DUBLIN, Nov. 2, 2015 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/8sv34n/cambridge_cmos) has announced the addition of the "Cambridge CMOS Sensor CCS801 - Reverse Costing Analysis" report to their offering.
New entrant in the Gas Sensor market, Cambridge CMOS Sensors is focused on the future mobile market with ultra low power consumption products.
The objective is the integration of gas sensor in smartphones in order to offer new functions like pollution monitoring, alcohol breathalyzer and toxic gas (CO) detection.
The CCS801 is a volatile organic compound gas sensor which can detect Carbon Monoxide (CO), a wide range of Volatile Organic Compounds (VOC) and which can also be used as a CO2 equivalent sensor.
With a very small footprint, only 6mm², the package is adapted to consumer applications. The sensor die area is very tiny.
The die is based on a Metal Oxide sensitive layer made on a micro hotplate. This allows a very low power consumption: 1.6mW for one measurement. Moreover, the die is using some of the last technologies developed for the MEMS microphones.
Cambridge CMOS Sensors is a young company and the CCS801 is their first product for large volume. CCMOSS has developed a complex SiO2 membrane and a multi-heater to reduce the duration of the measurement.
The report provides all details on the structure of the component and the supply chain to produce this MEMS sensor. The report includes a detailed technology and cost analysis describing the innovations of CCMOSS and a comparison with the AS-MLV-P2 from AMS-Applied sensor.
Key Topics Covered:
1. Introduction - Executive Summary - Report of observation - Reverse Costing Methodology
2. Company Profile
- Cambridge CMOS Sensors
- CCS801 Characteristics
3. Physical Analysis - Synthesis of the Physical Analysis - Physical Analysis Methodology - Package - Package Views, Dimensions & Pin Out - Package Opening - Package Cross-Section - Package Process - Gas Sensor - View, Dimensions & Marking - Gas Sensor Area - Gas Sensor Cross-Section - Electrode - Micro Hotplate - Heater - Pad Cross-Section - Membrane Cross-Section - SnO2 deposition - Operation Principle - Process Characteristics - Comparison CCS801 vs. AS-MLV-P2 (From AMS) - Characteristics - Package - Die
4. Manufacturing Process Flow
- Global Overview
- Gas Sensor Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
5. Cost Analysis - Synthesis of the cost analysis - Main steps of economic analysis - Yields Hypotheses - Gas Sensor Front-End Cost - Gas Sensor Front-End Cost per process steps - Back-End : Probe Test Cost - Back-End : Packaging Cost - Back-End : Packaging Cost per Process Steps - Back-End : Final Test - CCS801 Component Cost
6. Estimated Price Analysis
- Estimated Selling Price
7. Gas Sensors Cost Comparison
For more information visit http://www.researchandmarkets.com/research/8sv34n/cambridge_cmos
Laura Wood, +353-1-481-1716, firstname.lastname@example.org
SOURCE Research and Markets