Reportlinker Adds European Fabless Semiconductor Report
NEW YORK, June 21 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
European Fabless Semiconductor Report
http://www.reportlinker.com/p0208560/European-Fabless-Semiconductor-Report.html
Content
This unique report focuses on Europe and European IC design expertise. It highlights the considerable number of independent companies that supply the key enabling technology that allows European system companies to achieve early market entry and leading edge product performance. The strength of the IC design expertise in Europe, is one of the semiconductor industry's best-kept secrets, and partially balances the influence of the trend towards foreign ownership of European wafer manufacturing.
This report is essential for those planning the resources of subcontracting new product design in the semiconductor industry, and those involved in the final system end product. It will also prove invaluable for authorities and government departments in planning and directing economic growth, as well as companies seeking to invest in Europe. The report includes a profile on each of the approximately 350 enterprises active in this area, including details on their chosen technology and target markets, company size and structure, as well as contact details in a convenient one 'company per page' format. This information is also available as a company database in Excel format. This best-selling report has a proven track record as an invaluable research resource for sourcing IP, acquisitions and joint ventures.
The price of the report includes a free hardcopy and CD-ROM upon request.
1.0 Introduction .. 1
1.1 Scope.. 1
1.2 Methodology . 3
2.0 Introduction .. 5
2.1 European Semiconductor Industry Evolution ....... 5
2.2 Applications Market Environment . 9
2.3 OEM Industry Changes..... 13
2.4 Business Model Developments....... 18
3.0 Introduction 27
3.1 Driver - OEM Strengths In Europe .......... 27
3.2 Driver - End User Demand 28
3.3 Driver - Integration Trends ......... 30
3.4 Driver - Time To Market... 33
3.5 Driver - Reusable Intellectual Property ... 34
- IP Exploitation .. 34
- Re-Use Of IP..... 36
- Importance Of External IP Sources ...... 39
4.0 Introduction 43
4.1 IP Location, Evaluation & Libraries ........ 43
4.2 Valuing Intellectual Property (IP) 46
4.3 IP Protection, Licensing & Negotiation.... 50
4.5 Security Of IP Technology. 53
4.6 Evaluation & Delivery Issues ........ 54
- Types Of Core... 55
- Hard & Soft IP Delivery Formats ......... 58
5.0 Independent Contract Design Houses ...... 61
5.1 Captive IC Design Houses . 62
5.2 Fabless Semiconductor Companies........... 62
5.3 Chipless IP Vendors ........... 63
5.4 Design House Chronology.. 64
5.5 Skill Clusters........... 67
5.6 Geographical Distribution . 69
6 COMPANY SKILLS & PROFILES........ 71
6.0 Introduction 71
6.1 Alphabetical List Of All Companies ......... 71
6.2 European Companies, By Company Type ........... 82
- Chipless Companies...... 82
- Fabless Companies ....... 84
- Contract Design House Companies - Digital .... 89
- Contract Design House Companies - Mixed-Function . 90
- Contract Design House Companies - Mixed-Signal ..... 91
- Contract Design House Companies - System on Chip (SoC) ... 93
- Design House Service Companies ........ 94
6.3 European IC DesignCompanies, By Country ...... 95
- Austria .. 95
- Belgium 96
- Denmark ........... 96
- England. 97
- Finland 100
- France . 100
- Germany ......... 102
- Greece. 103
- Ireland. 103
- Israel ... 104
- Italy..... 106
- The Netherlands.......... 106
- Northern Ireland.......... 107
- Norway ........... 107
- Portugal........... 107
- Scotland .......... 108
- Spain ... 108
- Sweden 109
- Switzerland ..... 110
- Wales .. 111
6.4 IP Resources In European Design Companies... 113
- Families & Categories 113
6.5 Companies With Analogue Skills 114
- Analogue Interface...... 114
- Analogue RF... 116
6.6 Processing IP......... 119
- Central Processing Units (CPU) ......... 119
- Digital Signal Processing (DSP)......... 120
- Memory .......... 120
6.7 Connectivity IP..... 124
- Bus Systems.... 124
- Modems & xDSL........ 124
- Networks......... 124
- Optoelectronics ........... 124
6.8 VLSI Application IP......... 129
- Automotive ..... 129
- Encryption....... 129
- Graphics.......... 130
- Internet 130
- Peripherals ...... 130
- Radio Baseband .......... 130
- Sensor Interfacing....... 131
- Telecommunications... 131
- Video/Audio ... 131
- VLSI Integration – ASICs & FPGAs.. 131
- Software (embedded) IP ......... 132
6.9 Design Support & Verification.... 145
- IP Services ...... 145
- Verification Services... 146
8 IC DESIGN HOUSE DATABASE DISK AVAILABLE ......... 511
APPENDIX A - GLOSSARY OF TERMS....... 513
APPENDIX B – ABOUT FUTURE HORIZONS ........ 547
List Of Figures
Figure 2.1 - Major European Semiconductor Companies, 1999-2008.......... 8
Figure 2.2 - European Semiconductor Application Markets, 2003-2013 ... 11
Figure 2.3 - IC Industry Restructuring........ 20
Figure 2.4 - Formation Of The Semiconductor Industry .... 23
Figure 3.1 - Worldwide Semiconductor Application Markets. 2003-2013. 30
Figure 3.2 - Technology Life Cycle 35
Figure 4.1 - IP Fee Structure, Chipless Companies, 2008 .. 48
Figure 4.2 - IP Core Delivery Format, All Companies ....... 59
Figure 5.1 - Company Type Choice Within Europe ........... 64
Figure 5.2 - Period Of Company Foundation ......... 66
Figure 5.3 - Age In Years - All Companies 66
Figure 5.4 - Geographical Location Of Companies 69
List Of Tables
Table 6.1 - All European IC Design, Chipless & Fabless Companies........ 71
Table 6.2 - IC Design Companies - Chipless.......... 82
Table 6.3 - European IC Design Companies - Fabless ....... 84
Table 6.4 - European IC Design Companies - Digital Design ........ 89
Table 6.5 - European IC Design Companies - Mixed-Function Design ..... 90
Table 6.6 - European IC Design Companies - Mixed-Signal Design ......... 91
Table 6.7 - European IC Design Companies - System on Chip Design...... 93
Table 6.8 - IC Design Companies - Services .......... 94
Table 6.9 - IC Design Companies - Austria 95
Table 6.10 - IC Design Companies - Belgium........ 96
Table 6.11 - IC Design Companies - Denmark....... 96
Table 6.12 - IC Design Companies - England ........ 97
Table 6.13 - IC Design Companies - Finland ....... 100
Table 6.14 - IC Design Companies - France......... 100
Table 6.15 - IC Design Companies - Germany..... 102
Table 6.16 - IC Design Companies - Greece ........ 103
Table 6.17 - IC Design Companies - Ireland ........ 103
Table 6.18 - IC Design Companies - Israel........... 104
Table 6.19 - IC Design Companies - Italy 106
Table 6.20 - IC Design Companies - The Netherlands ..... 106
Table 6.21 - IC Design Companies - Northern Ireland..... 107
Table 6.22 - IC Design Companies - Norway....... 107
Table 6.23 - IC Design Companies - Portugal ...... 107
Table 6.24 - IC Design Companies - Scotland...... 108
Table 6.25 - IC Design Companies - Spain .......... 108
Table 6.26 - IC Design Companies - Sweden....... 109
Table 6.27 - IC Design Companies - Switzerland. 110
Table 6.28 - IC Design Companies - Wales.......... 111
Table 6.29 - Design Company IP Families & Categories . 113
Table 6.30 - Skill & IP Resources, Analogue Interface .... 114
Table 6.31 - Skill & IP Resources, Analogue RF . 116
Table 6.32 - Skill & IP Resources, Processing IP, CPU... 120
Table 6.33 - Skill & IP Resources, Processing IP, DSP ... 122
Table 6.34 - Skill & IP Resources, Processing IP, Memory ......... 123
Table 6.35 - Skill & IP Resources, Connectivity, Bus Systems.... 125
Table 6.36 - Skill & IP Resources, Connectivity, Modems & xDSL........ 125
Table 6.37 - Skill & IP Resources, Connectivity, Networks......... 126
Table 6.38 - Skill & IP Resources, Connectivity, Optoelectronics........... 128
Table 6.39 - Skill & IP Resources, Automotive.... 132
Table 6.40 - Skill & IP Resources, Encryption..... 133
Table 6.41 - Skill & IP Resources, Graphics ........ 133
Table 6.42 - Skill & IP Resources, Internet .......... 134
Table 6.43 - Skill & IP Resources, Peripherals..... 134
Table 6.44 - Skill & IP Resources, Wired Telecommunications .. 135
Table 6.45 - Skill & IP Resources, Radio Baseband......... 136
Table 6.46 - Skill & IP Resources, Sensor Processing & Processing ....... 137
Table 6.47 - Skill & IP Resources, Video & Audio.......... 139
Table 6.48 - Skill & IP Resources, Embedded Software IP.......... 141
Table 6.49 - Skill & IP Resources, VLSI Integration & ASIC/FPGA...... 143
Table 6.50 - Skill & IP Resources, IP Services..... 145
Table 6.51 - Skill & IP Resources, Verification Services. 146
To order this report:
Electronic Component and Semiconductor Industry: European Fabless Semiconductor Report
Check our Company Profile, SWOT and Revenue Analysis!
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Nicolas Bombourg
Reportlinker
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