SiP Technology Market (System in Package) Applications, Packaging and Testing Service Analysis and Forecasts in New 2016 Research Report

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• India - English

PUNE, India, February 29, 2016 /PRNewswire/ --

The Global Trends in SiP Technology Development market research report provides an in-depth market analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.

Complete report on SiP Technology market analyzes 13 major companies and provides data 5 figures is available at http://www.reportsnreports.com/reports/496201-global-trends-in-sip-technology-development.html .

Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology.

List of Topics 

Development of SiP from the industry perspective and includes favourable and detrimental factors. The development of SiP from the perspective of market applications, touching on smartphones, other mobile devices, wearables and IoT. And the development of SiP from the perspective of packaging and testing service providers, IC substrate manufacturers and foundries.

Companies covered: Amkor, Apple, ASE, ChipPAC, Inotera Memories, JCET, Kansu, Nan Ya PCB, SPIL, TAM, TDK, Unimicron, USI. Order a copy of this report at http://www.reportsnreports.com/purchase.aspx?name=496201.

Another related report on packaging market is Global Advanced Packaging Market 2015-2019, The market research analysts predict the global advanced packaging market to grow at a CAGR of close to 8% until 2019. To calculate the market size, analysts have considered revenues generated by global advanced packaging solution providers. The market is segmented according to the technology offered by the major players and on the basis of geography.

The global advanced packaging market can be segmented on the basis of technology type as follows: Active technology, Intelligent technology and Modified atmosphere

The global active technology packaging market is expected to witness strong growth during the forecast period because of factors such as the increasing consumer demand for fresh, safe, healthy, and quality packaged food. Also, the increase in concerns of manufacturers about the shelf life of food and beverages has led to increased demand for active packaging technologies that can extend shelf life. Complete report available at http://www.reportsnreports.com/reports/447835-global-advanced-packaging-market-2015-2019.html.

Leading vendors analyzed in this report are Desiccare, Freshpoint, LINPAC, Maxwell Chase, Multisorb, PakSense and Sealed Air.

Other prominent vendors in this market include Avery Dennison, CVP Systems, EMCO, GEA, Harpak-ULMA, Johnson Matthey, ORICS, Robert Reiser, and Stora Enso.

In terms of revenue, in 2014, the Americas accounted for the major share of the global advanced packaging market. However, the APAC region is expected to witness the fastest growth rate during the forecast period on account of increased demand for advanced packaging solutions in emerging economies of APAC.

Explore other reports on semiconductor and electronics market at http://www.reportsnreports.com/market-research/semiconductor-and-electronics/ .

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