ALISO VIEJO, Calif., April 1, 2014 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has implemented significant FPGA design infrastructure support with the opening of three new technical support design centers, and by training and certifying more than 200 distributor partner field application engineers (FAEs) worldwide. In addition, the company is providing one of the most comprehensive and effective hands-on customer seminar training programs globally.
More than 200 technical training seminars have been conducted via Microsemi's strategic distribution channel partners—Avnet, Arrow Electronics and Future Electronics—and over 1,000 customer engineers have been trained on Microsemi's leading FPGA product line and its development systems. Microsemi has certified more than 110 distributor FAEs, and provided extensive training to over 200 FAEs worldwide on the company's SmartFusion®2 SoC FPGA and IGLOO®2 FPGA product lines. The three new strategic design centers set up in collaboration with distribution partners are located in Aliso Viejo and San Jose, Calif., as well as in Taiwan—adding to existing facilities in Hyderabad and Shanghai. The design centers were established to provide in-depth reference design support for Microsemi FPGA customers.
Microsemi's award-winning SmartFusion2 SoC FPGA and IGLOO2 FPGA product lines provide the lowest power consumption, best-in-class security technology and highest reliability in their class of products. Offering an extensive array of mainstream features, these families are superior FPGA-based application solutions for system architects, FPGA designers and system designers that allow them to considerably differentiate their products from the competition and gain significant market advantage. The comprehensive features offered from Microsemi FPGAs enable a broader range of mainstream applications to leverage these benefits while realizing the lowest cost of ownership relative to other FPGAs with similar capabilities.
"Since the introduction of Microsemi's SmartFusion2 SoC FPGA in 2012, and subsequent introduction of IGLOO2 FPGA in 2013, we have made a concentrated effort to collaborate with our worldwide channel partners to create the world's foremost technical support team," said Paul Pickle, president and chief operating officer at Microsemi. "We are very pleased with the result and customer feedback that we have been seeing on a worldwide basis, with design activity up more than threefold year over year, which validates our overall demand creation and support strategy."
About SmartFusion2 SoC FPGAs
SmartFusion2 SoC FPGAs integrate inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip. Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications.
About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA markets by providing a LUT based fabric, 5G transceivers, high speed GPIO, block RAM, a high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash based fabric with the highest number of general purpose I/Os, 5G SERDES interfaces and PCI Express end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its significant FPGA design infrastructure support with the opening of three technical support design centers, by training and certifying more than 260 distributor partner field application engineers (FAEs) worldwide, providing one of the most comprehensive and effective hands-on customer seminar training programs globally, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation