The radio frequency (RF) semiconductor market is projected to reach a value of $5.0 billion in 2030, from $2.1 billion in 2019, exhibiting an 8.8% CAGR during the forecast period (2020-2030). The market is growing primarily because of the surging deployment of the IoT technology, increasing demand for smartphones, and rising adoption of mobile communication technologies including 5G and 4G. On the basis of component, the market is categorized into switches, power amplifiers, filters, low noise amplifiers, and tuners.
Out of these, the power amplifiers category contributed the largest revenue share to the global RF semiconductor market in 2019. These are among the key components of telecommunications and consumer electronics equipment. Owing to this, the rising demand for gaming consoles, laptops, tablets, smartphones, networking equipment, surveillance systems, and IoT devices are resulting in the increasing demand for power amplifiers. In addition to this, the swift infrastructural development in a number of countries is also predicted to drive the growth of this category during the forecast period.
Based on application, the market is divided into satellite communications, consumer electronics, aerospace & defense, and IT & telecommunications, among which, the IT & telecommunications application held the major share of the market during the historical period (2014-2019). The surging consumption of data globally is leading to the high requirement for the upgradation of telecommunication networks. The division is then projected to lead the market during the forecast period due to the expanding mobile devices sector and increasing number of 5G deals.
Geographically, the RF semiconductor market is being dominated by the Asia-Pacific region at the present time because of the increasing demand for smartphones and rising deployment of 5G in several countries, including South Korea, China, and Japan. Other than this, North America is expected to exhibit the highest CGAR during the forecast period. The surging penetration of internet, increased adoption of smartphones, and rising 5G deployment are resulting in the growth of the regional market.
The surging demand and adoption of smartphones all across the globe is one of the primary driving factors of the RF semiconductor market. After the initial introduction of smartphones, their demands grew rapidly in developed countries, and now their adoption has been increasing considerably in emerging economies as well. The urbanization rate and spending power of people in countries including India, China, Indonesia, Pakistan, and Nigeria are growing rapidly, which in turn, are resulting in the growing demand for smartphones.
A major trend being witnessed in the RF semiconductor market is the growing integration of AI. The technology is helping businesses expand by improving customer experience and is also allowing predictive maintenance for enhancing network reliability. AI can decrease the design complexities of RF semiconductor devices by making use of machine learning algorithms. These algorithms can further be utilized for optimizing RF parameters such as spectrum monitoring, antenna sensitivity, and channel bandwidth. Such enhancements in RF semiconductor devices is projected to result in the growth of the domain.
Key Topics Covered:
Chapter 1. Research Background 1.1 Research Objectives 1.2 Market Definition 1.3 Research Scope 1.3.1 Market Segmentation by Wafer Size 1.3.2 Market Segmentation by Frequency Band 1.3.3 Market Segmentation by Component 1.3.4 Market Segmentation by Material 1.3.5 Market Segmentation by Operating Voltage 1.3.6 Market Segmentation by Application 1.3.7 Market Segmentation by Region 1.3.8 Analysis Period 1.3.9 Market Data Reporting Unit 188.8.131.52 Volume 184.108.40.206 Value 1.4 Key Stakeholders
Chapter 2. Research Methodology 2.1 Secondary Research 2.1.1 Paid 2.1.2 Unpaid 2.2 Primary Research 2.2.1 Breakdown of Primary Research Respondents 220.127.116.11 By region 18.104.22.168 By industry participant 22.214.171.124 By company type 2.3 Market Size Estimation 2.4 Data Triangulation 2.5 Currency Conversion Rates 2.6 Assumptions for the Study 2.7 Notes and Caveats
Chapter 3. Executive Summary
Chapter 4. Introduction 4.1 Definition of Market Segments 4.1.1 By Wafer Size 126.96.36.199 &lessThan; 200 mm 188.8.131.52 200 mm 184.108.40.206 300 mm 4.1.2 By Frequency Band 220.127.116.11 VHF & UHF 18.104.22.168 SHF 22.214.171.124 EHF 4.1.3 By Component 126.96.36.199 Power amplifiers 188.8.131.52 Filters 184.108.40.206 Low noise amplifiers 220.127.116.11 Tuners 18.104.22.168 Switches 22.214.171.124 Others 4.1.4 By Material 126.96.36.199 Gallium arsenide 188.8.131.52 Silicon 184.108.40.206 Gallium nitride 220.127.116.11 Indium phosphate 18.104.22.168 Silicon germanium 4.1.5 By Operating Voltage 22.214.171.124 &lessThan; 5 V 126.96.36.199 5-20 V 188.8.131.52 >20 V 4.1.6 By Application 184.108.40.206 IT & telecommunications 220.127.116.11 Consumer electronics 18.104.22.168 Satellite communications 22.214.171.124 Aerospace & defense 126.96.36.199 Others 4.2 Value Chain Analysis 4.3 Market Dynamics 4.3.1 Trends 188.8.131.52 Use of mmWave for 5G communication 184.108.40.206 Rising integration of artificial intelligence (AI) 4.3.2 Drivers 220.127.116.11 Increasing demand for smartphones 18.104.22.168 Technological advancements in wireless communication 22.214.171.124 Surging adoption of IoT 126.96.36.199 Impact analysis of drivers on market forecast 4.3.3 Restraints 188.8.131.52 Effect of COVID-19 outbreak 184.108.40.206 Impact analysis of restraints on market forecast 4.3.4 Opportunities 220.127.116.11 Increasing demand for advanced driver-assistance systems (ADASs) 18.104.22.168 Rising number of smart city projects 4.4 Porter's Five Forces Analysis
Chapter 5. Global Market Size and Forecast 5.1 By Wafer Size 5.2 By Frequency Band 5.3 By Component 5.4 By Material 5.5 By Operating Voltage 5.6 By Application 5.7 By Region
Chapter 6. APAC Market Size and Forecast 6.1 By Wafer Size 6.2 By Frequency Band 6.3 By Component 6.4 By Material 6.5 By Operating Voltage 6.6 By Application 6.7 By Country
Chapter 7. Europe Market Size and Forecast 7.1 By Wafer Size 7.2 By Frequency Band 7.3 By Component 7.4 By Material 7.5 By Operating Voltage 7.6 By Application 7.7 By Country
Chapter 8. North America Market Size and Forecast 8.1 By Wafer Size 8.2 By Frequency Band 8.3 By Component 8.4 By Material 8.5 By Operating Voltage 8.6 By Application 8.7 By Country
Chapter 9. MEA Market Size and Forecast 9.1 By Wafer Size 9.2 By Frequency Band 9.3 By Component 9.4 By Material 9.5 By Operating Voltage 9.6 By Application 9.7 By Country
Chapter 10. LATAM Market Size and Forecast 10.1 By Wafer Size 10.2 By Frequency Band 10.3 By Component 10.4 By Material 10.5 By Operating Voltage 10.6 By Application 10.7 By Country
Chapter 11. Competitive Landscape 11.1 List of Key Players and Their Offerings 11.2 Competitive Benchmarking of Key Players 11.3 Market Share Analysis of Key Players 11.4 Strategic Developments of Market Players 11.4.1 Partnerships 11.4.2 Product Launches 11.4.3 Client Wins
Chapter 12. Company Profiles 12.1 Infineon Technologies AG 12.1.1 Business Overview 12.1.2 Product and Service offerings 12.1.3 Key Financial Summary 12.2 Texas Instruments Incorporated 12.2.1 Business Overview 12.2.2 Product and Service Offerings 12.2.3 Key Financial Summary 12.3 Analog Devices Inc. 12.3.1 Business Overview 12.3.2 Product and Service Offerings category 12.3.3 Key Financial Summary 12.4 STMicroelectronics N.V. 12.4.1 Business Overview 12.4.2 Product and Service Offerings 12.4.3 Key Financial Summary 12.5 Qorvo Inc. 12.5.1 Business Overview 12.5.2 Product and Service Offerings 12.5.3 Key Financial Summary 12.6 Broadcom Inc. 12.6.1 Business Overview 12.6.2 Product and Service Offerings 12.6.3 Key Financial Summary 12.7 Qualcomm Incorporated 12.7.1 Business Overview 12.7.2 Product and Service Offerings 12.7.3 Key Financial Summary 12.8 Telefonaktiebolaget LM Ericsson 12.8.1 Business Overview 12.8.2 Product and Service offerings 12.8.3 Key Financial Summary 12.9 Skyworks Solutions Inc. 12.9.1 Business Overview 12.9.2 Product offerings 12.9.3 Key Financial Summary 12.10 Samsung Electronics Co. Ltd. 12.10.1 Business Overview 12.10.2 Product and Service Offerings 12.10.3 Key Financial Summary 12.11 On Semiconductor Corporation 12.11.1 Business Overview 12.11.2 Product and Service Offerings 12.11.3 Key Financial Summary 12.12 NXP SEMICONDUCTORS N.V. 12.12.1 Business Overview 12.12.2 Product and Service Offerings 12.12.3 Key Financial Summary 12.13 Nokia Corporation 12.13.1 Business Overview 12.13.2 Product and Service Offerings 12.13.3 Key Financial Summary 12.14 Murata Manufacturing Co. Ltd. 12.14.1 Business Overview 12.14.2 Product and Service Offerings 12.14.3 Key Financial Summary 12.15 Huawei Technologies Co. Ltd. 12.15.1 Business Overview 12.15.2 Product and Service Offerings 12.15.3 Key Financial Summary 12.16 Fujitsu Limited 12.16.1 Business Overview 12.16.2 Product and Service Offerings 12.16.3 Key Financial Summary 12.17 ZTE CORPORATION 12.17.1 Business Overview 12.17.2 Product and Service Offerings 12.17.3 Key Financial Summary
Chapter 13. Appendix 13.1 Abbreviations 13.2 Sources and References 13.3 Related Reports