DUBLIN, July 8, 2016 /PRNewswire/ --
Research and Markets has announced the addition of the "Global Bonding Wire packaging material market 2016-2020" report to their offering.
The global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.
Global Bonding Wire Packaging Material Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
One trend which will boost market growth is the migration to smaller diameter wires. The semiconductor industry is constantly evolving amid rapid advances in technology and miniaturization, which will lead to bonding wires with smaller diameters. Reduction in wire diameter is an effective way to reduce costs in the bonding wire packaging material market, as gold content accounts for the majority of bonding wire expense.
According to the report, a key growth driver is the rising need for miniaturization. The increasing demand for miniaturization in the semiconductor industry has made bonding wires an important part of electronic assemblies. Fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are used for the production of bonding wires. The uniformity of the wires with quality is in high demand. Vendors need to constantly upgrade their offerings with more advanced and compact packaging materials, such as bonding wires with smaller diameters, to cater to consumer requirements.
Further, the report states that one challenge that could impact market growth is the migration to flip chip packaging technology. A flip chip eliminates the primary technical limitations of wire bonding by providing an area-array interconnect and reducing interconnect inductance, which helps in higher frequency performance.
- TANAKA Precious Metals
- Heraeus Deutschland
- California Fine Wire
- MK Electron
Other prominent vendors
- Palomar Technologies
- RED Micro Wire
- Sumitomo Metal Mining
- Tatsuta Electric Wire & Cable
Key Topics Covered:
Part 01: Executive summary
Part 02: Scope of the report
Part 03: Market research methodology
Part 04: Introduction
Part 05: Market landscape
Part 06: Market segmentation by material type
Part 07: Geographical segmentation
Part 08: Key leading countries
Part 09: Summary of key figures
Part 10: Market drivers
Part 11: Impact of drivers
Part 12: Market challenges
Part 13: Impact of drivers and challenges
Part 14: Market trends
Part 15: Vendor landscape
Part 16: Appendix
For more information visit http://www.researchandmarkets.com/research/m5nvdk/global_bonding
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SOURCE Research and Markets