Ultratech Cambridge NanoTech Delivers Phoenix G2 ALD System To Japan

SAN JOSE, Calif., June 3, 2015 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser­ processing and inspection systems used to manufacture semiconductor devices and high­brightness LEDs (HB­ LEDs), as well as atomic layer deposition (ALD) systems, announced that its Cambridge NanoTech business unit Ultratech-CNT has delivered a new, second-generation production tool, the Phoenix G2 Batch ALD system to a major Japanese manufacturer. The system was purchased for its ability to deposit on multiple large area substrates utilizing a new, high-output oxidant source. Ultratech CNT is at the cutting-edge of nanotechnology thin-film development and leads the field with new innovations and technologies enabling it to meet the high demands of the expanding ALD market.

The company introduced the first Phoenix system in 2008 followed by enhanced models of the system in 2010. The current Phoenix G2 further expands the capabilities of the tool, and offers production-oriented safety and stability features. The Phoenix G2 thermal ALD system is a large format batch tool with flexibility to handle wafers, large planar substrates, and non-planar objects. Multiple operation modes enable manual and automated use of the system, thereby providing the end user the freedom of transitioning from research and development to production in a single platform. As a versatile, thin-film deposition technique, ALD usage is ever increasing, along with its role as an enabler in a broad spectrum of critical technologies, such as microelectronics, lighting and display, energy storage, MEMS, data storage and more. As a result, the Phoenix G2 system speeds the transition from lab-to-fab.

Ultratech Cambridge NanoTech Vice President of Global Sales, ALD Products, Bob Kane, said, "The ability to deposit batch ALD solutions using ozone instead of H2O opens the door to new opportunities in several markets. With new ALD applications emerging every week, the Phoenix G2 is designed for use in any environment from pilot to volume production with industry-leading reliability. As the leading ALD supplier to academic institutions and industrial manufacturers worldwide, Ultratech CNT will continue to develop bridge-tool solutions that implement new technologies and techniques that enable the transition from research to manufacturing environments."

Ultratech CNT's Phoenix G2 Batch ALD System
The Phoenix is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufacturing. Technologists and researchers rely on the Phoenix for repeatable, highly-accurate film deposition on flat and 3-D substrates alike. And with support for up to six individual precursor lines, the Phoenix delivers solid, liquid, or gaseous process chemistries depending on the thin film needs. The precise software control of process parameters, including temperature, flow and pressure, provide defect-free coatings on the most sensitive substrates. A compact footprint and innovative design, plus numerous automation options, makes Phoenix G2 system the practical choice for those with batch production ALD requirements. 

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This release includes forward­looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward­looking statements can generally be identified by words such as "anticipates," "expects," "may," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forward­looking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forward­looking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers; quarterly revenue fluctuations; industry and sector cyclicality, instability and unpredictability; market demand for consumer devices utilizing semiconductors produced by our clients; our ability to manage costs; new product introductions, market acceptance of new products and enhanced versions of our existing products; reliability and technical acceptance of our products; our lengthy sales cycles, and the timing of system installations and acceptances; lengthy and costly development cycles for laser­processing and lithography technologies and applications; competition and consolidation in the markets we serve; improvements, including in cost and technical features, of competitors' products; rapid technological change; pricing pressures and product discounts; our ability to collect receivables; customer and product concentration and lack of product revenue diversification; inventory obsolescence; general economic, financial market and political conditions and other factors outside of our control; domestic and international tax policies; acquisitions, cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies; and other factors described in our SEC reports including our Annual Report on Form 10­K filed for the year ended December 31, 2014 and our Quarterly Report on Form 10-Q filed for the quarterly period ended April 4, 2015. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forward­looking statements to reflect any event or circumstance that may arise after the date of this release.

About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front­end semiconductor, back­end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high­brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.

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SOURCE Ultratech, Inc.

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