HSINCHU, Taiwan, March 9, 2011 /PRNewswire-Asia/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC" or "The Company"), a leading global semiconductor foundry, today announced its successful participation in the European Union (EU) 7th Framework Programme for Research and Technological Development (FP7), becoming the first Taiwanese electronic firm to join as an official member of this program. As part of a team of 18 participants from 9 countries spanning industry, academia, and R&D (including Taiwan's Industrial Technology Research Institute, or ITRI), UMC jointly proposed 'Boosting Life Cycle Assessment (LCA) Use In Small-To-Medium Enterprises (SMEs): Development of Sectoral Methods and Tools', or the 'LCA to go' project. This project was approved by the European Commission (EC) in October 2010 and received technology funding from Taiwan's Ministry of Economic Affairs (MOEA) in February 2011. Successful participation in the FP7 demonstrates that UMC's capability in green technology innovation has achieved world-class standards and gained recognition from EU industrial, governmental, academic, and R&D spheres.
UMC's CEO, Dr. Shih-Wei Sun, said, "The goal of the 'LCA to go' project - to develop an easy-to-use, cost-efficient tool for calculating products' carbon footprint - is in line with UMC's promotion of green products and low-carbon supply chains. Participation in this project represents the practical implementation of UMC's customer-driven values and climate change policy, UMC's recognition of the importance of the European market's demand for green products, and the fulfillment of UMC's duties as a responsible global and corporate citizen."
Dr. Sun continued, "UMC recognizes the increasingly swift pace of new electronic applications and the growing demand for green design and low-carbon products. With UMC's carbon footprint experience and the support of supply chain partners, our collaboration with the EU in green technology provides customers with comprehensive, tailored low-carbon services and helps customers acquire information on their products' carbon footprint with minimal time and resources to reduce negative impact from green trade barriers. At the same time, the results of 'LCA to go' will promote carbon reduction and raise low-carbon competitiveness for the industry."
Started in 1984, 'Framework Programmes' (FPs) are Europe's main vehicles for funding scientific research and development activities. The current FP7, spanning 2007-2013, is designed to spur the development of a knowledge economy and society in Europe while boosting competitiveness and quality of life. The 'LCA to go' project focuses on assisting small-to-medium enterprises (SMEs) to efficiently complete product life cycle assessments (LCAs), the results of which will then be used in green design.
For more information on Taiwanese firms' participation in the EU FP7, please visit the EC's website at http://cordis.europa.eu/fp7/projects_en.html or the website for the Taiwan office for FP coordination at http://ncp-tw.ntust.edu.tw/front/bin/home.phtml.
For more information on UMC's climate change policy, please refer to http://www.umc.com/English/news/2010/20100420.asp.
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the strength of the company's leading-edge processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.
Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.
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SOURCE United Microelectronics Corporation