IDTechEx Research Announces a New Report on Barrier Layers for Flexible Electronics

BOSTON, June 27, 2017 /PRNewswire/ --

Flexible consumer electronic devices are now a reality and a large opportunity lies in developing them further: devices in a flexible form factor that can operate without deterioration in performance, allowing them to be more robust, lightweight and versatile in their use and form factor is the end game.

     (Logo: http://photos.prnewswire.com/prnh/20140310/673848 )

     (Photo: http://mma.prnewswire.com/media/527721/IDTechEx_Infographic.jpg )

As forecasted by IDTechEx in the launch of the first ever market research report on the topic of barrier films for electronics almost ten years ago, innovation in encapsulation was one of the critical requirements that needed to be met in order to realize commercially viable consumer products.

Today, challenges of previous years are giving their place to new ones, being an integral part of bringing innovation to market, and they are discussed in detail in the new report by IDTechEx Research, Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts , where it is forecasted that the market for flexible encapsulation will reach approximately $913 million by 2027.

The report gives an in-depth review of the needs, emerging solutions and key players, addressing specific topics such as companies which are active in the development of high barrier films and their achievements on the field to date; benefits and drawbacks of deposition processes; new methods of permeability measurement and equipment.

Forecasts for displays, lighting and thin film photovoltaics (in terms of market value as well as area of barrier film sold into different verticals) are included in the report, in order to understand the influence that the development of flexible barriers would have at the mass deployment and adoption of these technologies.

Detailed profiles and benchmarking of key technology developers, based in almost 10 years of IDTechEx research in the space for barrier layers.

For further discussion, along with the challenges and opportunities for other flexible encapsulation options such as flexible glass; measurement techniques for high WVTR as well as 10-year forecasts, see Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts.

For those developing flexible electronics, seeking materials needs and opportunities, this is a must-read report.

For more information see http://www.IDTechEx.com/barrier and find out more about IDTechEx here.

Contact:
Alison Lewis
Marketing Manager, Reports
[email protected]
UK: +44(0)1223-810290

SOURCE IDTechEx