Silex Technology Introduces its Latest 802.11ac SDIO Wi-Fi System-in-Package (SiP)
The Latest Wi-Fi Plus Bluetooth Low-Cost SiP Offers Better Performance and Smallest Footprint
Jun 20, 2017, 10:00 ET
SANTA ANA, Calif., June 20, 2017 /PRNewswire/ -- Silex Technology America, Inc., a global leader in wired and wireless networking solutions, today introduced its newest embedded Wi-Fi solution, the SX-SDPAC SDIO System-in-Package (SiP). This dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS "Smart Ready" SiP is based on the latest Qualcomm Atheros QCA9377 System-on-Chip (SoC). It offers cost effective, small form factor, and low power Wi-Fi+BT connectivity solution for our customers.
With the release of the SX-SDPAC SiP, Silex expands its 802.11ac SDIO portfolio by offering increased choice and flexibility to our customers to choose the right form factor Wi-Fi solution for their needs. This SiP is ideal for high-volume customers who want to achieve the lowest bill of material (BOM) cost and the smallest footprint. It can be mounted directly on the device PCBA, which minimizes cost by eliminating extra materials and labor associated with a radio module or card. It's small size, light weight and low power consumption makes it a viable option not only for handheld devices but also for a wide variety of applications such headsets, speakers, displays and many other Internet of Things (IoT) applications.
"Today a vast majority of Wi-Fi users consume multimedia content ranging from high-resolution images for patient care to instructional videos in the classroom, or wireless display technologies in corporate conference rooms," said Babar Hashim, Senior Product Manager at Silex. "SX-SDPAC's compact single-stream design lowers cost while delivering dramatic speed, power and performance improvements, empowering users to effortlessly stream HD-quality videos and watch rich multimedia anywhere they have Wi-Fi coverage."
SX-SDPAC Features
- Based on the QCA9377 Chipset
- 802.11 a/b/g/n/ac Wave 2 MU-MIMO
- SDIO 3.0 WLAN Host Interface
- Bluetooth 4.2 BR/EDR/LE Smart Ready
- Commercial Temperature, -20°C ~ +70°C
- Optional Antenna Diversity Support
- Internal 48 MHz XTAL
- Single-Ended Integrated RF Front-End Design
- Minimal Host Utilization (11ac speeds) via Offloading
- Smallest Size Package 6.9 mm x 6.9 mm x 1.082 mm
To expedite the product development process, Silex also provides additional world-class engineering services including custom driver development, certification services and hardware schematic design reviews.
Pricing and Availability
The product is in full production and is now available for purchase at our distribution partners. Contact Future Electronics to order now or start your evaluation here.
About Silex Technology America, Inc.
Silex Technology builds on more than 40 years of hardware and software connectivity know-how and IP, custom design development experience, and in-house manufacturing capabilities, bringing value to customers with a foundation of technical expertise. With relentless attention to quality, exclusive access to Qualcomm Atheros expertise, and strategic partnerships with leading semiconductor providers, Silex Technology is the global leader in reliable Wi-Fi connectivity for products ranging from a medical device to a document imaging product to a video or digital display. With Silex Technology, customers get a single vendor that provides hardware and software support from design through manufacturing for successful product after successful product. For more information, please visit www.silexamerica.com.
SOURCE Silex Technology America, Inc.