System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical)& Geography - Global Trends & Forecasts 2014 - 2020

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Jun 16, 2014, 10:35 ET

NEW YORK, June 16, 2014 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical)& Geography - Global Trends & Forecasts 2014 - 2020

http://www.reportlinker.com/p02131165/System-in-Package-SIP-Market-by-Technology-2D-25D--3D-by-Type-BGA-SMT-QFP-SOP-Interconnection-Technology-Flip-Chip--Wire-bond-Applications-Communications-Consumer-Automotive-Medical-Geography---Global-Trends--Forecasts-2014---2020.html

The ever-increasing demands for miniaturization and higher functionality at less cost processes have driven the development of stacked ICs and System in Package (SiP) technologies. System in Package (SiP) is a single reduced functional module realized by the horizontal tiling or vertical stacking of two or more similar or dissimilar bare die or packaged chips. Taking the chips nearer enables the highest level of silicon integration and area efficiency at the lowest cost, compared to mounting them separately in traditional ways. In doing so, the electrical pathway length between chips is reduced, leading to a higher performance.

System on Package (SOP) is an emerging trend in the system miniaturization technology in divergence to System-on-Chip (SOC) at IC level and System in Package (SiP) at module level. System in Package (SiP) is obtained by thinning ICs from its original 800 micron thick wafer dimensions to 50 microns and stacking as many as 10 of these, one on top of the other, in 3D form. These are then interconnected by either wire bond or flip-chip technology. The current Through Silicon via (TSV) developments have further condensed System in Package (SiP) by replacing flip chip with pad to pad bonding.

The capability to integrate different technologies and to reduce total production cost and time to market are the prime drivers for System in Package (SiP) packaging. System in Package (SiP) has enabled the rapid integration of active and passive devices into single package solutions. This approach has also reduced product costs, allowing systems to be partitioned into the most cost-effective blocks. The stacked System in Package (SiP) alignments reduce the system size and eliminate the cost of individual packages for each die. They also improve signal transmission times and reduced power by minimizing capacitive loads between ICs.

The rapid expansion of the System in Package (SiP) market has inspired research and development in System in Package (SiP) associated technology by Integrated Device Manufacturers (IDM) as well as Electronic Manufacturing Services (EMS) providers and Semiconductor Assembly Services (SAS). With this evolution of System in Package (SiP) technology during the last few decades, the future trend for System in Package (SiP) technology in the next decade or two will be clearer if we look at the future electronics market sectors such as mobile products, high-end computers, automobiles, flat-panel High-Definition TVs (HDTVs), and sensors for security, health care, and environment. The consumer mobile products will advance to more multi functionality, thus, realizing the digital convergent dream with flexible displays with LED as a light source, thin film, or nano batteries.

Some of the key players in this market include Amkor Technology (U.S.), ASE Global (Taiwan), Powertech Technology (Taiwan), STATS ChipPAC (Singapore), ChipMOS Technologies (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), InsightSiP (France), Freescale Semiconductor Inc. (U.S.), Wi2Wi Inc.(U.S.), and Nanium S.A. (Portugal), among others.

Table of Contents

1 Introduction (Page No. - 21)
1.1 Key Objectives
1.2 Report Description
1.3 Markets Covered
1.4 Stakeholders
1.5 Research Methodology
1.5.1 Market Size Estimation
1.5.2 Market Crackdown &Data Triangulation
1.5.3 Key Points Taken From Secondary Sources
1.5.4 Key Points Taken From Primary Sources
1.5.5 List of Companies Covered During Study
1.6 Report Assumptions

2 Executive Summary (Page No. - 35)

3 Market Overview (Page No. - 39)
3.1 Introduction
3.2 History & Evolution of SIP
3.2.1 Soc (System on Chip)
3.2.2 Mcm (Multi Chip Module)
3.2.3 SIP (System in Package)
3.2.4 Soc Vs. SIP
3.3 Emerging Trends
3.3.1 System on Package (SOP)
3.3.2 Photonics Convergence for Interchip Interconnects

4 Market Analysis (Page No. - 49)
4.1 Introduction
4.2 System in Package (SIP) Industry Value Chain Analysis
4.3 Market Dynamics
4.3.1 Introduction
4.3.2 Market Drivers
4.3.2.1 Increasing Demand for Miniaturized & High Performance Electronic Devices
4.3.2.2 Strong Penetration in Consumer Electronics Sector to Drive the SIP Market
4.3.2.3 Faster Time-to-Market and Lower Development Costs Acts As An Attractive Prospect for the Electronic Manufacturers
4.3.3 Market Restraints
4.3.3.1 'Known Good Die'– Big Challenge for SIP (System in Package)
4.3.3.2 Reliability Challenges
4.3.4 Opportunity
4.3.4.1 Rapid Adoption of Smartphone & Tablets in Emerging Countries
4.4 Burning Issue
4.4.1 Lack of Industry Infrastructure
4.5 Winning Imperative
4.5.1 Need of thermal Management for Packaged Chips
4.6 Porter's Five forces Model
4.6.1 Degree of Competition
4.6.2 Bargaining Power of Buyers
4.6.3 Bargaining Power of Suppliers
4.6.4 Threat From Substitutes
4.6.5 Threat From New Entrants

5 Global System in Package (SIP) Market Segmentation (Page No. - 69)
5.1 Introduction
5.2 System in Package (SIP) – By Packaging Technology
5.2.1 2D Ic Packaging Technology
5.2.2 2.5D Ic Packaging Technology
5.2.2.1 Major Benefits of 2.5D Ic Packaging Over the Traditional 2D Packaging Practices
5.2.3 3D Ic Packaging Technology
5.2.4 2D Vs. 2.5D Vs. 3D Ic Packaging Technology
5.3 System in Package (SIP) – By Packaging Type
5.3.1 Ball Grid Array
5.3.1.1 Pbga (Plastic Ball Grid Array)
5.3.1.2 Sbga (Super Ball Grid Array)
5.3.1.3 Fbga (Fine Pitch Ball Grid Array)
5.3.1.4 Fcbga (Flip Chip Ball Grid Array)
5.3.1.5 Others
5.3.2 Surface Mount Package
5.3.2.1 Lga (Land Grid Array)
5.3.2.2 Ccga (Ceramic Column Grid Array)
5.3.2.3 Others
5.3.3 Pin Grid Array (Pga)
5.3.3.1 Flip Chip Pin Grid Array (FCPGA)
5.3.3.2 Ceramic Pin Grid Array (CPGA)
5.3.3.3 Others
5.3.4 Flat Packages
5.3.4.1 Qfn (Quad Flat No-Leads)
5.3.4.2 Utqfn (Ultra Thin Quad Flat No-Leads)
5.3.4.3 Others
5.3.5 Small Outline Package
5.3.5.1 Tsop(Thin Small Outline Package)
5.3.5.2 Tssop (Thin Shrink Small Outline Package)
5.3.5.3 Others
5.4 System in Package (SIP) – By interconnection Technology
5.4.1 Wire Bond Technology
5.4.2 Flip Chip Technology
5.4.2.1 Advantages of Flip Chip Technology Over the Traditional Interconnection Technology:
5.4.3 Others

6 Market By Application (Page No. - 106)
6.1 Introduction
6.2 Consumer Electronics Sector
6.2.1 Smartphone & Tablets
6.2.2 Portable Media Players
6.2.3 Set-top Boxes & Digital Tvs
6.2.4 Dvd & Blu-Ray Players
6.2.5 Others
6.3 Communications Sector
6.3.1 Network Processors
6.3.2 Wireless Communication Equipment
6.3.3 Others
6.4 Automotive & Transportation Sector
6.4.1 Automotive Radar
6.4.2 Automotive Smart Sensors
6.4.3 Automotive Local Interconnect Network (LIN)
6.4.4 Others
6.5 Industrial Sector
6.5.1 Industrial Wireless Sensor Networks (IWSN)
6.5.2 Industrial Automation Devices
6.5.3 Others
6.6 Military, Defense & Aerospace (MDA) Sector
6.6.1 Radar Equipment
6.6.2 Satellite Communication Devices
6.6.3 Others
6.7 Medical Sector
6.7.1 Patient Monitoring Devices
6.7.2 Medical Smart Sensor System
6.7.3 Others
6.8 Emerging & Other Applications Sector

7 Market By Geography (Page No. - 146)
7.1 Introduction
7.2 North America
7.2.1 U.S.
7.2.2 Canada
7.3 APAC
7.3.1 Japan
7.3.2 Taiwan
7.3.3 China
7.3.4 Others
7.4 Europe
7.4.1 U.K.
7.4.2 Germany
7.4.3 France
7.4.4 Others
7.5 Rest of The World
7.5.1 Middle East
7.5.2 Russia
7.5.3 Others

8 Competitive Landscape (Page No. - 172)
8.1 Overview
8.2 Competitive Analysis
8.2.1 Market Share Ranking Analysis
8.3 Competitive Situation &Trends
8.3.1 New Product Launch, New Product Development&Expansion
8.3.2 Agreements, Partnerships, Joint Ventures, & Collaborations
8.3.3 Mergers &Acquisitions
8.3.4 Other Developments

9 Company Profiles (Overview, Products and Services, Financials, Strategy & Development)* (Page No. - 191)
9.1 Amkor Technology Inc.
9.2 ASE Inc.
9.3 Chipmos Tech. Inc.
9.4 Chipbond Technology Corporation
9.5 Fujitsu Ltd.
9.6 GS Nanotech
9.7 Insight SIP
9.8 Jiangsu Changjiang Electronics Technology Co. Ltd.
9.9 Nanium S.A.
9.10 Powertech Technologies Inc.
9.11 Qualcomm Incorporated
9.12 Siliconware Precision Industries Co., Ltd.
9.13 Stats Chippac Ltd.
9.14 Toshiba Corporation
9.15 WI2WI Corporation

*Details on Overview, Products and Services, Financials, Strategy & Development Might Not Be Capturedin Case of Unlisted Companies.

List Of Tables

Table 1 Report Assumptions
Table 2 Soc Vs. SIP: By Techinical Aspects
Table 3 Soc Vs. SIP: By Financial Aspect
Table 4 System in Package (SIP) VS. System on Package (Sop)
Table 5 Global SIP Market Size, 2013 – 2020, By Value ($Billion) & By Volume (Billion Units)
Table 6 Global SIP Market Size (Value), By Packaging Technology, 2013 – 2020, ($Million)
Table 7 Global SIP Market Size (Volume), By Packaging Technology, 2013 – 2020, (Million Units)
Table 8 2D Vs. 2.5D VS. 3D Ic Packaging
Table 9 Global System in Package (SIP) Market Size (Value), By Packaging Type, 2013 – 2020 ($Million)
Table 10 Global SIP Market Size (Volume), By Packaging Type, 2013 – 2020 (Million Units)
Table 11 Global SIP Market Size (Value), By Bga Package Type, 2013 – 2020, ($Million)
Table 12 Global SIP Market Size (Volume), By Bga Package Type, 2013 – 2020 (Million Units)
Table 13 Global SIP Market Size (Value), By Surface Mount Package Type, 2013 – 2020 ($Million)
Table 14 Global SIP Market Size (Volume), By Surface Mount Package Type, 2013 – 2020 (Million Units)
Table 15 Global SIP Market Size (Value), By Pga Package Type, 2013 – 2020 ($Million)
Table 16 Global SIP Market Size (Volume), By Pga Package Type, 2013 – 2020 (Million Units)
Table 17 Global SIP Market Size (Value), By Flat Packages, 2013 – 2020 ($Million)
Table 18 Global SIP Market Size (Volume), By Flat Packages, 2013 – 2020 (Million Units)
Table 19 Global SIP Market Size (Value), By Sop Package Type, 2013 – 2020 ($Million)
Table 20 Global SIP Market Size (Volume), By Sop Package Type, 2013 – 2020 (Million Units)
Table 21 Global SIP Market Size (Value), By Interconnection Technology, 2013 – 2020 ($Million)
Table 22 Global SIP Market Size (Volume), By Interconnection Technology, 2013 – 2020 (Million Units)
Table 23 Global SIP Market Size (Value), By Applications, 2013 – 2020 ($Million)
Table 24 Global SIP Market Size (Volume), By Applications, 2013 – 2020 (Million Units)
Table 25 Global Market Size (Value), By Consumer Electronics Sector, 2013 – 2020 ($Million)
Table 26 Global Market Size (Volume), By Consumer Electronics Sector, 2013 – 2020 (Million Units)
Table 27 Consumer Electronics Sector Market Size (Value), By Geography, 2013 – 2020 ($Million)
Table 28 Consumer Electronics Sector Market Size (Volume), By Geography, 2013 – 2020 (Million Units)
Table 29 Global System in Package (SIP) Market Size (Value), By Communications Sector, 2013 – 2020 ($Million)
Table 30 Global Market Size (Volume), By Communications Sector, 2013 – 2020 (Million Units)
Table 31 Communications Sector Market Size (Value), By Geography, 2013 – 2020 ($Million)
Table 32 Communications Sector Market Size (Volume), By Geography, 2013 – 2020 (Million Units)
Table 33 Global System in Package (SIP) Market Size (Value), By Automotive & Transportation Sector, 2013 – 2020 ($Million)
Table 34 Global Market Size (Volume), By Automotive &Transportation Sector, 2013 – 2020 (Million Units)
Table 35 Automotive & Transportation Sector Market Size (Value), By Geography, 2013 – 2020 ($Million)
Table 36 Automotive & Transportation Sector Market Size (Volume), By Geography, 2013 – 2020 (Million Units)
Table 37 Global System in Package (SIP) Market Size (Value), By Industrial Sector, 2013 – 2020 ($Million)
Table 38 Global Market Size (Volume), By Industrial Sector, 2013 – 2020 (Million Units)
Table 39 Industrial Sector Market Size (Value), By Geography, 2013 – 2020 ($Million)
Table 40 Industrial Sector Market Size (Volume), By Geography, 2013 – 2020 (Million Units)
Table 41 Global System in Package (SIP) Market Size (Value), By MDA Sector, 2013 – 2020 ($Million)
Table 42 Global Market Size (Volume), By MDA Sector, 2013 – 2020 (Million Units)
Table 43 MDA Sector Market Size (Value), By Geography, 2013 – 2020 ($Million)
Table 44 MDA Sector Market Size (Volume), By Geography, 2013 – 2020 (Million Units)
Table 45 Global Market Size (Value), By Medical Sector, 2013 – 2020 ($Million)
Table 46 Global Market Size (Volume), By Medical Sector, 2013 – 2020 (Million Units)
Table 47 Medical Sector Market Size (Value), By Geography, 2013 – 2020 ($Million)
Table 48 Medical Sector Market Size (Volume), By Geography, 2013 – 2020 (Million Units)
Table 49 Emerging & Others Sector Market Size (Value), By Geography, 2013 – 2020 ($Million)
Table 50 Emerging & Others Sector Market Size (Volume), By Geography, 2013 – 2020 (Million Units)
Table 51 System in Package (SIP) Market Size (Value), By Geography, 2013 – 2020 ($Million)
Table 52 Market Size (Volume), By Geography, 2013 – 2020 (Million Units)
Table 53 North America: System in Package (SIP) Market Size (Value), By Country, 2013 – 2020 ($Million)
Table 54 North America: Market Size (Volume), By Country, 2013 – 2020 (Million Units)
Table 55 North America: Market Size (Value), By Application, 2013 – 2020 ($Million)
Table 56 North America: Market Size (Volume), By Application, 2013 – 2020 (Million Units)
Table 57 APAC: System in Package (SIP) Market Size (Value), By Country, 2013 – 2020 ($Million)
Table 58 APAC: Market Size (Volume), By Country, 2013 – 2020 (Million Units)
Table 59 APAC: Market Size (Value), By Application, 2013 – 2020 ($Million)
Table 60 APAC: Market Size (Volume), By Application, 2013 – 2020 (Million Units)
Table 61 Europe: System in Package (SIP) Market Size (Value), By Country, 2013 – 2020 ($Million)
Table 62 Europe: Market Size (Volume), By Country, 2013 – 2020 (Million Units)
Table 63 Europe: Market Size (Value), By Application, 2013 – 2020 ($Million)
Table 64 Europe: Market Size (Volume) Market Size (Volume), By Application, 2013 – 2020 (Million Units)
Table 65 ROW: System in Package (SIP) Market Size (Value), By Country, 2013 – 2020 ($Million)
Table 66 ROW: Market Size (Volume) Market Size (Volume), By Country, 2013 – 2020 (Million Units)
Table 67 ROW: Market Size (Value), By Application, 2013 – 2020 ($Million)
Table 68 ROW: Market Size (Volume) Market Size (Volume), By Application, 2013 – 2020 (Million Units)
Table 69 Market Ranking Analysis, By Key Player
Table 70 System in Package (SIP) Market:New Product Launches, New Product Development & Expansion, 2010-2014
Table 71 Market: Agreements, Partnerships, Joint Ventures, & Collaborations, 2010-2014
Table 72 Market: Mergers & Acquisitions, 2011-2013
Table 73 Market: Other Developments, 2010 – 2014
Table 74 GS Nanotech: Company Snapshot
Table 75 Insight SIP: Company Snapshot
Table 76 Nanium: Company Snapshot

List Of Figures

Figure 1 Markets Covered for Analysis
Figure 2 Research Methodology
Figure 3 Market Size Estimation
Figure 4 Data Triangulation Methodology
Figure 5 System in Package (SIP) Market Size (Value), By Application, 2013 – 2020 ($Million)
Figure 6 Market Overview
Figure 7 History & Evolution
Figure 8 System in Package (SIP) Industry Value Chain
Figure 9 SIP Market: Impact Analysis of Market Drivers, 2013 – 2020
Figure 10 SIP Market: Impact Analysis of Market Restraints, 2013 – 2020
Figure 11 SIP Market: Impact Analysis of the Market Opportunities, 2013 – 2020
Figure 12 Porter's Analysis for System in Package (SIP) Market
Figure 13 Degree of Competition
Figure 14 Bargaining Power of the Buyers
Figure 15 Bargaining Power of the Suppliers
Figure 16 Threat From Substitutes
Figure 17 Threat From New Entrants
Figure 18 System in Package (SIP): Market Segmentation
Figure 19 Global System in Package (SIP) Market, By Packaging Technology, 2013 Vs. 2020 (%)
Figure 20 Illustration of 2D Ic Packaging Technology
Figure 21 Illustration of 2.5D Ic Packaging Technology
Figure 22 Illustration of 3D Ic Packaging Technology
Figure 23 Global System in Package (SIP) Market, By Packaging Type, 2013 Vs. 2020 (%)
Figure 24 Global SIP Market, By interconnection Technology, 2013 Vs. 2020 (%)
Figure 25 System in Package (SIP): Application Market
Figure 26 System in Package (SIP) Market Segmentation, By Geography
Figure 27 Key Growth Strategies, 2013
Figure 28 Amkor Technology Inc.: Company Snapshot
Figure 29 Amkor Technology Inc.: Product Portfolio
Figure 30 Amkor Technology: SWOT Analysis
Figure 31 ASE Inc.: Company Snapshot
Figure 32 ASE Global Inc.: Services
Figure 33 ASE Inc.: SWOT Analysis
Figure 34 Chipmos Tech. Inc.: Company Snapshot
Figure 35 Chipmos Tech. Inc.: Services
Figure 36 Chipbond Technology Corporation: Company Snapshot
Figure 37 Chipbond Technology Corporation: Services
Figure 38 Fujitsu Ltd: Company Snapshot
Figure 39 Fujitsu Ltd: Product Portfolio
Figure 40 GS Nanotech: Services
Figure 41 Insight SIP: Services
Figure 42 Jiangsu Changjiang Electronics Technology Co. Ltd.: Company Snapshot
Figure 43 Jiangsu Changjiang Electronics Technology Co. Ltd.: Product Portfolio
Figure 44 Nanium: Services
Figure 45 Powertech Technology Inc.: Company Snapshot
Figure 46 Powertech Technology Inc.: Product Portfolio
Figure 47 Qualcomm Incorporated: Company Snapshot
Figure 48 Qualcomm Incorporated: Product Classification
Figure 49 Qualcomm Incorporated: SWOT Analysis
Figure 50 Siliconware Precision Industries Co., Ltd.: Company Snapshot
Figure 51 Siliconware Precision Industries Co., Ltd.: Product and Services
Figure 52 Siliconware Precision Industries Co., Ltd.: SWOT Analysis
Figure 53 Stats Chippac Ltd.: Company Snapshot
Figure 54 Stats Chippac Ltd.: Services
Figure 55 Toshiba Corporation: Company Snapshot
Figure 56 Toshiba Corporation: Product Portfolio
Figure 57 Toshiba Corporation: SWOT Analysis
Figure 58 WI2WI Corporation: Company Snapshot
Figure 59 WI2WI Corporation: Product Portfolio