Team Led by Microsemi Wins European Commission's Innovation Award Competition for FP7 Projects

Company and its Collaborators on Research Project SOI-HITS Presented with Inaugural Award

Dec 17, 2015, 07:00 ET from Microsemi Corporation

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ALISO VIEJO, Calif., Dec. 17, 2015 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the company and its collaborators are the first recipients of the European Commission's Innovation Award Competition for their Smart Silicon-on-Insulator Sensing Systems Operating at High Temperature (SOI-HITS) FP7 research project. The organization's Innovation Award Competition is open to teams involved with FP7 projects from the area of "micro/nano electronics" or "smart system integration" that demonstrate significant importance for the European economy and the EU citizens.

SOI-HITS, which met the award criteria as a single innovation developed in an EU-funded project, was bestowed the Innovation Award by the EU Project Monitoring Officers. Led by Microsemi, SOI-HITS was a collaborative project involving several industry-leading institutions, including Cambridge CMOS Sensors, Cissoid, Honeywell, IREC, University of Cambridge, Université Catholique de Louvain and The University of Warwick.

"This prestigious award from the European Commission demonstrates Microsemi's success in innovative research, and showcases our expertise in building and factory automation thanks to the assistance of our talented collaborators," said Roger Holliday, senior vice president and general manager at Microsemi. "SOI-HITS is a game changer for emissions control, as this ambitious, innovative and timely project will enable significant energy consumption savings and reduce waste in processes."

The award-winning SOI-HITS research project focuses on the reduction of both energy consumption and waste gas emissions by moving the control sensing elements into the harsh areas not normally accessible to conventional electronics, increasing the number of sensors available for control. The project features multiple sensing devices packaged into one part, and a device able to operate at much higher temperatures than normal silicon devices (to 225 degrees Celsius). SOI-HITS also features alternative measurement methods, alternative packaging options and reduced running costs, and builds on Microsemi's expertise in package miniaturization. To learn more, visit  

"This is the first time we decided to provide such an award and we are delighted with the high quality applications we received. It was not easy to choose the winner, as the competition was really tough and many applications raised the enthusiasm of the selection committee," said Willy Van Puymbroeck, Head of Unit in Components at the European Commission's DG Connect.

The Microsemi-led team was recognized on Dec. 1 at the European Nanoelectronics Forum located at the Maritim Hotel in Berlin. A trophy was presented to Microsemi at the event by Van Puymbroeck, which the company accepted on behalf of the consortium. For more information about the SOI-HITS research project, visit  

About Microsemi Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif, and has approximately 3,600 employees globally. Learn more at

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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements to Microsemi announcing the company and its collaborators are the first recipients of the European Commission's Innovation Award Competition for their Smart Silicon-on-Insulator Sensing Systems Operating at High Temperature (SOI-HITS) FP7 research project, and the potential effect of the foregoing on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

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