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RiseLink Convenes the Physical AI Ecosystem at CES 2026, Showcasing How Intelligence Moves From Silicon to Shipping Products


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Riselink

Jan 14, 2026, 13:39 ET

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LAS VEGAS, Jan. 14, 2026 /PRNewswire/ -- RiseLink Technologies, a provider of edge intelligence and ultra-low-power connectivity solutions for AI-native devices, brought together leaders across AI, hardware, and connected products at CES 2026 to explore how intelligence is moving beyond the cloud and into the physical world.

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Dr. Diana Zhu, Head of U.S. at RiseLink Technologies, introducing RiseLink’s latest ultra-low-power edge AI chips during CES 2026. The session highlighted how on-device intelligence, efficient connectivity, and system-level design enable scalable, real-world AI products across smart home, robotics, and AI companion applications.
Dr. Diana Zhu, Head of U.S. at RiseLink Technologies, introducing RiseLink’s latest ultra-low-power edge AI chips during CES 2026. The session highlighted how on-device intelligence, efficient connectivity, and system-level design enable scalable, real-world AI products across smart home, robotics, and AI companion applications.

Through curated ecosystem conversations, hands-on workshops, and an invitation-only industry gathering, RiseLink highlighted its role as a connective platform for companies building intelligent devices—bridging chips, algorithms, and real-world product deployment. More information about RiseLink is available at https://riselink.ai.

Aligning the Physical AI Stack: From Silicon to Shipping Products

At CES 2026, RiseLink convened founders, product leaders, and platform partners across the physical AI ecosystem for "The Blueprint for Physical AI: AI-Native Hardware Mixer," an invitation-only gathering designed to foster alignment across the full AI stack.

The event brought together companies spanning AI models, platforms, and device deployment — including MiniMax, Agora, Wyze, Nanit, Luka AI, WowCube, Fuzozo, Dify, and other emerging builders — to exchange lessons on moving AI from cloud-centric architectures into production-ready, intelligent devices.

Conversations centered on how edge intelligence, ultra-low-power connectivity, and system-level design must come together to enable real-world AI experiences, from smart homes and robotics to AI companions and educational devices.

Reflecting on the shift underway, Dr. Pengfei Zhang, CEO of RiseLink Technologies, shared:

"The future of AI is physical. Intelligence must live where interaction happens — inside devices that are always on, power-efficient, and designed with trust at the core. Building that future requires deep collaboration across chips, algorithms, and product teams."

Across discussions, a consistent theme emerged: the next generation of AI products will be defined not by isolated breakthroughs, but by ecosystem-level collaboration — where silicon, algorithms, and applications are co-designed from day one.

From Ecosystem Alignment to a Shipping Product: ChooChoo, an AI Early Education Toy

That ecosystem alignment was made tangible at CES with the introduction of ChooChoo, an AI-powered early education toy that brings together edge intelligence, ultra-low-power connectivity, and conversational AI in a child-friendly device.

Created and introduced by Dr. Diana Zhu, Head of U.S. at RiseLink, ChooChoo is designed to support early language development through interactive reading and dialogue-driven storytelling. By running intelligence closer to the device, ChooChoo enables responsive, always-on interaction while prioritizing privacy, safety, and reliability—attributes that are increasingly critical as AI moves into everyday environments.

ChooChoo serves as a real-world demonstration of how the physical AI stack comes together in practice: AI algorithms optimized for edge deployment, hardware designed for power efficiency, and system-level integration that enables products to move from concept to scalable deployment. More information about ChooChoo is available at https://choochoostudio.com.

Building the Physical AI Ecosystem—Together

Across CES 2026, RiseLink reinforced its role as an ecosystem connector for the physical AI era. The company is actively seeking to collaborate with:

  • Algorithm and AI model companies developing directly on edge chips
  • Smart toy, robotics, and smart home companies bringing AI into everyday environments
  • Solution and platform partners building production-ready systems on RiseLink silicon

By enabling collaboration across silicon, software, and system design, RiseLink aims to help partners move faster from prototype to production—supporting a new generation of intelligent, connected devices designed for life beyond the screen.

To learn more about RiseLink Technologies, visit https://riselink.ai.

Ecosystem partners and collaborators may contact Dr. Diana Zhu at [email protected]. RiseLink development boards and select end products are available for purchase through Digi-Key at https://www.digikey.com/en/supplier-centers/riselink  

SOURCE Riselink

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