Sensonor STIM210 - High-precision MEMS Gyro Module Reverse Costing Analysis

DUBLIN, April 9, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/gkn2fm/sensonor_stim210) has announced the addition of the "Sensonor STIM210 - High-precision MEMS Gyro Module Reverse Costing Analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.

With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.

STIM210 applications are typically found within Industrial, Aerospace and Defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.

COMPLETE TEARDOWN WITH:

• Detailed Photos
• BOM Identification
• Precise Measurements
• Material Analysis
• Manufacturing Process Flow
• Supply Chain Evaluation
• Manufacturing Cost Analysis
• Selling Price Estimation

Key Topics Covered:

Glossary

Overview/Introduction

Company Profile

Physical Analysis
- Module
- -Views, Dimensions & Pin-out
-- Opening
- Electronic Board
-- Components Markings
-- Components Identification
-- Bare Dies Connections
- ASICs
-- View, Dimensions & Marking
-- Delayering, Process Identification
-- Cross-Section
- MEMS Gyro
-- View, Dimensions & Marking
-- Bond Pads & Bond Pads Opening
-- MEMS Cap Removed
-- MEMS Sensing Area
-- MEMS Gyro Principle
-- MEMS Cross-Section: Masses
-- MEMS Cross-Section: Electrode
-- MEMS Cross-Section: Buried Connections
-- MEMS Cross-Section: Getter

Manufacturing Process Flow
- Global Overview
- ASICs Front-End Processes & Wafer Fab Units
- MEMS Process Flow & Wafer Fab Unit
- Module Assembly Process Flow & Assembly Unit

Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASICs Cost
-- Front-End Cost
-- Probe Test & Dicing Cost
-- Wafer & Die Cost
- MEMS Gyro Cost
-- Front-End Cost
-- Front-End Cost per process steps
-- Probe Test & Dicing Cost
-- Wafer & Die Cost
-- BOM Cost
- Electronic Board BOM Cost
-- Housing BOM Cost
-- Material Cost Breakdown
- Module Assembly & Test Cost
-- Electronic Board Assembly Cost
-- Housing Assembly Cost
-- Final Test & Calibration Cost
- STIM210 Module Cost & Estimated Price

For more information visit http://www.researchandmarkets.com/research/gkn2fm/sensonor_stim210

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

SOURCE Research and Markets