SAN JOSE, Calif., Oct. 14, 2015 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received a large multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems. The AP300 systems will be utilized for high-volume, fan-out wafer-level packaging (WLP) applications used to manufacture leading-edge chips. Ultratech will begin shipping the systems in Q4FY15 to the customer's facility in Taiwan.
The strong demand for thin mobile communication devices such as smartphones and tablets continues to drive growth in WLP. Due to the costs associated with 3D through-silicon via (TSV) architectures, industry analysts regard fan-out WLP as an effective solution for the highly demanding mobile and wireless market where the focus is on delivering high performance coupled with a small form factor.
Ultratech's General Manager and Vice President of Lithography Products Rezwan Lateef stated, "Fan-out technologies provide a cost-effective packaging solution that enables smaller form factors, increased I/O density and excellent electrical and thermal performance. By working closely with our customers and continuing to invest in product R&D, Ultratech successfully addresses challenging fan-out issues, such as chip-to-mold non-planarity, die shift misalignment and wafer warpage, while providing outstanding cost-of-ownership. This major order clearly validates our technology leadership and the value proposition of our AP300 systems. We look forward to building on our relationship with this valued customer and supporting their aggressive technology roadmap for the next generation of mobile devices."
The Ultratech AP300 Family of Lithography Steppers
The AP300 family of lithography systems is built on Ultratech's customizable Unity Platform™, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost-effective manufacturing. These systems are particularly well suited for Cu pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as Ultratech's award winning dual-side alignment (DSA) system, utilized around the world in volume production.
This release includes forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can generally be identified by words such as "anticipates," "expects," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forward-looking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forward-looking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers; quarterly revenue fluctuations; industry and sector cyclicality, instability and unpredictability; market demand for consumer devices utilizing semiconductors produced by our clients; our ability to manage costs; new product introductions, market acceptance of new products and enhanced versions of our existing products; reliability and technical acceptance of our products; our lengthy sales cycles, and the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; competition and consolidation in the markets we serve; improvements, including in cost and technical features, of competitors' products; rapid technological change; pricing pressures and product discounts; our ability to collect receivables; customer and product concentration and lack of product revenue diversification; inventory obsolescence; general economic, financial market and political conditions and other factors outside of our control; domestic and international tax policies; cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies; and other factors described in our SEC reports including our Annual Report on Form 10-K filed for the year ended December 31, 2014 and our Quarterly Report on Form 10-Q filed for the quarterly period ended July 4, 2015. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front-end semiconductor, back-end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high-brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
Unity Platform is a trademark of Ultratech, Inc.
SOURCE Ultratech, Inc.