Global Semiconductor Assembly and Packaging Services Market Report 2018 - Key Vendors are ASE, Amkor Technology, Intel, Samsung, SPIL & TSMC

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May 03, 2018, 06:00 ET

DUBLIN, May 3, 2018 /PRNewswire/ --

The "Global Semiconductor Assembly and Packaging Services Market 2018-2022" report has been added to ResearchAndMarkets.com's offering.

The global semiconductor assembly and packaging services market to grow at a CAGR of 4.87% during the period 2018-2022.

Global Semiconductor Assembly and Packaging Services Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

One trend in the market is advances in wafer size. The semiconductor industry has seen a drastic transition in wafer size since 1910. The industry has migrated to large diameter wafers to cut down costs by almost 20%-25%. The industry presently uses 300-mm wafers to manufacture ICs.

According to the report, one driver in the market is rising number of fabs. Semiconductor fabs manufacture a range of semiconductor devices and components. These components are either designed in-house by IDMs or manufactured as per designs provided by the client to foundries.

Further, the report states that one challenge in the market is requirement of high initial capital investment. The establishment of a whole manufacturing setup requires a significant amount of capital investment, as new fab costs on an average $3-4 billion. Therefore, companies that have comparatively low-scale production of ICs outsource the manufacturing to foundries and OSATs such as TSMC and ASE.

Key vendors

ASE
Amkor Technology
Intel
Samsung Electronics
SPIL
TSMC

Key Topics Covered:

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

PART 05: MARKET SIZING

Market sizing 2017
Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

PART 07: MARKET SEGMENTATION BY APPLICATION

Comparison by application
Communication sector - Market size and forecast 2017-2022
Computing and networking sector - Market size and forecast 2017-2022
Industrial and automotive sector - Market size and forecast 2017-2022
Consumer electronics sector - Market size and forecast 2017-2022
Market opportunity by application

PART 08: MARKET SEGMENTATION BY PACKAGING TYPE

Comparison by packaging type
WLP - Market size and forecast 2017-2022
Die level packaging - Market size and forecast 2017-2022
Market opportunity by technology

PART 09: MARKET SEGMENTATION BY SERVICE PROVIDER

Comparison by service provider
OSATs - Market size and forecast 2017-2022
IDMs - Market size and forecast 2017-2022
Foundries - Market size and forecast 2017-2022
Market opportunity by service provider

PART 10: CUSTOMER LANDSCAPE

PART 11: REGIONAL LANDSCAPE

Geographical segmentation
Regional comparison
Key leading countries
Market opportunity

PART 12: DECISION FRAMEWORK

PART 13: DRIVERS AND CHALLENGES

PART 14: MARKET TRENDS

Advances in wafer size
Integration of semiconductor components in automobiles
Short product lifecycle of mobile devices
Growing number of OSAT vendors in APAC
Rising trend of M&A in semiconductor packaging industry
Growing requirement for semiconductor memory devices
Rising acceptance of wearable devices

PART 15: VENDOR LANDSCAPE

For more information about this report visit https://www.researchandmarkets.com/research/43hxgg/global?w=5

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SOURCE Research and Markets