DUBLIN, Sept. 6, 2018 /PRNewswire/ --
The "Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023" report has been added to ResearchAndMarkets.com's offering.
The MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023.
Major factors driving the growth of this market include the increasing use of MID in medical devices, rising demand for miniaturization in the consumer electronics industry, and growing need to reduce e-waste. For the past few years, the healthcare industry has been focusing on minimizing its spending on medical devices and equipment, as well as adopting the latest technologies (with fast operations and miniaturized components compared with the existing ones). Designing miniaturized and portable equipment requires miniaturized components. MID technology meets these requirements of medical device OEMs.
In this report, the MID market has been segmented based on process, product type, industry, and geography. The consumer electronics industry accounted for the largest share of the MID market in 2017. MIDs are used in consumer electronics for the internal antenna of cellular phones, which replaces the normal antenna stub. Furthermore, using antenna as part of the phone's internal fixtures helps in reducing volume by achieving more efficient space utilization. Therefore, growth in smartphones, tablets, and laptops would increase the adoption of MIDs in this industry, which would further fuel the growth of the MID market in the coming years.
The market for laser direct structuring is expected to grow at the highest CAGR during the forecast period. LDS equipment is used to manufacture MIDs. LDS consists of various steps, such as injection molding, laser activation, metallization, and assembly. LPKF is the sole manufacturer of LDS equipment. It allows to eliminate components in electronic devices, such as antennae in smartphones, thus reducing assembly time and device production cost. Moreover, the introduction of 5G mobile communications technology will lead to the rise in demand for smartphone antennae, which in turn will increase demand for LDS equipment.
Molded Interconnect Device (MID) Market
By region, the MID market has been segmented into North America, Europe, APAC, and RoW. APAC is expected to account for the largest size of the overall MID market during the forecast period. APAC is expected to offer lucrative opportunities for the MID market growth owing to the growing base for communication infrastructure, communication devices, and consumer electronics. APAC is one of the key regions for players dealing with smartphones and wearable devices. The trend of miniaturization of components in smartphones and wearables will drive the MID market in this region.
MIDs have a thriving market in the automotive industry. This is largely due to the wide-scale adoption of MID in various automotive applications, such as steering wheel hubs, brake sensors, position sensors, and lighting. In automotive, MID reduces the wiring and combines the connector and housing in 1 piece, and through selective plating, it incorporates all the required circuitry. Such benefits of MIDs encourage this industry to adopt MID technology, thereby fueling the MID marke
MIDs are used in consumer electronics for the internal antenna of cellular phones, which replaces the normal antenna stub. Furthermore, using antenna as part of the phone's internal fixtures helps in reducing volume by achieving more efficient space utilization. Therefore, growth in smartphones, tablets, and laptops would increase the adoption of MIDs in this industry, which would further fuel the growth of the MID market in the coming years.
To save production costs and reduce production time for devices, telecommunications equipment manufacturers are focusing on developing products where electrical and mechanical functions can be combined in a single product. In telecommunications, MID finds application in connectors, security shields, and telecommunications boxes, among others. Therefore, increase in the usage of MID in telecommunications applications would drive the MID market in the coming years.
The medical industry is implementing and adopting new technologies to provide better services to patients. MID technology has been used in medical devices to improve product quality. MID finds application in portable devices such as glucose meters and hearing aids. MID helps miniaturize monitoring devices for medication, which improves their diagnostic capabilities. Therefore, the increasing adoption of MID in medical devices is expected to boost the MID market growth in the coming years.
Critical questions that the report answers:
- Where will all these developments take the industry in the mid to long term?
- Will the suppliers continue to explore new avenues for MID?
- What are the upcoming industrial applications for MID?
The key players operating in the MID market are Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).
Key Topics Covered:
2 Research Methodology
3 Executive Summary
4 Premium Insight
4.1 Attractive Opportunities for Molded Interconnect Device Market Growth
4.2 Molded Interconnect Device Market for Consumer Electronics Industry, By Product Type
4.3 Molded Interconnect Device Market for Antennae and Connectivity Modules, By Industry
4.4 Molded Interconnect Device Market in Europe, By Process
4.5 Molded Interconnect Device Market, By Region
5 Market Overview
5.2 Market Dynamics
126.96.36.199 Increasing Use of MID in Medical Devices
188.8.131.52 Rising Demand for Miniaturization in Consumer Electronics Industry
184.108.40.206 Increasing Need to Reduce E-Waste
220.127.116.11 Technological Monopoly of Lds Equipment Manufacturer
18.104.22.168 Rising Use of MID in Automotive Industry
22.214.171.124 Growth in IoT Devices
126.96.36.199 Incompatibility With Electronic Packages
6 Industry Trends
6.2 In-Mold Electronics (IME)
6.2.2 Building Blocks
7 Molded Interconnect Device Market, By Process
7.2 Laser Direct Structuring
7.3 2-Shot Molding
7.4 Film Techniques
8 Molded Interconnect Device Market, By Product Type
8.2 Antennae and Connectivity Modules
8.4 Connectors and Switches
9 Molded Interconnect Device Market, By Industry
9.3 Consumer Electronics
10 Geographic Analysis
11 Competitive Landscape
11.2 Market Player Ranking Analysis
11.3 Competitive Situations and Trends
12 Company Profiles
12.2 Key Players
12.2.2 LPKF Laser & Electronics
12.2.3 TE Connectivity
12.2.5 Arlington Plating Company
12.2.7 MID Solutions
12.2.8 2E Mechatronic
12.2.9 Multiple Dimensions
12.3 Other Important Players
12.3.1 Laser Micronics
12.3.3 Axon Cable
12.3.5 Suzhou Cicor Technology Co. Ltd
12.3.6 IME Vendors
188.8.131.52 Dura Tech Industries
184.108.40.206 Yomura Technologies
For more information about this report visit
Laura Wood, Senior Manager
For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
SOURCE Research and Markets