BEAVERTON, Ore., June 4, 2012 /PRNewswire/ -- BeSang Inc. is pleased to announce that "TRUE 3D" is now a Registered Trademark through the United States Patent and Trademark Office. BeSang's "TRUE 3D" IC is not an off-chip 3D chip stacking technology with limited TSV interconnects, but a single-chip 3D IC solution with unrestricted 3D interconnects. There are many technologies that claim to be 3D IC although they are not – this is the philosophy behind BeSang's "TRUE 3D" phrase.
More information about BeSang Inc., its "TRUE 3D" technology, and recent news can be found at besang.com.
BeSang Inc. is a pioneer in the design, development, and delivery of unsurpassed, three-dimensional (3D) IC solutions, providing unmatched process and design technologies for 3D IC as well as technology licenses to customers. The company's proprietary and cutting edge TRUE 3D IC technologies enable vertical stacking of multiple device layers, and offer ultra low-cost and high-performance solutions to CPU, DSP, GPU, ASIC, FPGA, SoC, DRAM, SRAM, flash, image sensor, and SSD applications. BeSang has successfully developed 3D ICs and is providing high-value intellectual properties related to its proprietary TRUE 3D ICs. The fabless semiconductor company is headquartered in Beaverton, Oregon.
SOURCE BeSang Inc