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Ceva Powers Oritek's Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles

Ceva is the leader in silicon and software IP that enable smart edge devices to connect, sense and infer data more reliably and efficiently.

News provided by

Ceva, Inc.

Jan 08, 2025, 07:00 ET

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Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst China's rapidly growing EV market and global shift towards more sustainable and intelligent transportation solutions

LAS VEGAS, Jan. 8, 2025 /PRNewswire/ -- CES 2025 -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced that Oritek Semiconductor, a provider of AI system-on-chip (SoC) solutions for intelligent automotive platforms, has licensed Ceva's SensPro™ Vision AI DSP for its Longquan 560 series of Advanced Driver Assistance Systems (ADAS) chipsets.

The Longquan 560 series represents Oritek's commitment to innovation, catering to diverse intelligent automotive needs of Electric Vehicles (EV) such as AI-based headlights, camera monitoring systems (CMS), zone control units (ZCU), and integrated central computing units for driving and parking. These chips are equipped with the Ceva-SensPro Vision AI DSP, a high-performance, low-power processor designed for complex sensor processing and AI workloads. This combination enables automakers to accelerate time-to-market, reduce development costs, and integrate advanced features seamlessly.

"Ceva's SensPro Vision AI DSP, embedded in our Longquan 560 series, provides the high-performance, energy-efficient processing essential for ADAS innovation," said Mr. Gao Feng, CEO of Oritek. "Our collaboration will empower automakers to meet the demands of a fast-evolving automotive market, delivering smarter, safer, and more reliable solutions."

"Oritek's selection of our SensPro processor reinforces the market-leading performance we enable for advanced sensing and processing capabilities required by today's automotive leaders," said Ran Snir, vice president and general manager of the vision business unit at Ceva. "With SensPro's unique capability to seamlessly handle the most intensive real-time workloads associated with critical ADAS applications, we are excited to collaborate on delivering cutting-edge solutions for the rapidly expanding EV market."

Market Context: The Booming Global EV Industry
The global electric vehicle (EV) market is experiencing unprecedented growth, driven by escalating demand for sustainable transportation, stringent emissions regulations, and advancements in technology. China remains the largest EV market, accounting for over 50% of global EV sales. By 2027, it is expected that battery-powered electric vehicles (BEV) will account for 30% of global vehicle sales, led by China. As the industry continues to evolve, Oritek's innovative ADAS solutions, powered by CEVA's SensPro Visio AI processor, are ideally positioned to address this expanding market opportunity.

SensPro™ is a highly-scalable, high-performance vision AI DSP for multitasking sensing and AI workloads of multiple sensors including camera, Radar, LiDar, Time-of-Flight, microphones and inertial measurement units. The SensPro family is designed to handle multiple sensor processing for contextually-aware devices and can be utilized in modern intelligent systems in automotive (inc. ISO26262 functional safety compliance), robotics, surveillance, AR/VR, voice assistants, wearables, mobile and smart home devices. The SensPro maximizes performance-per-watt for multi-sensor processing use cases by utilizing a combination of high performance single and half precision floating point math, point cloud creation and Deep Neural Network processing, along with parallel processing capacity for voice, imaging, and Simultaneous Localization and Mapping (SLAM). For more information, visit https://www.ceva-ip.com/product/ceva-senspro/.

About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 17 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.

Our headquarters are in Rockville, Maryland with a global customer base supported by operations worldwide. Our employees are among the leading experts in their areas of specialty, consistently solving the most complex design challenges, enabling our customers to bring innovative smart edge products to market.

Ceva: Powering the Smart Edge™

Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.

Logo: https://mma.prnewswire.com/media/74483/ceva__inc__logo.jpg

SOURCE Ceva, Inc.

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