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Supermicro® anuncia suporte para nova família de produtos Intel® Xeon Phi™ x100
  • USA - English

Completa variedade de soluções SuperServer®, incluindo FatTwin™, fornece a mais ampla seleção de plataformas de computador de alta densidade, para computação de alto desempenho


News provided by

Super Micro Computer, Inc.

Jun 17, 2013, 01:00 ET

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SÃO JOSÉ, Califórnia, 17 de junho 2013 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), uma líder mundial em servidores de alto desempenho e alta eficiência, tecnologia de armazenamento e computação verde, anuncia a maior variedade de soluções de servidores do setor, suportando os novos coprocessadores Xeon Phi da Intel, esta semana em Leipzig, Alemanha, na Conferência Internacional de Supercomputação (ISC, sigla em inglês) 2013. As soluções para computação de alto desempenho (HPC, sigla em inglês) da Supermicro unificam os mais recentes processadores Intel® Xeon® com os coprocessadores Intel Xeon Phi, baseados na arquitetura Many Integrated Core (MIC), da Intel, para dramaticamente acelerarem o desenvolvimento e o desempenho de aplicativos de engenharia, científicos e de pesquisa. As soluções da Supermicro estão disponíveis com SuperBlade® em 0.7U, SuperServer® em 1U, 2U, 3U e SuperBlade® em 7U e 20x MIC de alta densidade ou FatTwin em 4U e 12x MIC, criados para suportarem Xeon Phi, os coprocessadores de altíssimo desempenho da Intel, de 300W. Clusters FatTwin foram instalados com êxito na área, suportando milhares de nós em recentes projetos de HPC. Com as novas soluções Supermicro, baseadas na série de coprocessadores Intel Xeon Phi 3100, 5100 e 7100, a comunidade de HPC terá acesso a mais opções para massiva potência de processamento paralelo com desempenho de dupla precisão.  

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(Foto: http://photos.prnewswire.com/prnh/20130617/AQ32726)

"A presença da Supermicro na comunidade de HPC é forte e cresce com a introdução de nossas novas soluções de servidor, baseadas no coprocessador Intel Xeon Phi", disse Charles Liang, presidente e CEO da Supermicro. "Com o acréscimo da nova série de coprocessadores Intel Xeon Phi, 3100, 5100 e 7100, oferecemos cinco vezes o volume de soluções, dando a nossos clientes o máximo de flexibilidade para criar soluções de HPC otimizadas para as necessidades exatas de seus aplicativos.".

"A Supermicro tem experiência comprovada na adoção de novas tecnologias que aceleram a implantação de sistemas que assistem a aplicativos essenciais de engenharia e pesquisa", disse Rajesh Hazra, vice-presidente e gerente geral do Grupo de Computação Técnica da Intel. "Com as ofertas dos produtos de nossos cinco novos coprocessadores Intel® Xeon Phi™, a Supermicro continua a demonstrar uma capabilidade de fornecer soluções inovadoras e oportunas ao mercado para comunidade de computação de alto desempenho.".

A Supermicro possui as seguintes plataformas de HPC, validadas pelos coprocessadores Intel Xeon Phi 3100, 5100 e 7100 (www.supermicro.com/MIC)

  • SuperBlade® em 0.7U SBI-7127RG-E – 2x cartões MIC, processadores duais da série Intel Xeon E5-2600, memória DDR3 1600MHz ECC de até 256GB, 4x InfiniBand FDR (56Gb) ou 10GbE suportados via cartão mezanino opcional, 1x suporte SSD, até 120x MIC + 120 CPU por SuperRack® em 42U
  • 4x nó hot-plug FatTwin™ em 4U SYS-F627G3-FT+/FTPT+/F73+/F73PT+ – 12x cartões MIC (3x por nó), processadores duais da série Intel Xeon E5-2600 por nó, memória DDR3 1600MHz ECC de até 512GB em16x slots DIMM por nó, HDDs SATA de até 2x hot-swap de 3.5" (-FT+/-FTPT+) ou SAS2 (-F73+/-F73PT+), por nó
  • 4x nó hot-plug FatTwin™ em 4U SYS-F627G2-FT+/FTPT+/F73+/F73PT+ – 12x cartões MIC (3x por nó), processadores duais Intel Xeon E5-2600 por nó, memória DDR3 1600MHz ECC até 512GB em 16x slots DIMM por nó, HDDs SATA de até 6x hot-swap de 2.5" (-FT+/-FTPT+) ou SAS2 (-F73+/-F73PT+), por nó  
  • 3U SYS-6037R-72RFT+ – 2x cartões MIC, processadores duais da série Intel Xeon E5-2600, memória DDR3 1600MHz ECC de até 728GB em 24x slots DIMM, 8x baías de HDD hot-swap 3.5", 2x baías de discos periféricos de 5.25"
  • 2U SYS-2027GR-TRF/TRFT/TSF – 4x cartões MIC, processadores duais da série Intel Xeon E5-2600, memória DDR3 1600MHz ECC de até 256GB, 10x baías de HDD SATA hot-swap 2.5" (4x SATA2, 6x SATA3)
  • 2U SYS-2027GR-TRFH/TRFHT – 6x cartões MIC, série de processadores duais Intel Xeon E5-2600 duais, memória DDR3 1600MHz ECC de até 256GB, 10x baías de HDD SATA hot-swap 2.5" (4x SATA2, 6x SATA3)
  • 1U SYS-1027GR-TRFT/TRF/TSF – 3x cartões MIC, série de processadores duais Intel Xeon E5-2600, memória DDR3 1600MHz ECC de até 256GB, 4x baías de HDD SATA hot-swap 2.5"
  • 1U SYS-1027GR-TRFT+/TRF+ – 2x cartões MIC, série de processadores duais Intel Xeon E5-2600, memória DDR3 1600MHz ECC de até 512GB em 16x slots DIMM, 4x baías de HDD SATA hot-swap 2.5"
  • 1U SYS-1017GR-TF – 2x cartões MIC, processador da série Intel Xeon E5-2600 único, memória DDR3 1600MHz ECC de até 256GB, 6x baías de HDD SATA hot-swap 2.5"
  • 1U SYS-5017GR-TF – 2x cartões MIC, processador da série Intel Xeon E5-2600 único, processor, memória DDR3 1600MHz ECC de até 256GB, 3x baías de HDD SATA hot-swap 3.5"
  • 4U/Torre SYS-7047GR-TPRF – 4x cartões MIC, série de processadores duais Intel Xeon E5-2600 dual, memória DDR3 1600MHz ECC de até 512GB em 16x slots DIMM, 8x baías de HDD SATA hot-swap 3.5", 3x baías de disco periférico de 5.25", 1x baía de disco periférico fixo de 3.5"

Exposição da Supermicro na ISC:

  • Economizador de energia FatTwin™ em 4U (SYS-F617R3-FT) – 8x nós hot-swap, I/O frontal, apresentando consumo de energia 16% mais baixo com uma fonte compartilhada de refrigeração e energia de arquitetura superior e uma fonte extra de alimentação de alta eficiência (94%+), de nível platina, para uma solução avançada termicamente otimizada
  • Twin2 em 2U (SYS-6027TR-HTRF) – 4x nós hot-plug, cada nó suportando 2x processadores Intel Xeon E5-2600, memória 1600MHz ECC de até 256GB, 1x slot de expansão de perfil baixo PCI-E 3.0 (x16), portas GbE duais, 3x baías de HDD SATA3/SATA2, hot-swap 3.5"
  • MicroCloud de 12 nós em 3U (SYS-5038ML-H12TRF) apresentando12x nó independente com capacidade hot swap, cada um suportando CPUs Intel® Xeon® E3-1200 V3 13W-80W, memória de 32GB, HDDs 2x 3.5" ou opcionais 4x 2.5" e expansão MicroLP
  • Double-Sided Storage® de alta densidade em 4U (SSG-6047R-E1R72L) 72 x HDDs com hot swap externo de 3.5", com 2x interno (opcional 2x externo) HDDs fixos de 2.5"

Placas para servidor de alto desempenho

  • Placas-mãe de processador dual (DP) apresentam o suporte da família do processador E5-2600 Intel® Xeon® e uma variedade de aperfeiçoamentos de design, incluindo o suporte para CPUs com TDP de até 150W, memória 1600MHz ECC de até 768GB, fatores de forma WIO orientados à expansão e a solução de slot 11x PCI-E única do mundo.
    • X9DR7-TF+, X9DRW-7TPF+, X9DRH-7TF, X9DR3-LN4F+, X9DAX-7TF, X9DRW-3TF+, X9DRG-QF, X9DRX+-F, X9DRD-EF
  • Placas-mãe de processador único (UP) oferecem recursos cobrindo uma larga variedade de aplicativos de HPC, desde armazenamento 6Gb/s de alto desempenho, capabilidade de overclocking, suporte PCI legado, funcionalidade de administração remota e fatores de forma WIO especiais para opções de expansão flexível. .
    • X10SL7-F, X10SLH-F, X10SAE, X10SAT, C7Z87-OCE suporta o processador Intel® Xeon® E3-1200 V3 e a quarta geração das famílias de processadores Intel® Core™ (anteriormente denominada Haswell)
    • X9SRH-7F, X9SRH-7TF, X9SRW-F, X9SRE-3F, X9SRA suporta o processador Intel® Xeon®, família E5-2600/1600

Visite a Supermicro na Conferência Internacional de Supercomputação (ISC), em Leipzig, Alemanha, de 16 a 20 de junho, no Centro de Convenções de Leipzig (CCL), estande #320, ou para ver a linha completa de soluções de servidores de alto desempenho e alta eficiência e de armazenamento da Supermicro, navegue em www.supermicro.com.

Siga a Supermicro no Facebook e Twitter para receber suas mais recentes notícias e anúncios.

Sobre Super Micro Computer, Inc.

Supermicro® (NASDAQ: SMCI), a inovadora líder em tecnologia de servidor de alta eficiência e alto desempenho é uma provedora de primeira qualidade de servidor avançado Building Block Solution® para, centro de dados, computação em nuvem empresas de TI, Hadoop/Big Data, HPC e sistemas integrados em todo o mundo. A Supermicro está comprometida com a proteção do meio ambiente por meio de sua iniciativa "We Keep IT Green®" e dota consumidores com as soluções mais eficientes de energia, favoráveis ao meio ambiente disponíveis no mercado. 

Supermicro, FatTwin, SuperServer, SuperBlade, Double-Sided Storage, SuperRack, Building Block Solutions e We Keep IT Green são marcas comerciais/ou marcas registradas da Super Micro Computer, Inc.

Todas as outras marcas, nomes e marcas registradas são propriedade de seus respectivos donos.

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