Ultratech Receives Follow-On Order From Major Asian Foundry For Laser Spike Annealing System

SAN JOSE, Calif., June 21, 2016 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today announced a follow-on order from a major foundry in Asia for its LSA101 laser spike anneal system. Equipped with the dual-beam option, the system provides a second low-power laser that adds flexibility for annealing at low substrate temperatures. This capability is required for advanced applica­tions, such as gate stack formation, silicide or post-silicide anneal. The LSA101 tool will be used to support the foundry's 28-nm and 40-nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.

Scott Zafiropoulo, General Manager of LSA and Senior Vice President of Marketing at Ultratech, said, "This follow-on order for our LSA101 system reinforces the growing opportunities that we are experiencing for advanced planar logic devices. Customers around the world are increasing their 28-nm capacity to take advantage of the optimal performance-to-cost ratio at this node. We will continue working closely with our global customers as we strive to continue to provide advanced annealing systems that deliver the most flexible, extendable and cost-effective performance."

Ultratech LSA 101 Dual Beam Laser Spike Anneal System
Built on the customizable Unity Platform™, LSA101 with the dual-beam option expands the process space by adding a second low-power laser beam that adds process flexibility and enables millisecond annealing with a low substrate temperature. Inserting a millisecond anneal step post-junction formation, such as gate stack formation, silicide or post-silicide anneal, has been shown to improve leakage and device reliability, while reducing contact resistance and improving both performance and yield. Compared to compet­ing millisecond annealing technologies, LSA with dual beam is designed to offer the lowest thermal budget millisecond anneal process along with superior within-die uniformity for different layouts. The LSA101 delivers high flexibility and extendibility for advanced annealing applications and is currently in high-volume production for advanced planar and FinFET devices.

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Additional Information:  In connection with the solicitation of proxies, Ultratech, Inc. ("Ultratech") has filed with the Securities and Exchange Commission (the "SEC"), a definitive proxy statement and other relevant documents concerning the proposals to be presented at Ultratech's 2016 Annual Meeting of Stockholders (the "2016 Annual Meeting").  The proxy statement contains important information about Ultratech and the 2016 Annual Meeting.  In connection with the 2016 Annual Meeting, Ultratech has mailed the definitive proxy statement to stockholders.  In addition, Ultratech files annual, quarterly and special reports, proxy statements and other information with the SEC.  You are urged to read the proxy statement and other information because they contain important information about Ultratech and the proposals to be presented at the 2016 Annual Meeting.  These documents are available free of charge at the SEC's website (www.sec.gov) or from Ultratech at our investor relations website (http://ir.ultratech.com).  The contents of any websites referenced herein are not deemed to be incorporated by reference into the proxy statement.

Ultratech and its directors, executive officers and certain employees may be deemed to be participants in the solicitation of proxies from Ultratech's stockholders in connection with the election of directors and other matters to be proposed at the 2016 Annual Meeting.  Information regarding the interests, if any, of these directors, executive officers and specified employees is included in the definitive proxy statement and other materials filed by Ultratech with the SEC.

About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front­end semiconductor, back­end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high­ brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
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Unity Platform is a trademark of Ultratech, Inc.

SOURCE Ultratech, Inc.

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