Spansion Launches Industrial-grade e.MMC Memory for Consumer, Communication and Industrial Embedded Systems

SUNNYVALE, Calif., Nov. 10, 2014 /PRNewswire/ -- Spansion Inc. (NYSE: CODE), a global leader in embedded systems, today launched a family of industrial-grade e.MMC NAND memory products for the consumer, communication and industrial equipment markets. Offered in 8GB and 16GB densities and temperature ranges from -40C to +85C, Spansion's e.MMC NAND memory products address a growing demand for reliable, higher density storage in these markets. The new Spansion e.MMC family complements Spansion's leading portfolio of parallel and serial NOR flash memory, and SLC NAND flash memory for embedded applications.

Spansion e.MMC products use high-density MLC NAND that can be configured into modes that allow for higher reliability, better data protection and enhanced data security. The controller, firmware and product assembly is developed for Spansion's quality-sensitive embedded customer base. These products are subjected to stringent qualification and characterization at the NAND, controller and e.MMC module level to meet Spansion's world-class quality requirements.

The Spansion e.MMC S4041-1B1 family supports the JEDEC e.MMC 4.51 command set and also includes support for select e.MMC 5.0 features such as the field firmware update, health self-monitoring and automatic background operations. Spansion's rigorous testing for abrupt power failure allows for high levels of data protection in case of power disruption. The firmware is optimized for efficient performance for embedded use cases, giving the product longer useful life for its targeted customer base.

The S4041-1B1 products can be used with Spansion's Memory Diagnostics Toolkit. The Memory Diagnostics Toolkit is an engineering diagnostics, analytics, configuration and programmer toolkit intended for engineers validating Spansion's memory solutions products for their embedded applications. The toolkit simplifies the configuration and aids in validation of the e.MMC device which can lead to faster memory qualification cycles for customers.

"Embedded systems for industrial/medical, networking and durable consumer applications have stringent requirements and our customers are placing the highest priority on data protection and reliability," stated Touhid Raza, director, Spansion NAND Product Marketing and Business Development. "Like all Spansion products, the S4041-1B1 product family has been developed with those requirements in mind. Standard e.MMC interface and features make it easy to use, but its special features and interactions with the Memory Diagnostics Toolkit make it easier to validate and design in even in the most stringent platforms." 

Availability

Volume productions of Spansion's S4041-1B1 products are available now in 8GB and 16GB densities. Package options include 153 BGA (0.5mm ball pitch) and 100 BGA (1.0mm ball pitch) packages. Temperature options include -25C to +85C and -40C to +85C. Spansion plans to introduce 4GB, 32GB and 64GB densities in the future.

Spansion Resources:

• Spansion e.MMC product brief: http://www.spansion.com/Products/memory/eMMC/Documents/Spansion%20eMMC%20Brief.pdf
• newsroom: http://news.spansion.com 
• Spansion digital magazine, Core & Code: http://core.spansion.com
• Spansion on Twitter: http://www.twitter.com/Spansion
• Spansion on Facebook: http://www.facebook.com/Spansion
• Spansion on YouTube: https://www.youtube.com/user/SpansionInc

About Spansion
Spansion (NYSE: CODE) is a global leader in flash memory-based embedded systems solutions. Spansion's flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people's daily lives. For more information, visit http://www.spansion.com.

Spansion(R), the Spansion logo, and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

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SOURCE Spansion Inc.

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