and support up to 204 input/outputs (IOs);
- Enables system and power management capabilities where multiple power rails exist; and
- Allows designers to combine analog and digital components, saving board space.
Availability and Packaging
Military temperature samples and software will be available in May 2012 for prototyping purposes. Fully qualified parts will be available June 2012. Qualified parts will include the SmartFusion A2F500 FG/G: 484 and 256 packages as well as the A2F060 FG/G 256 package. For more information contact your local Microsemi sales representative or visit www.microsemi.com/soc/products/solutions/milaero/default.aspx.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and medical, industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new military temperature SmartFusion cSoCs, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation