IRVINE, Calif., Jan. 13, 2015 /PRNewswire/ -- Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that EDN has named its 15nm e-MMCTM  embedded NAND flash memory devices as one of the "100 Hot Products of 2014." The 2014 EDN Hot 100 highlights the electronics industry's most significant products of the year based on innovation, significance, usefulness, and popularity.
Toshiba's new chips are among the world's smallest, and integrate NAND chips fabricated with Toshiba's cutting-edge 15nm process technology and a controller to manage basic control functions for NAND applications into a single package. Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. The new product's package size is approximately 26 percent smaller than comparable Toshiba products  and offers faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately eight percent faster (max.), while the write speed is approximately 20 percent faster (max.).
Sample shipments of the 16 gigabyte (GB) and 32GB products have commenced, with 8GB, 64GB and 128GB products to follow.
"With the introduction of 15nm-based e-MMC, Toshiba continues to demonstrate its leadership in NAND Flash and embedded memory solutions targeting mobile and wearable devices," noted Scott Beekman, director of managed NAND memory products for TAEC. "The small 11mm x 10mm package, supporting a wide range of densities, is well-suited for increasingly space limited applications."
"Of the many thousands of products announced during the past year, the EDN Hot 100 are the products that especially caught the attention of our editors and readers," said Rich Pell, executive and chief technical editor, EDN. "We are pleased to share the tradition of showcasing these technologies as we celebrate the 21st anniversary of this program."
The complete list of EDN's Hot 100 products can be found online at: http://www.edn.com/electronics-products/other/4437460/EDN-Hot-100-products-of-2014/?_mc=pr_edn_bcs_hot100temp
*About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, April 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
EDN is an online community intended to help engineers get from concept to reality. EDN offers deep-dive technical content along with a community experience where the latest in design techniques, technologies, and methodologies meld with the simplest and most useful online interaction tools. EDN celebrates all that is the engineer – from deep down technical views, to informed opinions, to knowledge and schematics sharing, to creative design and all aspects of life as an engineer. From day one, EDN has been written by engineers, for engineers, feeding design know-how and experience back to the engineering community as a trusted source. EDN is part of UBM Canon, the leading B-to-B event producer, publisher, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry.
 e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association.
 As of September 30th 2014. Toshiba survey. Excluding the 128GB product.
 High-speed class e-MMC embedded NAND flash memory products using 19nm second generation process technology.
 Excluding the 128GB product.
 Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size. For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes.
*The products are labeled based on the memory chip(s) it contains, not the amount of memory capacity available for data storage by the end user. Part of the capacity is reserved for card functionality. Please refer to the data sheet or your local Toshiba sales representative.
(For purposes of measuring memory capacity in this context, 1GB = 1,073,741,824 bytes.)
*Read and write speeds are calculated as 1MB/s = 1,000,000bytes/s.
© 2015 Toshiba America Electronic Components, Inc. All rights reserved.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
Editor's Note: Images available for download from: http://www.toshiba.com/taec/news/press_releases/2015/memy_15_739.jsp
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SOURCE Toshiba America Electronic Components, Inc.