SAN DIEGO, Oct. 27 /PRNewswire/ -- Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has entered into a contract with UltraComm for the packaging and assembly of electro/optic Cores which are embedded into High Speed Optical Transceivers for military and space applications. UltraComm provides custom engineering design, and systems integration services to a wide variety of companies.
"The electro/optic Cores that UltraComm designs for harsh environments require extremely tight tolerance placement of stacked components," says Steve Swendrowski, Quik-Pak General Manager. "Quik-Pak has the state-of-the-art assembly capabilities to meet these stringent requirements and our flexible manufacturing can accommodate the ramp up in volume."
The company specializes in microelectronic packaging and advanced assembly services. A limitless array of open-cavity and open molded packages are available with no minimum quantity. Packaging can be provided as part of a turnkey assembly solution along with backgrinding, wafer dicing, die/wire bonding, laser micromachining, remolding and marking/branding. Custom assembly services are also offered for flip chip, ceramic packages, chip-on-board, stacked die, MEMS, etc. Quik-Pak's unique offerings deliver faster time to market and reduced costs for new devices, while providing excellent flexibility, quality and customer service.