Silex Technology America Announces Wi-Fi 6E Tri-Band Embedded Module Based on NXP IW623 Chipset

SX-SDMAX6E Enables High-Speed, Low-Power Wireless Connectivity for Medical and Industrial Applications

SANTA ANA, Calif., Aug. 20, 2025 /PRNewswire/ -- Silex Technology America , a global provider of secure and reliable wireless solutions, announces the launch of the SX-SDMAX6E, the embedded module based on NXP ® Semiconductors ' IW623 tri-band Wi-Fi 6E chipset.

Packed with next-generation capabilities, the SX-SDMAX6E is purpose-built for performance-critical, battery-powered devices in medical, industrial, and factory automation settings, making it ideal for battery-powered or compact embedded devices.

Product Highlights:

• Powered by NXP's latest IW623 chipset
• Tri-band Wi-Fi 6/6E (2.4 / 5 / 6 GHz) – 2x2 dual stream
  • 1 x 1 configuration option to optimize power consumption.
• Ultra-low-power design with SDIO 3.0 for Wi-Fi, UART for Bluetooth®
• Industrial Temp Range: -40°C to +85°C
• Form Factors:
  • SX-SDMAX6E-2530S (Surface Mount)
  • SX-SDMAX6E-M2 (M.2 Connector)
• Designed, manufactured, and quality assured in Japan
• Regulatory readiness across the U.S., Canada, EU, UK, Japan (incl. DFS Master support)
• Extended product lifecycle—beyond NXP's longevity guarantee

Unleashing the Power of Wi-Fi 6E

Wi-Fi 6E opens up the uncluttered 6 GHz spectrum, enabling ultra-fast, low-latency, and interference-free connections. Combined with SDIO host interface support and optimized for low power, the SX-SDMAX6E delivers blazing speeds and rock-solid stability – all without draining your battery.

"This is a huge moment for wireless innovation," said Matthew Buckett, President, Silex Technology America. " Getting to market with a module based on NXP's IW623 chipset is no accident – it's the result of deep collaboration, relentless testing, and our commitment to delivering an Absolutely Must Connect experience to the industries that depend on us most."

"The collaboration with Silex brings the IW623 to life in a highly optimized module for industrial and medical applications," said Larry Olivas, Vice President and General Manager, Wireless Connectivity, NXP Semiconductors. " Silex's Gold Partner status is a reflection of their deep wireless expertise and dedication to quality that our customers expect ."

Availability & Early Access

Mass production is set for April 2026, but Silex is already opening doors for early adopters.

Early Access Program starts October 2025

• Includes: Pre-production samples, technical documentation, and evaluation support
• Apply now: https://www.silextechnology.com/connectivity-solutions/embedded-wireless/sx-sdmax6e
• Contact:
  • North America: [email protected]
  • Europe: [email protected]

Media Contact: Babar Hashim, [email protected] 

**About Silex Technology America**

Silex Technology America, based in San ta Ana , California, is the North American subsidiary of Silex Technology, a Japan-based technology company with deep R&D expertise in device networking and wireless communications. Silex provides embedded wireless modules, connectivity solutions, and integration services tailored for medical, industrial, and commercial applications. With design, engineering, and customer support teams across the globe, Silex helps device manufacturers accelerate product development, ensure regulatory compliance, and deliver a "When It Absolutely Must Connect" wireless experience.

SOURCE Silex Technology America, Inc.