Ultratech Receives Multiple-System Order For Its Superfast 4G+ Inspection System

SAN JOSE, Calif., March 29, 2016 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser­ processing and inspection systems used to manufacture semiconductor devices and high­brightness LEDs (HB­ LEDs), as well as atomic layer deposition (ALD) systems, announced that following technical validation the company received an order for multiple Superfast 4G+ inspection systems from a leading memory manufacturer in Asia. The in-line inspection systems will be used for high-volume production of advanced 3D NAND flash memory chips. Ultratech plans to begin shipping the Superfast 4G+ systems in June.

Damon Tsai, Ultratech's Asia Director for Inspection Systems, said, "We are thrilled to have been selected for insertion in this 3D NAND flash manufacturing factory, having just finished the development of our latest generation, the Superfast 4G+. With its high throughput and improved performance, our customer recognized the yield benefits and selected the Superfast 4G+ for its latest 3D NAND flash technology ramp. This adds to the list of 3D NAND flash factories using Superfast for displacement feed-forward to the scanners. Our customer will use the system initially for bow, warpage and planarization control. This order is further proof that Ultratech's Coherent Gradient Sensing (CGS) technology provides comprehensive measurements that deliver critical wafer shape distortion and topography parameters at any point in the process flow."

Ultratech's Superfast 4G+ Inspection System

Based on patented coherent gradient sensing (CGS) technology, Ultratech's Superfast 4G+ inspection system for patterned wafers provides the industry's highest-productivity for volume manufacturing with a lower cost solution compared to competing systems. Building on the field­proven Superfast 4G, Ultratech's 4G+ Inspection System provides the industry with a 3D topography solution for advanced lithography applications with the flexibility to measure front­side of patterned wafers anywhere in the production line. Its direct, front­side 3D topography measurement capability is well suited for patterned wafer applications, such as displacement feed­forward to the scanner, 3D topography measurement for focus control, and high­stress process control with a cost­effective solution.

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About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front­end semiconductor, back­end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high­ brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.

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SOURCE Ultratech, Inc.

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