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Oct 21, 2025, 03:00 ET Longsys Launches Industry's First Integrated-packaging mSSD, Enabling Flexible and Efficient Manufacturing
≤1000 to ≤100 — a tenfold improvement. By consolidating manufacturing into a one-step packaging process, the mSSD eliminates PCB mounting, reflow soldering, and multiple transfer stages. This doubles delivery efficiency and reduces additional cost by over 10%, while significantly
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Oct 15, 2025, 13:23 ET NEXTFLEX ANNOUNCES NEW AFFILIATED ALABAMA "NODE" TO SUPPORT GROWING NATIONAL HYBRID ELECTRONICS COMMUNITY
Electronics Hybrid Electronics are shaping the future of electronics manufacturing, delivering breakthrough solutions for PCB manufacturers and electronics systems integrators. By combining silicon ICs with novel additive printing processes and advanced materials, Hybrid Electronics
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Oct 13, 2025, 08:35 ET Metallium Advances Texas Facility Development with Addition of Second Demonstration Line to Handle Rare Earths Elements and Semiconductor Feedstocks for FJH Process Amid Global Supply Chain Disruptions
Texas plant include: A 5X scale-up from original 360 tpa design (1 ton per day) to 8,000 tpa PCB feed capacity (approximately 1,600 tpa metal-rich char post-plastic removal). Ramp up to Stage 1 scale targeted for Q3 2026. Core
More news about: MTM Critical Metals Ltd.
Oct 12, 2025, 23:35 ET Festival Belanja "Double 10"! Dapatkan Promo dan Hadiah Menarik dari Comfee
lebih stabil dan tahan lama, serta mencegah pertumbuhan dan penyebaran bakteri. Dirancang agar tahan lama, Gusto memakai PCB dengan lapisan UV yang meningkatkan daya tahan korosi, serta rentang voltase 80V–265V yang menjaga performa meski berhadapan dengan fluktuasi daya.
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Oct 07, 2025, 10:00 ET Arcwood Environmental Strengthens Midwest Presence with ERG Acquisition
analysis, waste characterization, packaging, manifesting, transportation, and disposal. The company also offers specialized services such as mercury and PCB management, household hazardous waste programs, and site remediation. Its certified team supports clients across industrial, municipal, and tribal sectors
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Oct 06, 2025, 10:00 ET ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q2 2025
3.1%. Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 7.8% to $430.5 million. The four-quarter moving average for PCB and MCM rose 8.8%. Semiconductor Intellectual
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Oct 06, 2025, 10:00 ET ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q2 2025
3.1%. Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 7.8% to $430.5 million. The four-quarter moving average for PCB and MCM rose 8.8%. Semiconductor Intellectual
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Oct 01, 2025, 11:27 ET Portage Community Bank Hires C. Joseph Assid as Executive Vice President and Chief Financial Officer
-- Portage Community Bank ("PCB"), the wholly-owned bank subsidiary of Portage Bancshares, Inc. ("PBI"), is pleased to announce the appointment of C. Joseph ("Joe") Assid as Executive Vice President (EVP) and Chief Financial Officer (CFO) of Portage Community Bank ("PCB"). With over twenty-five years
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Oct 01, 2025, 10:01 ET APIC Corporation Secures OTA From AFRL Information Directorate to Develop Prototype Trusted HIP-E Photonic PCB for Secure Multi-Level Processing
high-bandwidth, point-to-point optical links between processors, memory, and I/O interfaces Packaging the PCB assembly with processors and memory modules to meet stringent security and reliability requirements
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Oct 01, 2025, 01:00 ET JarnisTech Offers PCB Design and Assembly Services to Startups and R&D Teams
leader in high-end multi-layer and specialized material PCB solutions, provides flexible, cost-effective, and efficient PCB design and assembly services to startups and R&D teams around the globe. The company helps clients significantly reduce PCB development cycles and speed up product launches.
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Sep 30, 2025, 08:31 ET A Catalyst for Open Source: NextPCB Launches KiCad Projects Platform to Fuel the Future of KiCad
NextPCB, a global leader in PCB manufacturing and assembly solutions, proudly announces the launch of kicadprojects.com, a dynamic open-source community dedicated to supporting open-source hardware and enriching KiCad, the renowned open-source EDA tool for schematic capture and PCB layout. This initiative
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Sep 24, 2025, 22:57 ET E&R Strengthens North American Semiconductor Presence with New U.S. Subsidiary
EquipmentHigh-Precision Machining ServicesIC Tray & Carrier Tape Design and Manufacturing ServicesInternational logistics forwarder servicePCB/ABF Sputter, plasma equipmentSemiconductor AMHS System (OHT/AMR/EFEM)"E&R Select"
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Sep 18, 2025, 09:13 ET Minuman Manis yang Dingin dan Udara Sejuk: Comfee dan MIXUE Hadirkan Kesegaran Ganda pada Musim Panas Ini
self-cleaning yang membersihkan bunga es dari AC selama 42 menit untuk menjaga udara tetap bersih dan sehat.Tahan lama & stabil: Dilengkapi PCB dengan UV conformal coating yang melindungi perangkat AC dari karat, serta mendukung rentang voltase 80V–265V agar kinerja AC tetap stabil meski
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Sep 18, 2025, 03:00 ET ROHM Releases New Compact PFC + Flyback Control Reference Design for Power
enabling high-precision voltage setting and overcurrent protection. Tighter design margins permit smaller, lower-power devices and inductors, reducing PCB area and system cost. REF67004 logs operating data -- input/output voltage, current, temperature, pre-shutdown status, and cumulative operating
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Sep 17, 2025, 11:00 ET 技嘉 AORUS X870E X3D 系列主機板正式上市 以 AI 全面釋放 AMD Ryzen™ X3D 處理器效能
技術，AORUS X870E X3D 系列將 DDR5 記憶體效能推向業界全新標竿，全系列支援最高 9000+ MT/s，同時滿足遊戲、創作與 AI 工作負載的高效能需求。搭配技嘉專屬調校的 AI 增強技術，即使在高負載下依然有強化且穩定的效能。 透過 6mm 直觸式 VRM 熱導管與 PCB 散熱背板，AORUS X870E X3D 系列主機板散熱效率提升高達 14%，確保高負載下依舊穩定運行。同時搭載 EZ-DIY 友善設計，如 M.2 EZ-Flex 可讓 M.2 SSD 與散熱片緊密貼合，有效降溫高達 12℃ 及 PCIe EZ-Latch+ Duo 無須工具即可卸除雙顯示卡；DriverBIOS
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Sep 17, 2025, 11:00 ET GIGABYTE Announces the Availability of its AI-enhanced AORUS X870E X3D Series Motherboards for AMD Ryzen™ X3D Processors
performance, GIGABYTE offers a smarter user experience with advanced thermal management that leverages superior 6mm direct-touch heatpipe at VRM and PCB Thermal Plate for 14% enhanced heat dissipating efficiency, EZ-DIY features such as M.2 EZ-Flex and PCIe EZ-Latch+ Duo for tool-free installation, and
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Sep 17, 2025, 11:00 ET 기가바이트, AMD Ryzen™ X3D 프로세서용 AI 강화 AORUS X870E X3D 시리즈 마더보드 출시
차원이 다른 DDR5 메모리 속도로 게임과 콘텐츠 제작, AI 워크로드의 수요에 대응할 수 있다. 안정성과 속도를 모두 갖춘 튜닝 및 AI 기반 기능 최적화를 통해 사용자들은 차별화된 성능을 경험할 수 있다. 성능뿐 아니라 편의성도 강화됐다. VRM과 PCB 써멀 플레이트에 6mm 다이렉트 터치 히트파이프를 탑재해, 방열 효율이 14% 더 향상되었으며, 공구 없이도 설치가 가능한 M.2 EZ-Flex, PCIe EZ-Latch+ Duo 등 EZ-DIY 기능을 제공해 손쉽게 설치가 가능하다. 또한 DriverBIOS 기능을 통해 간단하게
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Sep 17, 2025, 11:00 ET GIGABYTE Announces the Availability of its AI-enhanced AORUS X870E X3D Series Motherboards for AMD Ryzen™ X3D Processors
performance, GIGABYTE offers a smarter user experience with advanced thermal management that leverages superior 6mm direct-touch heatpipe at VRM and PCB Thermal Plate for 14% enhanced heat dissipating efficiency, EZ-DIY features such as M.2 EZ-Flex and PCIe EZ-Latch+ Duo for tool-free installation, and
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Sep 17, 2025, 11:00 ET GIGABYTE kündigt die Verfügbarkeit seiner KI-optimierten Motherboards der Serie AORUS X870E X3D für AMD Ryzen™ X3D-Prozessoren an
Leistung bietet GIGABYTE ein nutzerfreundliches Erlebnis mit einem optimierten Thermomanagement, das ein 6-mm-Direct-Touch-Heatpipe am VRM und eine PCB-Thermal-Plate nutzt, wodurch die Wärmeableitung um bis zu 14 % verbessert wird. Ergänzt wird dies durch EZ-DIY-Funktionen wie M.2 EZ-Flex und PCIe EZ-Latch+
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Sep 17, 2025, 11:00 ET GIGABYTE annonce que ses cartes mères de la série AORUS X870E X3D, améliorées par l'IA pour les processeurs AMD Ryzen™ X3D, sont désormais disponibles
intelligente avec une gestion thermique avancée qui exploite un caloduc supérieur de 6 mm à contact direct au niveau du VRM et de la plaque thermique du PCB pour une efficacité de dissipation thermique améliorée de 14 %, des fonctions EZ-DIY telles que M.2 EZ-Flex et PCIe EZ-Latch+ Duo pour une installation
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Sep 17, 2025, 11:00 ET GIGABYTE anuncia o lançamento das suas placas-mãe AORUS X870E X3D com IA aprimorada para processadores AMD Ryzen™ X3D
de usuário mais inteligente com gerenciamento térmico avançado que aproveita o heatpipe de contato direto superior de 6 mm no VRM e na placa térmica PCB para aumentar em 14% a eficiência de dissipação de calor, recursos EZ-DIY, como M.2 EZ-Flex e PCIe EZ-Latch+ Duo para instalação sem ferramentas, e o
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Sep 17, 2025, 11:00 ET GIGABYTE anuncia las placas base de la serie AORUS X870E X3D con tecnología IA mejorada para procesadores AMD Ryzen™ X3D
de usuario más inteligente con una gestión térmica avanzada que aprovecha un tubo de calor de contacto directo de 6 mm de calidad superior en VRM y PCB Thermal Plate para aumentar un 14 % la eficiencia de disipación del calor, funciones EZ-DIY como M.2 EZ-Flex y PCIe EZ-Latch+ Duo para una instalación
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Sep 17, 2025, 11:00 ET GIGABYTE anuncia la disponibilidad de sus placas base de la serie AORUS X870E X3D mejoradas con IA para procesadores AMD Ryzen™ X3D
de usuario más inteligente con una gestión térmica avanzada que aprovecha un tubo de calor de contacto directo de 6 mm en el VRM y una placa térmica PCB para mejorar en un 14 % la eficiencia de disipación del calor, funciones EZ-DIY como M.2 EZ-Flex y PCIe EZ-Latch+ Duo para instalar sin herramientas
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Sep 17, 2025, 03:00 ET Grinn seals partnership with MediaTek following launch of high-performance SOMs based on Genio family processors
integration of sensors and modules with Grinn GenioSOM products. It serves as an ideal reference for developers, streamlining the creation of schematics and PCB layouts for new product development. The Grinn GenioSOM-700, Grinn GenioSOM-510 and Grinn GenioEVB are available to order online now from
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Sep 16, 2025, 10:30 ET Cyient Semiconductors & Anora Partner to Expand Turnkey Test and Validation Solutions
With over 2800+ projects transformed to 50+ global customers, Anora specializes in design-for-test, post-silicon validation, production test, PCB design, PCB manufacturing, functional testing and automation. Anora helps customers seamlessly transition from design to volume production with reliable, cost-optimized
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