MILPITAS, Calif., Aug. 15, 2012 /PRNewswire/ -- Open-Silicon, Inc., a leading semiconductor design and manufacturing company, and developer member in the Hybrid Memory Cube Consortium, announced today that Vice President of IP and Platforms Steve Erickson will present on Hybrid Memory Cube (HMC) and its revolutionary approach to 3D system memory at the "3D Flash – The Next Dimension" technical session at the Flash Memory Summit. Mr. Erickson's presentation will address the architecture of HMC and how it represents a fundamental shift in memory technology that sets a new standard for performance, power and reliability, particularly for mobile, networking and server applications.
This technical session will include presentations by Cadence Design Systems and 3D Plus in addition to Open-Silicon. The session will begin with an overview of 3D approaches to non-volatile memories and their likely effects on cost per bit. New interface technologies, such as Wide-IO and TSVs (through-silicon vias) will be explored, as well as BGA stacking options.
What: Presentation – "HMC Overview – A Revolutionary Approach to System Memory" – Session 101-A: 3D Flash – The Next Dimension (Hardware Track)
Who: Presented by Steve Erickson, vice president of IP and Platforms, Open-Silicon
When: Tuesday, August 21, 8:30 AM
Where: Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA 95054
About Open-Silicon, Inc.
Open-Silicon is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. In support of the industry trend towards collaborative engineering and design-lite, Open-Silicon offers SoC architecture, system design, physical design, IP, system software, and high-quality semiconductor manufacturing services with one of the world's broadest partner ecosystems for IC development. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.
SOURCE Open-Silicon, Inc.