SHANGHAI, June 28, 2017 /PRNewswire/ -- At Mobile World Congress Shanghai 2017, Qualcomm Incorporated (NASDAQ: QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced the Qualcomm® Snapdragon™ 450 Mobile Platform, a new entry to the Snapdragon 400 Mobile Platform tier. Catered to mid-range smartphones and tablets, the Snapdragon 450 is the first in its tier to use 14nm FinFET process and is designed to deliver significant improvements in battery life, graphics and compute performance, imaging and LTE connectivity over its predecessor, the Snapdragon 435 Mobile Platform.
The full release is available on the Qualcomm News Center website at https://www.qualcomm.com/news/releases/2017/06/28/qualcomm-snapdragon-450-mobile-platform-bring-14nm-finfet-process-enhanced
Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm's website, OnQ blog, Twitter and Facebook pages.
Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.
Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.
Pete Lancia, Corporate Communications
John Sinnott, Investor Relations
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SOURCE Qualcomm Technologies, Inc.