RF Filters, PAs, Antenna Switches and Tunability for Cellular Handsets

NEW YORK, April 23, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

RF Filters, PAs, Antenna Switches and Tunability for Cellular Handsets

http://www.reportlinker.com/p0844665/RF-Filters-PAs-Antenna-Switches-and-Tunability-for-Cellular-Handsets.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Phones_and_PDA

How emerging technologies are driving the RF architecture changes and will create new market opportunities

Market for key RF components to reach $4.7B in 2016

The radio-front end is a key part in every cell phone, from low cost GSM handset to multi-mode multi-band LTE smartphones. This market is very fragmented in terms of architectures, however there are a few types of components that are key. Filters or duplexers, power amplifiers and antenna switches are at the heart of every cell phone radio. Those components represent a $3.6B market in 2011 already, growing at a 5.6% rate annually until 2016. This report highlights that as this market becomes increasingly attractive, major technical evolutions and changes are observed in the competitive landscape for those categories of devices.

Filters and duplexers are the most dynamic market. Driven by duplexers which are growing at a 10.5% rate annually, this market will reach $1.7B in 2016. Indeed smartphones are widely using WCDMA bands and LTE is a new strong driver. Depending on each band, SAW or BAW developments are candidate to further growth. While Epcos and Murata dominate the SAW area, we observe a fierce competition between Avago and TriQuint in the BAW segment. 

Power amplifier is another strategic component in the RF part. This market matures but we still see many new technologies which impact the market. One current trend is that converged PAs and more broadband PAs are increasingly accepted in the market. GaAs is still dominating the PA market by far but is poised to loose market shares as CMOS PAs are growing, starting at the low end side of the market, and as SOI technology could be used for PAs in the near future. There is thus still room for many changes in the competitive landscape dominated by Skyworks, with RFMD, TriQuint, Avago and Murata / Renesas as challengers.

Antenna switches also become more mature however we observe evolutions in 2 directions. First we see an evolution towards more performance for the new LTE bands and increasing number of throws. This is where Peregrine Semiconductor has a leading position. Second we see massive adoption of SOI technology since 2010. All big players are now involved with this technology which offers a good price/performance ratio. GaAs switches are thus decreasing, although some players still release products with exceptional performances, such as Sony. At the same time new technologies are getting closer to production, this is what is observed with MEMS.

Tunability and changes in architecture

This report provides a detailed analysis on tunability, which is a new hot topic for radio front end modules. Indeed after years of development, antenna tuners have been accepted in 2011. Not only GaAs switches but also ferroelectric capacitors and MEMS variable capacitors have been successfully integrated into flagship products such as some Samsung Galaxy S2 smartphones. While there is no consensus yet on this topic, antenna tuners are now really providing a significant value proposition, we thus expect it to be the next very hot market in this space. New types of tuners and massive deployment of LTE within 2014 will be additional drivers for tunability. Leading the MEMS field, Wispry will be a key player to watch, while Sony and Peregrine also offer promising approaches based on alternative technologies. The acquisition of Paratek by RIM in March 2012 is also a sign that antenna tuners will be a strategic technology to be integrated in many cellphone platforms in the near future.

All those changes at the component level (PA, ASM, filters...) and the rise of tunability are having a dramatic impact in the global RF part architecture evolutions. Both technical and competitive challenges and opportunities are shaping the future front end modules. Similarly the trend for integration in various types of modules is driving changes at the individual component level. New packaging technologies now enable compact multi-chip packages: Rx modules, PA modules, multi-duplexers… All together, the front-end modules are already a $2.0B market in 2011 and grow at a 12.0% yearly rate, this will represent more than 3 times the value of the standalone PAs, filters/duplexers, tuners in 2016.

Rapid evolution of technology and competitive landscape  

While we start to see some level of consolidation, the competitive landscape in this RF market is changing quickly. Some companies are getting more vertically integrated, such as Murata after the acquisition of Renesas PA business, which may translate in a change in the business model of the company. As highlighted in the report, there are today a limited number of companies which dominate this RF space, but generally those players are involved in very specific market space, this means that significant evolutions can be expected in the near future. For instance Skyworks is leading the PA market and is big in switches but has no activity in filters, while Avago is a large PA vendor and dominates the BAW filter market, but is neither involved in SAW filters nor in antenna switches.

The evolution of architecture towards modules is one driver that pushes each company to be able to handle all types of components or to set up specific partnerships. Another driver for competitive change is the technical evolution which is very quick in this area: at the antenna switch level, players with early involvement in SOI switches (Skyworks, RFMD) are getting more market shares against players involved in GaAs (TriQuint…). This type of change should be observed with PA technology as well.

Report Outline

-RF filters / Duplexers, Power Amplifiers, Antenna switches, Tuners

-All types of cell phones: GSM/GPRS, Edge, CDMA & TDCDMA, UMTS (WCDMA), LTE

-2010 – 2016 worldwide market metrics market ($M, M units, ASP)

-2011 market shares

-Market dynamics, technical trends, key players, market forecasts for each component

-Established and new substrate technologies are taken into account: GaAs, HR-SOI, SOS, Bulk CMOS, MEMS, BST

-Radio Front End Modules: typology of modules, key drivers, market forecasts

-100+ companies included in the report

-Report is a 300+ slides PowerPoint presentation

Objectives of the Report

To provide a synthesized view on the market data for the most important RF components used in cellphone FEM: key market metrics & dynamics

-Unit shipments and revenues by type of sensor

-Average selling price analysis and expected evolution

-Market shares with detailed breakdown for each player and major OEM contracts

To provide an analysis on the potential for each technology for each type of device and the impact at the global architecture level:

-Specificities and competitive situation for current technologies and new developments

-Penetration of technologies in 2011 and expected evolution through 2016

-Impact of new packaging technologies (flip-chip, WLP…)

-How technology changes at the component level will impact the global architectures, and vice versa

To provide a deep analysis on the challenges and opportunities for tunability in handsets:

-Description of the different types of tuners and level of integration

-Which driver for tunability, why did it start, how market adoption will be like?

-Key tuner providers

-Different levels of processing and strategies for integration in the system (MCU…)

-Insight about architecture changes linked to the emergence of antenna tuners and other tuners…

*To provide a clear understanding of RF FEM value chain, infrastructure & players for the cellular handset business:

-List of major players for each device under consideration

-Analysis on the potential new entrants with disruptive technologies

-Description of the RF ecosystem: link between component providers, module makers, platform companies, OEMs

-Description of the value chain with major players from design to packaging

Who Should Buy this Report ? 

*Filter, PA, Switch, Tuner suppliers

-Evaluate market potential of future technologies and products

-Understand the differentiated value of your products and technologies in this market

-Build roadmap for modules: which type of modules? When?

-Identify new business opportunities such as tuners, envelope tracking…

-Identify potential strategic partners or technology providers: for more integration…

-Monitor and benchmark your competitor's advancements

*GaAs, SOI, CMOS, MEMS foundries, wafer suppliers, packaging houses

-Understand what are the applications that will drive the volumes in 2016

-Identity new business opportunities and prospects

*Specialists of baseband/ transceiver, of application processor…

-Spot new opportunities and define diversification strategies

Mobile phone OEMs, Platform makers

-Evaluate market potential of future technologies and products to comply with new standards

-Evaluate the benefits of using these new technologies in your end system, design architectures for the next generation of systems

-Screen potential new suppliers able to provide new functionalities, or cost and size savings

R&D centers

-Understand how the new front-end and packaging technologies will impact the future business

-Evaluate market potential of future technologies and products for new applicative markets

-Identify the best candidates for technology transfer

Financial & strategic investors

-Understand the structure and value chain of the cellular handset RF industry

-Estimate the potential of new devices such as antenna tuners…

-Get the list of the main key players and emerging start-ups of this industry worldwide

Key Companies Cited in the Report

ACX, Amalfi, Amkor, Amplitronis SAW, Anadigics, Apple, AT&S, Atlantec, Avago, AVX-Kyocera, Black Sand

Technologies, Broadcom, Carsem, Cavendish Kinetics, CEA LETI, C-Tech, Daisho Denshi, DelfMEMS, Foxconn,

Freescale, Fujitsu, Giga Solutions, Hitachi, HTC, Huawei, Ibiden, IBM, Icera, IM tech, Imbera, IMEC, Infineon,

Inostek, Intel, Ipedia, Javelin Semiconductor, Kyocera, LG, Magnachip, Maruwa, Maxim, Mediatek, Mini-circuits,

Mitsubishi, Motorola, Murata, NDK, NEC, Nelco, Nokia, NTT Docomo, NXP, OKI, Omron, On Semiconductor,

Oscillent, Panasonic, Paratek, Peregrine, Pilkor CND, Qualcomm, RDA Microelectronics, Renesas, RFMD,

RIM, Rubicon, Samsung, Shoulder Electronics Ltd, Sigurd, Skyworks, Soitec, Sony, Sony Mobile, Spectrum

Microwave, SPIL, ST-Ericsson, STMicroelectronics, STATSChipPAC, Subtron, Taconic, Tai-Saw, Taiyo Yuden, TDKEpcos,

Token, Tong Hsing, Toshiba, TriQuint, TSMC, Unisem, UTAC, Vectron, Vishay, VTT, Win Semiconductor,

WiSOL, Wispry, WUS, Yokowo, ZTE…

WHO SHOULD BUY THIS REPORT ?

*Filter, PA, Switch, Tuner suppliers

-Evaluate market potential of future technologies and products

-Understand the differentiated value of your products and technologies in this market

-Build roadmap for modules: which type of modules? When?

-Identify new business opportunities such as tuners, envelope tracking…

-Identify potential strategic partners or technology providers: for more integration…

-Monitor and benchmark your competitor's advancements

*GaAs, SOI, CMOS, MEMS foundries, wafer suppliers, packaging houses

-Understand what are the applications that will drive the volumes in 2016

-Identity new business opportunities and prospects

*Specialists of baseband/ transceiver, of application processor…

-Spot new opportunities and define diversification strategies

*Mobile phone OEMs, Platform makers

-Evaluate market potential of future technologies and products to comply with new standards

-Evaluate the benefits of using these new technologies in your end system, design architectures for the next generation of systems

-Screen potential new suppliers able to provide new functionalities, or cost and size savings

*R&D centers

-Understand how the new front-end and packaging technologies will impact the future business

-Evaluate market potential of future technologies and products for new applicative markets

-Identify the best candidates for technology transfer

*Financial & strategic investors

-Understand the structure and value chain of the cellular handset RF industry

-Estimate the potential of new devices such as antenna tuners…

-Get the list of the main key players and emerging start-ups of this industry worldwide

TABLE OF CONTENT

•Introduction and Definitions p.3

•Executive Summary p.19

1.RF Filter / Duplexer Market p.33

Overview of RF filters / duplexers

SAW market forecasts and market share

Technology trends for SAW filters and duplexers

BAW market forecasts and market share

Technology trends for FBAR / BAW filters and duplexers

2. Power Amplifier Market p.84

Technology trends for power amplifiers

PA pricing, market forecasts and market share

3.Antenna Switching Market p.117

Technology trends for antenna switching

GaAs switches

HR-SOI switches

SOS switches

Bulk CMOS switches

MEMS for antenna switching

Antenna switching pricing, market forecasts and market share

4.Tunability p.151

Drivers for tunable architectures

Application description: antenna tuning, tunable PA, tunable filters/duplexers

Tuning technology platforms

Profile of key players

Tunability pricing, market forecasts and market share

5. FEM Architecture Evolution p.214

Key drivers for radio front end modules

Trends for GSM FEM

Drivers and curent architectures for 3G and 4G phones

FEM market forecasts

6. Background on the RF Industry and Technology Principles p.274

RF ecosystem, supply chain and global drivers

Architecture of RF filters / duplexers

Principles of SAW filters and duplexers

Principles of FBAR / BAW filters and duplexers

•Conclusion and Perspectives p.311

To order this report:

Phones and PDA Industry: RF Filters, PAs, Antenna Switches and Tunability for Cellular Handsets

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