DUBLIN, Nov. 03, 2015 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/w7599j/atands_ecp) has announced the addition of the "AT&S ECP® Embedded Power Die Package - GaN Systems GaNpx Top Cooled - Reverse Costing Analysis" report to their offering.
GaN Systems offers for GS66508T (650V, 30A) a top-side cooling using AT&S ECP® embedded die packaging process. Compared to the bottom-side cooling approach, this new power packaging process allows to reduce the package footprint by 60% for a cost 40% cheaper!
The GS66508P is packaged is an innovative embedded die package developed by AT&S (ECP® process). This package has no wire bonding to reduce the inductance and a design to increase the heat management using the two sides of the die.
The new position of the die in the package allows to enhance the thermal dissipation. Moreover a simplification of the process reduces the time and the cost of manufacturing.
The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process, equipment and materials.
The report also features a comparison with GaNpx bottom-side cooled packaging and with AT&S first generation ECP® process in order to understand the different technology choices made.
Key Topics Covered:
- Executive Summary
- Reverse Costing Methodology
2. Companies Profile
- AT&S Profile
3. GS66508T Characteristics
- GS66508T Characteristics
4. GS66508T Packaging Physical Analysis
- Physical Analysis Methodology
- Views & Dimensions
- Top-Side Delayering
- Bottom-Side Delayering
- Package Cross-Section
- Through-Vias Cross-Section
- Micro-Vias Cross-Section
- EDX Material Analysis
- Redistribution Cross-Section
- Die Views & Dimensions
- GaNpx - ECP® technology
- Adaptation of AT&S ECP® package for high voltage power
- Comparison with GaNpx Bottom-Side Cooling
5. Manufacturing Process Flow
- Global Overview
- GaNpx Packaging Fabrication Unit
- GaNpx Packaging Process Flow
6. Cost Analysis
- Main steps of economic analysis
- GaNpx package
- Yields Hypotheses
- ECP Panel Efficiency
- GaNpx package Cost
- GaNpx package Cost per process steps
- GS66508T Component
- GS66508T Final Test Cost
- GS66508T Component Cost
7. Selling Price Estimation
8. Cost Comparison with Bottom-Side Cooling
For more information visit http://www.researchandmarkets.com/research/w7599j/atands_ecp
Media Contact: Laura Wood , +353-1-481-1716, email@example.com
SOURCE Research and Markets