NEW YORK, Feb. 23, 2011 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
This report analyzes the worldwide markets for Thin Layer Deposition Equipment in US$ Million by the following product segments: Physical Vapor Deposition (PVD) Equipment (Microelectronics, Cutting Tools, Industrial, Specialty Packaging, Storage, Optics, and Medical), and Chemical Vapor Deposition (CVD) Equipment (Microelectronics, Cutting Tools, Industrial, and Medical). The End-use segments discussed include Microelectronics Industry, Cutting Tools, Industrial Applications, Specialty Packaging, Data Storage, Optoelectronic Components, and Medical Technology Applications. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2007 through 2015. Also, a seven-year historic analysis is provided for these markets. The report profiles 118 companies including many key and niche players such as AIXTRON, Applied Materials, Inc., ASM International N.V., Axcelis Technologies, Inc., Canon ANELVA Corporation, CHA Industries, CVD Equipment Corporation, Denton Vacuum, Edwards Limited, Ionbond AG, Jusung Engineering Co., Ltd., KDF Electronic & Vacuum Services, Inc., Kokusai Semiconductor Equipment Corporation, Kookje Electric Korea Co., Ltd., Novellus Systems, Inc., OC Oerlikon Corporation AG, RIBER SA, Seki Technotron USA, SEN Corporation, Silicon Genesis Corporation, Tecvac Limited, Tegal Corporation, Ti-Coating, Inc., Tokyo Electron Limited, Ultramet, ULVAC Technologies, Inc., Vapor Technologies, Inc., and Veeco Instruments. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.
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