The Worldwide IC Packaging Market, 2018 Edition - Topics include: Worldwide Electronics Industry, Semiconductor Device & IC Packaging Market Analysis, OSAT Market & Strategy Analysis
DUBLIN, July 11, 2018 /PRNewswire/ --
The "The Worldwide IC Packaging Market 2018 Edition" report has been added to ResearchAndMarkets.com's offering.
The Worldwide IC Packaging Market, 2018 Edition, examines the global marketplace of integrated circuits (ICs) and the many packaging designs developed for ICs. This comprehensive report presents a detailed analysis of a vast and vibrant market that exceeded $358 billion in 2017.
The nearly 500-page report provides insightful analysis of major market trends affecting the semiconductor industry and presents dozens of tables and figures quantifying both the semiconductor device and IC packaging markets.
The report provides extensive and detailed quantitative analysis with forecasts for unit shipments, revenues and package pricing for 31 separate semiconductor device types as well as 14 major packaging categories comprising 44 IC packaging market segments.
Virtually every table presents two years of historical data for 2016 and 2017, and five-year forecasts from 2018 through 2022. In addition, numerous graphical figures provide an alternative perspective for understanding the underlying data.
The report is arranged into seven chapters focused on four major topics of discussion. Following an Introductory chapter (Chapter 1) and an Executive Summary (Chapter 2).
Chapter 3, "Worldwide Electronics Industry Outlook," examines broad economic trends and the global electronics industry, specifically looking at products that are helping drive the expanding demand for semiconductors and IC packaging technologies. Markets covered include communications products, computers and peripherals, and consumer products, as well as products for industrial, medical, automotive and commercial aviation and defense sectors.
In Chapter 4, "Semiconductor Device Market Analysis," the report analyzes each semiconductor device type with forecasts provided for unit shipments and revenues presented in terms of function, packaging types, applications and major world regions.
Chapter 5, "IC Packaging Market Analysis," examines the IC packaging market in terms of unit shipments, revenues and package pricing for each packaging market segment in terms of semiconductor device type and I/O count. The chapter also provides a short overview of advanced packaging products adapted from the researcher's companion report Advanced IC Packaging Technologies, Materials and Markets, 2017 Edition.
Chapter 6, "OSAT Market and Strategy Analysis," focuses on the outsourced semiconductor assembly and test (OSAT) company market segment, vendors who specialize in providing IC packaging and testing services to other companies in the industry. Consisting of more than 100 companies worldwide, the OSAT market segment accounts for a significant and growing sector of the semiconductor market. The report looks not only at the size of the OSAT market, but discusses the various strategies for success shared by the leading competitors.
Finally, Chapter 7, "OSAT Company Profiles," presents concise profiles of 40 OSAT companies, providing a cross-section of both large and small competitors. Each profile includes an overview of the company, as well as details of their IC packaging product lines.
Report Highlights
Industry Overview
- Economic Overview
- Semiconductor Industry Analysis
Worldwide Semiconductor Device Market Forecasts, 2016-2022
- By Unit Shipments and Revenues
- By Packaging Type
- By Application
- By Major World Region
Worldwide IC Packaging Market Forecasts, 2016-2022
- By Unit Shipments, Revenues and ASP
- By Semiconductor Product
- By I/O Range
OSAT IC Packaging Market Forecasts, 2016-2022
- IC Packaging Type by Unit Shipments, Revenues and ASP
- Competitive Rankings
- Company Profiles
Key Topics Covered
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: Worldwide Electronics Industry
- Outlook
- Global Economic Outlook
- Recent Economic Trends
- World GDP
- Impact on Semiconductor Market
- Trends to Watch in 2018 and Beyond
- Global Electronics Market
- Communications Markets, including: Cellular Handsets, LANs, DSL & Cable Modems, Carrier-class Equipment
- Computers Markets, including: PCs, Tablets, Servers, Storage Systems, Monitors, Printers
- Consumer Markets, including: TVs, Settop Boxes, Digital Cameras, Personal Navigation Devices
- Industrial Markets, including: ProcessControl, Test & Measurements, Other Industrial
- Medical Markets, including: Medical Diagnostics, Therapeutic, Monitoring & Surgical
- Automotive Markets
- Commercial Aviation, Defense and Other Transportation Markets
Chapter 4: Semiconductor Device Market Analysis
- Worldwide Semiconductor Device Market
- Total Market Forecasts
- IC Application Forecasts
- Regional Market Trends
- Covers: Consumer, Transportation, Computer Communications, Industrial & Other
- IC Market Forecasts by Major World Regions
- Market Forecasts by Device Type
- Transistors
- Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
- Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM
- Logic Devices: Digital Bipolar, Standard Logic, Gate Arrays, Standard Cell & PLDs, Display Drivers & Touch Screen Controllers, Special Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose & Other)
- Analog Devices: Amplifiers & Comparators, Interfaces, Voltage Regulators & References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial & Other)
Chapter 5: IC Packaging Market Analysis
- Overview
- IC Package Families
- Worldwide IC Packaging Market
- Total IC Packaging Market Forecasts
- IC Packaging Market by I/O Count
- Package Pricing Trends
- IC Package Families Forecasts
- Dual In-Line Package Markets (DIP)
- Transistor Outline Package Markets (TO)
- Small Outline Transistor Package Market (SOT)
- Small Outline IC Markets (SOIC)
- Thin Small Outline Package Markets (TSOP)
- Chip Carrier Markets (CC)
- Quad Flat Pack Markets (QFP)
- Dual Flat Pack No Lead Markets (DFN)
- Quad Flat Pack No Lead Markets (QFN)
- Pin Grid Array Package Markets (PGA)
- Ball Grid Array Package Markets (BGA)
- Fine-Pitch Ball Grid Array Package Markets (FBGA)
- Wafer-Level Packaging Markets (WLP)
- Direct Chip Attached Markets (DCA)
- Advanced IC Packaging
- Multichip Packages
- Fan-Out Wafer-Level Package (FOWLP)
- Multirow QFN Packages
- Flip Chip Interconnection
- Through-Silicon Via Interconnect Solutions
Chapter 6: OSAT Market and Strategy Analysis
- Outsourcing in the Semiconductor Market OSAT Market Forecasts, including: Unit Shipments, Revenues, Package ASP
Chapter 7: OSAT Company Profiles
- 3D Plus
- Advotech
- AIC Semiconductor
- Amkor Technology
- ANST China
- ASE
- Azimuth
- Carsem
- Chant World Technology
- China Wafer Level CSP
- ChipMOS
- Cirtek
- CONNECTEC Japan
- Chapter 7 OSAT Company Profiles
- CORWIL Technology
- Deca Technologies
- FlipChip Int'l
- Greatek Electronics
- Hana Microelectronics
- HANA Micron
- Interconnect Systems
- J-Devices
- Jiangsu Changjiang Electronics
- Lingsen Precision Industries
- nepes Corp.
- OSE
- Palomar Technologies
- Powertech Technology
- Shinko Electric
- Signetics
- Sigurd Microelectronics
- SPiL
- SPEL Semiconductor
- STATS ChipPAC
- Tera Probe
- Tianshui Huati an Tech
- TongFu Microelectronics
- Unisem
- UTAC
- Walton Advanced Engineering
- Xintec
For more information about this report visit https://www.researchandmarkets.com/research/jbmpgf/the_worldwide_ic?w=5
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