SAN JOSE, Calif., April 14, 2015 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB LEDs), as well as atomic layer deposition (ALD) systems, announced that a major memory manufacturer from Asia placed a follow-on order for Ultratech's Superfast high-volume inspection system. Following the success of the Superfast 3G+ system in R&D, this customer ordered Ultratech's 4G inspection system to facilitate the yield ramp of its latest memory technology. Ultratech has shipped the Superfast 4G system in the first quarter of 2015.
Ultratech's 4G system builds on the field-tested capability of the Superfast 3G+, providing the industry's highest productivity and lowest-cost 3-D topography inspection solution compared to competing systems. With a displacement repeatability of 0.2nm 1 sigma, an edge exclusion of 1.5mm and throughput of 125 wafers-per-hour, the Superfast 4G inspection system was selected as the lithography distortion control solution. To ensure a smooth transition from the 3G+ to the 4G model for high-volume production, the two inspection systems have identical optical modules insuring excellent tool-to- tool matching.
"As leading-edge DRAM and NAND Flash memory customers transition from R&D to high-volume production, they are expected to implement shape-based, patterned wafer inspection solutions in their production lines. Our Superfast 4G system delivers the highest productivity and lowest cost-of-ownership resulting in customers, such as this major Asian manufacturer, choosing Superfast solely as their production tool of record," explained Eric Bouche, Ultratech's general manager and vice president, Inspection Systems. "We have worked closely with advanced memory manufacturers to develop shape-based applications that contribute directly to production yield. This has enabled Ultratech's Superfast inspection system to achieve a market leadership position in 3-D topography. Ultratech remains committed to providing competitive advantages to its global customer base by developing leading technology in a cost-effective solution for high-volume manufacturing. We look forward to working with this valued customer to meet its production and technology roadmaps."
Ultratech's Superfast 4G Inspection System
Building on the field-proven Superfast 3G+, Ultratech's 4G Inspection System provides the industry with a 3D topography solution for advanced lithography applications with the flexibility to measure front-side of patterned wafers anywhere in the production line. Based on patented coherent gradient sensing (CGS) technology, Ultratech's Superfast 4G inspection system for patterned wafers provides the industry's highest throughput, with the lowest cost-of-ownership (3x to 5x lower) compared to competing systems. Its direct, front-side 3D topography measurement capability is well suited for patterned wafer applications such as feed-forward overlay distortion control, 3D topography measurement for focus control, and high-stress process control. The Ultratech Superfast 4G inspection system provides leading technology to address the critical needs of its global customers in a cost-effective solution.
This release includes forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can generally be identified by words such as "anticipates," "expects," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forward-looking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forward-looking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers; quarterly revenue fluctuations; industry and sector cyclicality, instability and unpredictability; market demand for consumer devices utilizing semiconductors produced by our clients; our ability to manage costs; new product introductions, market acceptance of new products and enhanced versions of our existing products; reliability and technical acceptance of our products; our lengthy sales cycles, and the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; competition and consolidation in the markets we serve; improvements, including in cost and technical features, of competitors' products; rapid technological change; pricing pressures and product discounts; our ability to collect receivables; customer and product concentration and lack of product revenue diversification; inventory obsolescence; general economic, financial market and political conditions and other factors outside of our control; domestic and international tax policies; cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies; and other factors described in our SEC reports including our Annual Report on Form 10K filed for the year ended December 31, 2014. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front-end semiconductor, back-end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high-brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
SOURCE Ultratech, Inc.