SAN JOSE, Calif., Sept. 26, 2011 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced it will launch a wireless LSI compliant with the TransferJet™ standard for close proximity wireless transfer technology. Samples will start shipping at the end of January 2012 and mass production is scheduled to begin in the second quarter (April-June) of 2012.
Using Toshiba's cutting-edge wireless communication technology, the new product achieves receiving sensitivity of -78dBm, the best performance in the industry, greatly surpassing the TransferJet specification(1). The high sensitivity contributes to stable communication between TransferJet-compliant digital devices.
Toshiba's cutting-edge RF-CMOS LSI integration technology enabled incorporation of the RF circuit and RF switch for TransferJet in the wireless LSI for the first time in the industry. Furthermore, the LSI is manufactured in a 65-nanometer process, lowering the number of external RF circuits and peripheral components, and uses the industry's smallest package to reduce overall chip size. This makes the new product ideal for increasingly compact and lightweight digital products, such as smartphones, tablet PCs, notebook PCs, and digital cameras.
TransferJet is a close proximity wireless transfer technology standard promoted by the TransferJet Consortium whose membership consists of 53 companies (as of September 2011), including Toshiba. TransferJet provides high-speed data transfer with low power consumption simply by selecting on the screen of a mobile device the data file to be transferred and "touching" the receiving device with the mobile device. Applications of TransferJet could expand to digital signage when combined with Near Field Communications (NFC) technology.
4.0 mm × 4.0 mm× 0.5 mm
Close proximity wireless
TC35420: TransferJet™-compliant LSI
● One-chip solution: RF (wireless), digital signal processing implemented in a monolithic chip
● RF-CMOS process: Built-in RF parts, RF switch, mating circuit and low-noise amplifier (LNA)
● Ultra-high-speed host interface: SDIO UHS-I support
● Low power consumption: Power reduction architecture realizing low leakage current
● Single power supply
● Small package: LGA 81 4.0 mm x 4.0 mm x 0.5 mm
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2010 WW Semiconductor Revenue, April 2011). Toshiba was founded in 1875 and today has over 490 subsidiaries and affiliates, with 203,000 employees worldwide and annual sales of $77 billion. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.
TransferJet is a trademark of Sony Corporation.
(1) TransferJet(T) specification is -71dBm.
SOURCE Toshiba America Electronic Components, Inc.