SAN JOSE, Calif., April 13, 2016 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today announced a follow-on order from a major foundry for its LSA101 laser spike anneal system. The system is equipped with the dual beam option, providing a second low-power laser that adds flexibility for yield enhancement and enables low thermal budget processing required for advanced applications such as gate stack formation, silicide or post-silicide anneal. Ultratech's LSA101 system will be used for 28-nm production and is expected to ship in the second quarter of 2016.
The industry is experiencing a second wave of growth in the advanced planar node technologies, including 28-nm logic. This is due to the high cost and challenges to manufacture chips at leading-edge FinFET nodes; lithography alone represents close to 45 percent of the overall spending when considering triple patterning and other advanced lithography techniques used in manufacturing. As a result, many foundries, especially those in China, are expanding their 28-nm capacity as end customers are taking advantage of the optimal performance to cost ratio at this node. This trend may extend the 28-nm node longer and at larger volumes than previously expected.
Arthur W. Zafiropoulo, Ultratech Chairman and Chief Executive Officer, said, "This LSA system order is an example of the growing manufacturing opportunities for cost-effective nodes, such as 28nm and above. When comparing the different nodes, 28nm was the last strong planar node and boasted the lowest cost-per-transistor. As a result, customers around the world are increasing their 28nm capacity. Ultratech continues to work with its global customer base to provide advanced annealing solutions that offer the best technical performance, while delivering low cost-of-ownership for their specific manufacturing needs whether at 40-nm, 28-nm or leading-edge nodes."
Ultratech LSA 101 Dual Beam Laser Spike Anneal System
Built on the customizable Unity Platform™, LSA101 with the dual beam option expands the process space by adding a second low-power laser beam that adds process flexibility and enables millisecond annealing with a low thermal budget process. Inserting a millisecond anneal step post-junction formation, such as gate stack formation, silicide or post-silicide anneal, has been shown to improve leakage and device reliability, while reducing contact resistance and improving both performance and yield. Compared to competing millisecond annealing technologies, LSA with dual beam offers the lowest thermal budget millisecond anneal process along with superior within-die uniformity for different layouts. This performance is provided at a significantly lower cost-of-ownership due to higher throughput and low cost-of-consumables. The LSA101 delivers high flexibility and extendibility for advanced annealing applications and is currently in high-volume production for 28-nm and below logic devices.
This release includes forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can generally be identified by words such as "anticipates," "expects," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forward-looking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forward-looking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers; quarterly revenue fluctuations; industry and sector cyclicality, instability and unpredictability; market demand for consumer devices utilizing semiconductors produced by our clients; our ability to manage costs; new product introductions, market acceptance of new products and enhanced versions of our existing products; reliability and technical acceptance of our products; our lengthy sales cycles, and the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; competition and consolidation in the markets we serve; improvements, including in cost and technical features, of competitors' products; rapid technological change; pricing pressures and product discounts; our ability to collect receivables; customer and product concentration and lack of product revenue diversification; inventory obsolescence; general economic, financial market and political conditions and other factors outside of our control; domestic and international tax policies; cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies; and other factors described in our SEC reports including our Annual Report on Form 10K filed for the year ended December 31, 2015 and our Quarterly Report on Form 10-Q filed for the quarterly period ended October 3, 2015. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: frontend semiconductor, backend semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
Unity Platform is a trademark of Ultratech, Inc.
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SOURCE Ultratech, Inc.