DUBLIN, April 30, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/fhhfv8/the) have announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" report to their offering.
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Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game changers for the industry. It is the package of the integrated circuit (IC) which holds the footprint to the printed circuit board (PCB), and thus it is the IC package which has enabled the multitude of small, handheld electronics to be invented and proliferate in today's world.
It is not just small size, but the added performance with high speed, more functionality, and the ability for handheld electronics to communicate via the Internet so that anyone with a smart phone or tablet has a wealth of information at their fingertips.
The costs per transistor is now going up with advancing technology nodes of 22nm and 14nm (see figure below), when traditionally the cost goes down. Increasingly the backend, or IC packaging, is being looked at a meeting the needs of tomorrow's technology demands rather than the front end manufacturing.
Chapter 3, Stacked Packages, explains the basics of this critical packaging technology, along with coverage of the latest products. Forecasts include units, prices, packaging revenue, package types, device types, first-level interconnection, and applications.
Chapter 4: Through Silicon Vias, 3-D and 2.5-D Integration is covered in depth, including 2.5-D interposer technology, with coverage of the latest new products and processes. Unit projections of both
2.5-D and 3-D are forecast, as are the identified potential markets for these technologies and their sizes, and 2.5-D interposer technology.
Chapter 5: System in Package (SiP) Solutions presents this package solution which combines an IC and passive devices in a single functional block, with a JEDEC footprint. New product introductions are presented. Forecasts include units, prices, packaging revenue, device types, interconnection, and applications.
Key Topics Covered:
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: Stacked Packages
Chapter 4: Through Vias, 3-D and 2.5-D Integration
Chapter 5: System in Package
- 3D Glass Solutions
- APSTL, llc
- Auburn University
- Cisco, Inc. and Amkor Technology
- Corning, Inc. Dow Chemical
- EV Group
- Fraunhofer Institute for Reliability and Microintegration
- Fujikura Ltd. and FlipChip International, LLC
- Innovative Micro Technology
- Kyocera America
- Nanyang Technology University
- Sandia National Laboratories
- SET North America and RTI International CMET
- Shinko Electric Industries
- STATS ChipPAC Ltd.
- SUNY College, College of Nanoscale Science and Engineering
- SUSS MicroTec
- Texas Instruments
- Tohoku University
- Triton Micro Technologies, Inc. and nMode Solutions
- Unimicron Technology Corporation and ITRI
For more information visit http://www.researchandmarkets.com/research/fhhfv8/the
Media Contact: Laura Wood, +353-1-481-1716, [email protected]
SOURCE Research and Markets