CEVA and UltraSoC Partner to Enable Advanced Debug for CEVA DSP Cores
SoC debug solution supports monitoring and analysis of multi-core systems
SoC debug solution supports monitoring and analysis of multi-core systems
MOUNTAIN VIEW, Calif. and CAMBRIDGE, United Kingdom, Nov. 9, 2015 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for cellular, multimedia and connectivity, and UltraSoC announced today that the companies have partnered to make UltraSoC's universal system-on-chip (SoC) debug solution available for CEVA DSP cores.
Today's electronic devices require sophisticated, computationally intensive signal processing algorithms in order to execute audio, voice, vision, image, and communications processing functions. CEVA's broad portfolio of specialized signal processing cores and platforms are specifically tailored to enable these processor-intensive functions with minimal power consumption, making them ideal for any smart, connected device.
UltraSoC's universal debug solution enables SoC developers to build an on-chip monitoring, control and communications architecture that 'looks inside' the chip while the device is operating. This greatly assists the identification and elimination of bugs, speeding up time to market. It can also be used after deployment for in-field performance monitoring and troubleshooting, leading to enhancements for current and next generation products.
The companies will publicly demonstrate UltraSoC's technology for CEVA DSPs for the first time at the upcoming ARM TechCon on Nov. 10-12th, 2015 in Santa Clara, CA, and later in the SemIsrael Expo on Nov. 17th in Israel. The demo platform consists of a dual core ARM and CEVA based system in an FPGA, running side-by-side, with the UltraSoC IP, effectively allowing the two processors to be debugged and fine-tuned within a single environment.
Will Strauss, president, Forward Concepts, commented: "A large part of the value of UltraSoC's platform is its vendor neutrality and ability to support SoCs featuring processor cores from multiple sources. The addition of CEVA DSP cores to the existing group, which includes other major IP vendors such as ARM, means that developers will have access to a very powerful system-wide debugging solution."
Rupert Baines, CEO, UltraSoC, said: "We aim to deliver a truly universal SoC debug platform, and in that context, CEVA support is a 'must-have': with over six billion chips shipped featuring its cores, CEVA technology is at the hub of many of today's audio, vision and communications devices. By working together, UltraSoC and CEVA now offer significant benefits to SoC developers who are designing CEVA DSPs into the next generation of emerging smart and connected devices."
Moshe Shahar, Director of DSP Systems Architecture at CEVA, added: "UltraSoC's ability to deliver non-intrusive, system-wide debugging with an extremely low silicon overhead makes it a valuable addition to the ecosystem supporting CEVA's DSP families. As SoCs increasingly utilize multiple processors, the level of complexity rises accordingly and being able to monitor and analyze the behavior of an entire device represents a distinct advantage for developers."
About UltraSoC
UltraSoC is an independent provider of SoC infrastructure that enables rapid development of embedded systems based on advanced SoC devices. The company is headquartered in Cambridge, United Kingdom. For more information visit www.ultrasoc.com.
About CEVA, Inc.
CEVA is the leading licensor of cellular, multimedia and connectivity technologies to semiconductor companies and OEMs serving the mobile, consumer, automotive and IoT markets. Our DSP IP portfolio includes comprehensive platforms for multimode 2G/3G/LTE/LTE-A baseband processing in terminals and infrastructure, computer vision and computational photography for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 b/g/n/ac up to 4x4) and serial storage (SATA and SAS). One in every three phones sold worldwide is powered by CEVA, from many of the world's leading OEMs including Samsung, Huawei, Xiaomi, Lenovo, HTC, LG, Coolpad, ZTE, Micromax and Meizu. Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube and LinkedIn.
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SOURCE CEVA, Inc.
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