DUBLIN, Dec. 08, 2015 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/79nzjf/semiconductor) has announced the addition of the "Semiconductor Packaging and Test Market in China 2015-2019" report to their offering.
- What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be?
- What are the key Market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
Key Topics Covered:
The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis:
- IDM (integrated devices manufacturers)
- Outsourced semiconductor assembly and test (OSAT)
This report forecasts the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019.
According to the report, rapid expansion of semiconductor chip application with growing demands from industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics will drive the market over the forecast period.
Further, the report states that the small life span of the packaging equipment may act as a challenge because the technology used to manufacture semiconductor chips is upgraded constantly and is more optimized.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
- Amkor Technology
- Powertech Technology
- Siliconware Precision Industries (SPIL)
- STATS ChipPAC
- Lingsen Precision
- Tianshui Huatian
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by business type
PART 07: Market drivers
PART 08: Impact of drivers
PART 09: Market challenges
PART 10: Impact of drivers and challenges
PART 11: Market trends
PART 12: Vendor landscape
PART 13: Key vendor analysis
PART 14: Appendix
PART 15: About the Author
For more information visit http://www.researchandmarkets.com/research/79nzjf/semiconductor
Media Contact: Laura Wood , +353-1-481-1716, firstname.lastname@example.org
SOURCE Research and Markets