Complete Teardown Report of ams's Color Sensor for the Apple iPhone 8 with a Comparison with the ams TCS3400, and a Summary of ams' ALS Evolution in the iPhone

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Jun 19, 2018, 08:30 ET

DUBLIN, June 19, 2018 /PRNewswire/ --

The "ams's Color Sensor in the Apple iPhone 8 Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

This report includes a full analysis of the package and sensor die, a cost analysis and price estimate for the device, a comparison with the ams TCS3400, and a summary of ams' ALS evolution in the iPhone.

ams AG is a long-time supplier for Apple's iPhone and has the biggest share of the ambient light sensor (ALS) market.

By introducing the RGBC sensor into high-end smartphones, ams has placed a key milestone leading to the next-generation, true-color sensor inside the iPhone X.

ams' iPhone 8 color sensor is located at the phone's front, sharing the flex PCB with the proximity sensor and the front camera module. The sensor is integrated in a 6-pin LGA package with dimensions 2.85 mm x 2.61 mm x 0.53 mm.

For the iPhone 8, Apple chose to continue its partnership with ams, but with a next-generation ALS that allows for detecting a wider range of wavelengths (color and infrared). The uniqueness of this color sensor lies in the organic material used for certain filters, which involves a more complex process.

The die design has also changed, with around 4x more photodiodes than the ALS in the iPhone 6S or 7, and there's a circular arrangement for the sensing part which improves sensing ability. The central filter region is for the infrared sensor, and the color sensors are positioned around it. They are composed of organic color filters and interferometric filters.

Key Topics Covered:

1. Overview / Introduction

2. Company Profile - ams

3. Apple iPhone 8 - Teardown

4. Physical Analysis

Physical Analysis Methodology
Package
Sensor Die
Physical Data Summary

5. Manufacturing Process Flow

Sensor - Die Process
Sensor - Wafer Fabrication Unit
Sensor - Filter Process Flow
Sensor - Filter Wafer Fabrication Unit
Packaging Process Flow
Final Assembly Unit

6. Cost Analysis

Cost Analysis Overview
Main Steps Used in the Economic Analysis
Yield Hypotheses
Sensor Die Cost
Component

7. Estimated Price Analysis

For more information about this report visit https://www.researchandmarkets.com/research/3brmvr/complete_teardown?w=5

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