Thin Wafers, Temporary Bonding Equipment & Materials Market
NEW YORK, Oct. 8, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
Thin Wafers, Temporary Bonding Equipment & Materials Market
http://www.reportlinker.com/p01008833/Thin-Wafers-Temporary-Bonding-Equipment--Materials-Market.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor
WITH ALMOST ¾ OF THE TOTAL NUMBER OF WAFERS EXPECTED TO BE THINNED BY 2017, TEMPORARY BONDING MARKET WILL INCREASE IN THE COMING YEARS
This Yole Développement report describes why thinner wafers will be needed in the future, especially for consumer applications. Indeed, consumer electronics is a big driver for smaller, higher-performing, lower-cost device configurations for use in various applications, such as memory and wireless devices. These new configurations, in turn, are pushing demand for thin (< 100 µm) and even ultra-thin semiconductor wafers (below 40µm) with the following benefits:-Reduced thickness and thus thinner packages (in cell phones, packaged dies must be < 1.2mm thick; this number shrinks to1mm for smart phones)-Wafer thinning is the most efficient approach used for heat dissipation in thermal management-For 3D integration, thin wafers bring higher through Si vias density, as pitch and dimensions are becoming smaller
However, as wafer thickness decreases to 100µm and below, manufacturing challenges arise. Ultra-thin wafers are less stable and more vulnerable to stress, and the die can be prone to breaking and warping—not only during grinding but also during subsequent processing steps. Yole Développement's report describes why special thin wafer handling processes (i.e. temporary bonding) are necessary, especially when wafers are dual-side processed or have high topographies.
This report deals not only with the thin wafers market and applications, but also with related processes, equipment, and materials for temporary bonding.
Thin wafer shipment forecasts are analyzed, as there is definitely a growing need for thin wafers (below 100 µm) for numerous applications: 3D ICs, MEMS, CMOS Image Sensors, Power Devices, LEDs, RF Devices, Memory & Logic, Interposers and Photovoltaic. The report shows that, by 2017, the ratio of THIN wafers vs. TOTAL number of wafers (in 300 mm eq.) will be 74%, corresponding to > 80M 12'' eq. wafers.Applications are also described in the report. The 2012 market drivers for thin wafers are 3D ICs, and also Power Devices and CIS BSI for ultra-thin wafers. Indeed, the BSI application is the big driver for ultra thin wafers; this application is currently booming. 2011 was a big year for 300 mm wafer bonding tools, thanks to BSI. This application requires ultra thin layers (< 10µ) on 12''.
Forecasts by wafer thickness are analyzed in the report. In 2017, most of the 12'' wafers will be 200µm thick for logic application; also, most of the thinned wafers will be in the 10-99µ thickness range. This includes memory, as well as interposers and power device applications.
CURRENTLY LOW IN VALUE, THE TEMPORARY BONDING EQUIPMENT MARKET WILL REACH US$250M BY 2017Yole Développement's report provides a temporary wafer bonding equipment forecast which shows that 10% of the total thin wafer shipment will experience a temporary bonding step by 2017. So, while temporary bonding equipment is still a small market today, it is expected to grow as the need for thin wafer handling grows. In fact, we estimate the market for temporary bonding tools to be more than $250M by 2017. Currently, shipped bonder/debonders are for Power and 3D ICs applications. However, we believe 3D ICs will become the predominant application for temporary bonders > 2015.
Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the "Magic" material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times, though this is not yet the case today.
WHAT'S NEW COMPARED TO THE 2011 REPORT?Updated thin wafers forecast 2011-2017
By application
By thickness
By wafer size
Updated players
New chapter on Power MOSFETs
Why thin wafers for power
Players
Roadmap
New chapter on Photovoltaic
Why thin wafers for PV
Players
Roadmap
New chapter on temporary bonding
Players
Technologies
Applications
Challenges
Equipment forecast 2011-2017
In units
In US$
By application
Temporary chemistry forecast 2011-2017
OBJECTIVES OF THE REPORTOverview of thin wafers applications: MEMS, CMOS Image Sensors, Memory, Power Devices, RF Devices, LEDs, Interposers, Photovoltaics
Thin wafers roadmap
Present market forecasts for thin wafers:
2011-2017 Market Forecast in units and US$ for thin wafers
Detailed forecasts by application, wafer size and thickness
Analyze wafer thinning trends, with a focus on temporary bonding
Market Forecasts for temporary bonding in US$ value and number of equipment:
By application
By wafer size
Market Forecast for temporary bonding chemistry
Overview of the different temporary bonding approaches, i.e.:
Without carrier:
TAIKO
DoubleCheck Semiconductors
With Carrier:
UV laser released
Electrostatic
Thermal release
Mechanical release
Chemical release
Temporary bonding trends
Thinning trends
Dicing trends
Description of the applications for temporary wafer bonding, including main characteristics and challenges
COMPANY INDEX Crystal Solar Nitto Denko Robert Bosch Table of ContentsWhy this report … 4
What is new compared to 2011 report … 6
List of companies mentioned in the report … 7
Executive summary … 8
THIN WAFERS … 22
2011-2017 thin wafer market forecasts … 24
Thinned wafers vs. TOT number of shipped wafers … 26
Thin wafers shipment in 300 mm eq. … 27
2011-2017 thin wafer shipment forecast by application in units … 28
In US$ … 30
2011-2017 thin wafer shipment forecast by wafer diameter in units … 32
In US$ … 33
2011-2017 thin wafer shipment forecast by wafer thickness in units … 34
In US$ … 35
2011 Thickness Breakdown … 36
2017 Thickness Breakdown … 37
Description of applications … 39
TOP Thin wafers processors … 40
Thin wafers processors production ranking … 41
Thin wafers processors by application … 42
Thin wafer processing geographical breakdown ... 43
Grinding players … 44
MEMS … 48
CMOS Image Sensors … 60
Memory & Logic … 70
Power Devices … 74
RF Devices (GaAs) … 91
LEDs … 98
Advanced Packaging … 104
Photovoltaic … 116
THIN WAFERS HANDLING … 141
Temporary bonders/Carriers/Materials forecast … 143
Temporary bonded wafers forecast … 144
Temporary bonders forecast in $M/units … 146
Temporary bonders forecast by wafer size … 147
Temporary bonding materials forecast … 148
Est 2011 temporary bonding players market share … 149
Thin wafer handling: the different solutions … 150
Wafer handling with carrier: temporary bonding . 155
The different temporary bonding techniques … 170
Thermal plastic release … 171
Mechanical release … 174
ZoneBOND … 177
YAG laser release … 180
Excimer laser release … 183
Chemical release … 185
Temporary bonding materials … 193
The "Magic" material … 195
Carriers … 207
Wafer handling with carrier: electrostatic carrier . 212
Wafer handling without carrier … 215
Wafer handling with ring technology … 220
Wafer thinning … 226
Wafer dicing … 238
Final conclusions … 264
To order this report: Electronic_Component_and_Semiconductor Industry: Thin Wafers, Temporary Bonding Equipment & Materials Market
Nicolas Bombourg
Reportlinker
Email: [email protected]
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